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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Power Electronics as an Enabler of the Current and Future Grid: Control Instead of Copper

Power electronics are becoming more pervasive in the power system. Solar, wind and battery energy storage systems regularly connect to the grid using power electronic interfaces. Loads are also increasingly power electronic-based. These changes, coupled with the change in the power system's operating characteristics as more and more renewable energy is integrated into the power system, offer a challenge to power electronic and power system engineers alike - how do we design and operate the power system moving forward?

direct connect↗
DOE OSTI2016

High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2016

Evaluation of Performance and Opportunities for Improvements in Automotive Power Electronics Systems: Preprint

Thermal management strategies for automotive power electronic systems have evolved over time to reduce system cost and to improve reliability and thermal performance. In this study, we characterized the power electronic thermal management systems of two electric-drive vehicles--the 2012 Nissan LEAF and 2014 Honda Accord Hybrid. Tests were conducted to measure the insulated-gate bipolar transistor-to-coolant thermal resistances for both steady-state and transient conditions at various coolant flow rates. Water-ethylene glycol at a temperature of 65 degrees C was used as the coolant for these experiments. Computational fluid dynamics and finite element analysis models of the vehicle's power electronics thermal management system were then created and validated using experimentally obtained results. Results indicate that the Accord module provides lower steady-state thermal resistance as compared with the LEAF module. However, the LEAF design may provide improved performance in transient conditions and may have cost benefits.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2021

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

In a power module the parasitic inductance limits the dynamic high-frequency performance, and the area of the cooling surfaces limits the power capability. This paper presents a new 3D power electronic design methodology based on the concept of mutual inductance cancellation and multi-sided heat transfer. New 3D prismatic packaging concepts are proposed for Wide Band Gap (WBG) power devices, where the devices can be mounted at acute angles to adjacent interconnects or other devices. Discussion is given on electrical and thermal path optimization in a 3D space. To validate the 3D prismatic packaging methodology, a 1200V/50A SiC half-bridge power module is fabricated and tested for electrical and thermal performance and results are compared with simulations. The power density calculated for the module is 12 kW/in3 (including heatsink) and shows a 31.3% inductance reduction compared to a 2D planar module. Finally, design guidance suggested for utilizing prismatic structures is provided, together with suggested future work in the area. This paper presents the first reported true 3D power module.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2017

Boosting Thermal Management & Reliability of Vehicle Power Electronics

Electric vehicles rely heavily on power electronics—including inverters, converters, and chargers—to control the flow of electricity between the battery, the motor, and other powertrain components. NREL is helping boost the performance of power electronics components and systems, while driving down size, weight, and cost. In electric vehicles, these components need to operate at higher temperatures, voltages, switching frequencies, and power conversion efficiencies. That’s where NREL’s thermal management and reliability research comes in.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2016

Photovoltaic Shading Testbed for Module-Level Power Electronics: 2016 Performance Data Update

The 2012 NREL report 'Photovoltaic Shading Testbed for Module-Level Power Electronics' provides a standard methodology for estimating the performance benefit of distributed power electronics under partial shading conditions. Since the release of the report, experiments have been conducted for a number of products and for different system configurations. Drawing from these experiences, updates to the test and analysis methods are recommended. Proposed changes in data processing have the benefit of reducing the sensitivity to measurement errors and weather variability, as well as bringing the updated performance score in line with measured and simulated values of the shade recovery benefit of distributed PV power electronics. Also, due to the emergence of new technologies including sub-module embedded power electronics, the shading method has been extended to include power electronics that operate at a finer granularity than the module level. An update to the method is proposed to account for these emerging technologies that respond to shading differently than module-level devices. The partial shading test remains a repeatable test procedure that attempts to simulate shading situations as would be experienced by typical residential or commercial rooftop photovoltaic (PV) systems. Performance data for multiple products tested using this method are discussed, based on equipment from Enphase, Solar Edge, Maxim Integrated and SMA. In general, the annual recovery of shading losses from the module-level electronics evaluated is 25-35%, with the major difference between different trials being related to the number of parallel strings in the test installation rather than differences between the equipment tested. Appendix D data has been added in this update.

14 SOLAR ENERGY↗
DOE OSTI2025

Impact assessment of geomagnetic induced current neutral blocking devices with power electronics sources on distance relay for 230 kV transmission lines

Electrical grids increased the integration of power electronics sources onto transmission lines. In addition, recent reports show a significant rise in geomagnetic storms occurring in 2024. These geomagnetic storms can affect transmission lines by inducing electrical currents within them, potentially causing power outages due to overloaded power transformers. Geomagnetic induced current neutral blocking devices (GIC-NBDs) are capacitors on the ground of wye power transformers, to avoid damage caused by geomagnetic storms. The integration of distance relays and transmission lines with power electronics sources and GIC-NBDs needs to be studied to observe if GIC-NBDs and power electronics sources could adversely affect operation of the electrical grid. In this analysis, the effect of 2 MW power electronics sources and GIC-NBDs on distance relays is assessed for different 230 kV transmission line lengths in radial and nonradial power systems. The simulations measured the apparent impedances, with different electrical faults. Results for a typical 2,650 μF GIC-NBD application were presented on impedance plots, and the distance relay model operations were assessed. In conclusion, the tests for radial and nonradial power systems showed the behavior of the distance elements and source impedance ratios, assessing the effect of power electronics sources and GIC-NBDs on 230 kV transmission lines.

Distance relays↗
DOE OSTI2022

Interdiffusion and Formation of Intermetallic Compounds in High-Temperature Power Electronics Substrate Joints Fabricated by Transient Liquid Phase Bonding

Power electronics packages typically comprise a dielectric substrate bonded to a metal layer and attached to heat sinks using a low-thermal-conductivity solder. These multiple layers increase the effective thermal resistance of the package and are responsible for package failures under cyclic thermal loads. Bonding the aluminum nitride dielectric layer (AlN) directly to a low coefficient of thermal expansion (CTE) aluminum silicon carbide (AlSiC) cold plate using copper-aluminum (Cu-Al) transient liquid phase (TLP) bonding has been shown to improve the mechanical reliability of the power electronic packages while making the package more compact by bringing the cooling solutions closer to the devices. This study aims to characterize the Cu-Al bonds formed during the TLP bonding of AlSiC with three different power electronics substrates: pure aluminum nitride (AlN), aluminum (DBA), and copper (DBC). The material compositions and microstructures of the bonds were analyzed using scanning electron microscopy (SEM), x-ray spectroscopy (EDS), confocal scanning acoustic microscopy (C-SAM), and x-ray diffraction (XRD). ..alpha..-Al solid compound was identified as the dominant phase in AlN-AlSiC and Al-AlSiC, with a notable presence of SiC particles. In contrast, three intermetallic phases - ..theta..-CuAl2, ..eta..-CuAl, and ..gamma..'- Cu9Al4 - were observed in the Cu-AlSiC bond. A computational solid-state diffusion model was developed to predict the intermetallic compounds (IMCs) formed during Cu-Al TLP bonding in each system, which supported the observation that an initial Cu volume fraction of 20 % in the material layers produced a final bond composition of >95 % Al with minimal IMC growth. However, increased Cu concentrations produced higher concentration gradients, leading to increased growth of IMCs, Kirkendall voids, and interstitial cracks.

DIRECT ENERGY CONVERSION↗
DOE OSTI2025

Power Electronics and Electric Machines for Advanced Aircraft

Power electronics and electric machines are critical components of efficient, high-performance aircraft - from fixed-wing turbine to electric vertical takeoff and landing aircraft and beyond. Improvements to these components create enormous energy efficiencies, enable cost savings, and ensure fail-safe operations. National Renewable Energy Laboratory researchers are developing innovative power electronics, electric motors, integrated electric traction drives, and thermal management systems to build highly efficient, lightweight, ultrareliable powertrains for aircraft.

42 ENGINEERING↗
DOE OSTI2015

Final Technical Report for Photovoltaic Power Electronics Research Initiative (PERI)

The Power Electronics team at the University of Central Florida (UCF) has developed a novel three-phase micro-inverter for photovoltaic (PV) distributed applications. Based on a new advanced topology and control methodology, the developed inverter is small in size, and achieved DoE targeted power density, cost and efficiency specifications. Today’s inverters are widely used in PV based energy harvesting systems, but are based on single-phase design with limited application to large installations. These micro-inverters have been shown to have advantageous over their string inverter counterparts in both grid-tied PV energy harvesting and standalone micro-grid systems with energy storage. Some of these are simplified installation, no high voltage DC wiring, no single point of failure and improved energy harvesting. Several patents have been issued and this new solar conversion technology has been licensed to the private sector.

14 SOLAR ENERGY↗
DOE OSTI2018

Enabling Advanced Power Electronics Technologies for the Next Generation Electric Utility Grid (Workshop Summary Report)

The role of power electronics in the utility grid is continually expanding. As converter design processes mature and new advanced materials become available, the pace of industry adoption is poised to accelerate. Looking forward, we can envision a future in which power electronics are as integral to grid functionality as the transformer is today. The Enabling Advanced Power Electronics Technologies for the Next Generation Electric Utility Grid Workshop was organized by Sandia National Laboratories and held in Albuquerque, New Mexico, July 17 - 18, 2018 . The workshop helped attendees to gain a broader understanding of power electronics R&D needs—from materials to systems—for the next generation electric utility grid. This report summarizes discussions and presentations from the workshop and identifies opportunities for future efforts.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2015

Advanced Power Electronics and Electric Motors Annual Report -- 2013

This report describes the research into advanced liquid cooling, integrated power module cooling, high temperature air cooled power electronics, two-phase cooling for power electronics, and electric motor thermal management by NREL's Power Electronics group in FY13.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2026

NREL Overview of Grid-Tied Power Electronics

This presentation focuses on the power electronics related research efforts carried out by researchers at the Power Systems Engineering Center at NREL.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2023

Power Electronics Cooling Technology Research at NREL

This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.

DIRECT ENERGY CONVERSION↗
DOE OSTI2020

Automotive Power Electronics and Electric Machine Thermal Management

The transition to modular and scalable electrified vehicle transportation requires technologies to improve power density within cost and reliability constraints to maximize vehicle platform flexibility. Key research challenges arise due to the limited packaging space, coolant distribution, electrical connections, and ambient temperatures. Challenges include thermal management for compact power-dense electric machines and the associated power electronics for power management within the vehicle. High-temperature silicon and wide-bandgap (WBG) based power electronics systems are of interest to enable compact and efficient electric drive systems. The higher temperatures present packaging challenges for thermal management and reliability. In this work, we provide an overview of research for thermal characteristics of materials, packages and thermal management approaches for enabling compact power dense automotive electric drive systems.

DIRECT ENERGY CONVERSION↗