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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1999

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Hunter, Don J.↗
NASA NTRS2014

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Ghaffarian, Reza↗
NASA NTRS2014

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

MLF↗
NASA NTRS1997

A Review of Chip Scale Package Assembled Reliability

NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.

Chip Scale Packaging Microspacecraft↗
NASA NTRS2000

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗
NASA NTRS2000

Systems Engineering Programmatic Estimation Using Technology Variance

Unique and innovative system programmatic estimation is conducted using the variance of the packaged technologies. Covariance analysis is performed on the subsystems and components comprising the system of interest. Technological "return" and "variation" parameters are estimated. These parameters are combined with the model error to arrive at a measure of system development stability. The resulting estimates provide valuable information concerning the potential cost growth of the system under development.

Mog, Robert A.↗
NASA NTRS2000

Systems Engineering Programmatic Estimation Using Technology Variance

Unique and innovative system programmatic estimation is conducted using the variance of the packaged technologies. Covariance analysis is performed oil the subsystems and components comprising the system of interest. Technological "returns" and "variation" parameters, are estimated. These parameters are combined with the model error to arrive at a measure of system development stability. The resulting estimates provide valuable information concerning the potential cost growth of the system under development.

Mog, Robert A.↗
NASA NTRS2014

LISA Pathfinder and eLISA news

Two important gatherings of the space-based gravitational-wave detector community were held in Zurich, Switzerland this past March. The first was a meeting of the Science Working Team for LISA Pathfinder (LPF), a dedicated technology demonstrator mission for a future LISA-like gravitational wave observatory. LPF is entering an extremely exciting phase with launch less than 15 months away. All flight components for both the European science payload, known as the LISA Technology Package (LTP), and the NASA science payload, known as the Space Technology 7 Disturbance Reduction System (ST7-DRS), have been delivered and are undergoing integration. The final flight component for the spacecraft bus, a cold-gas thruster based on the successful GAIA design, will be delivered later this year. Current focus is on completing integration of the science payload (see Figures 1 and 2) and preparation for operations and data analysis. After a launch in Summer 2015, LPF will take approximately 90 days to reach its operational orbit around the Earth-Sun Lagrange point (L1), where it will begin science operations. After 90 days of LTP operations followed by 90 days of DRS operations, LPF will have completed its prime mission of paving the way for a space-based observatory of gravitational waves in the milliHertz band. Immediately following the meeting of the LPF team, the eLISA consortium held its third progress meeting. The consortium (www.elisascience.org) is the organizing body of the European space-based gravitational-wave community, and it was responsible for the "The Gravitational Universe" whitepaper that resulted in the November 2013 election of a gravitational-wave science theme for ESA's Cosmic Visions L3 opportunity. In preparation for an L3 mission concept call, which is expected later this decade, and for launch in the mid 2030s, the eLISA consortium members are coordinating technology development and mission study activities which will build on the LPF results. The final mission concept is expected to include some international (non-European) contributions, and NASA has expressed an interest in participating in this ground-breaking mission. The US research community supports such a collaboration, or any other mission scenario that achieves the high-priority science of a space-based gravitational-wave observatory at the earliest possible date.

pathfinder↗
NASA NTRS2017

Colloid Microthruster Flight Performance Results from Space Technology 7 Disturbance Reduction System

Space Technology 7 Disturbance Reduction System (ST7-DRS) is a NASA technology demonstration payload as part of the ESA LISA Pathfinder (LPF) mission, which launched on December 3, 2015. The ST7-DRS payload includes colloid microthrusters as part of a drag-free dynamic control system (DCS) hosted on an integrated avionics unit (IAU) with spacecraft attitude and test mass position provided by the LPF spacecraft computer and the highly sensitive gravitational reference sensor (GRS) as part of the LISA Technology Package (LTP). The objective of the DRS was to validate two technologies: colloid micro-Newton thrusters (CMNT) to provide low-noise control capability of the spacecraft, and drag-free flight control. The CMNT were developed by Busek Co., Inc., in a partnership with NASA Jet Propulsion Laboratory (JPL), and the DCS algorithms and flight software were developed at NASA Goddard Space Flight Center (GSFC). ST7-DRS demonstrated drag-free operation with 10nmHz level precision spacecraft position control along the primary axis of the LTP using eight CMNTs that provided 5-30 N each with 0.1 N precision. The DCS and CMNTs performed as required and as expected from ground test results, meeting all Level 1 requirements based on on-orbit data and analysis. DRS microthrusters operated for 2400 hours in flight during commissioning activities, a 90-day experiment and the extended mission. This mission represents the first validated demonstration of electrospray thrusters in space, providing precision spacecraft control and drag-free operation in a flight environment with applications to future gravitational wave observatories like LISA.

Ziemer, John↗
NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗
NASA NTRS1985

Packaging for Food Service

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Stilwell, E. J.↗
NASA NTRS1990

Reliability and quality EEE parts issues

NASA policy and procedures are established which govern the selection, testing, and application of electrical, electronic, and electromechanical (EEE) parts. Recent advances in the state-of-the-art of electronic parts and associated technologies can significantly impact the electronic designs and reliability of NASA space transportation avionics. Significant issues that result from these advances are examined, including: recent advances in microelectronics technology (as applied to or considered for use in NASA projects); electron packaging technology advances (concurrent with, and as a result of, the development of the advanced microelectronic devices); availability of parts used in space avionics; and standardization and integration of parts activities between projects, centers, and contractors.

Barney, Dan↗
NASA NTRS2011

Comparison of Traditional and Innovative Techniques to Solve Technical Challenges

This slide presentation reviews the use of traditional and innovative techniques to solve technical challenges in food storage technology. The planning for a mission to Mars is underway, and the food storage technology improvements requires that improvements be made. This new technology is required, because current food storage technology is inadequate,refrigerators or freezers are not available for food preservation, and that a shelf life of 5 years is expected. A 10 year effort to improve food packaging technology has not enhanced significantly food packaging capabilities. Two innovation techniques were attempted InnoCentive and Yet2.com and have provided good results, and are still under due diligence for solver verification.

Perchonok, Michele↗
NASA NTRS2011

BOK-Underfill Optimization for FPGA Package/Assembly

Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages.

mechanical fatigue↗
NASA NTRS2008

Re-active Passive (RAP) Devices for Control of Noise Transmission through a Panel

Re-Active Passive (RAP) devices have been developed to control low frequency (<1000 Hz) noise transmission through a panel. These devices use a combination of active, re-active, and passive technologies packaged into a single unit to control a broad frequency range utilizing the strength of each technology over its best suited frequency range. The RAP device uses passive constrained layer damping to cover the relatively high frequency range (>200 Hz), reactive distributed vibration absorber) to cover the medium frequency range (75 to 250 Hz), and active control for controlling low frequencies (<200 Hz). The device was applied to control noise transmission through a panel mounted in a transmission loss test facility. Experimental results are presented for the bare panel, and combinations of passive treatment, reactive treatment, and active control. Results indicate that three RAP devices were able to increase the overall broadband (15-1000 Hz) transmission loss by 9.4 dB. These three devices added a total of 285 grams to the panel mass of 6.0 kg, or approximately 5%, not including control electronics.

Carneal, James P.↗