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At least 73 records · Page 4

Three Dimensionally Interlinked, Dense, Solid Form of Single-Walled CNT Ropes

A 3D networked, dense form of single-walled carbon nanotubes (SWNT) has been made through isotropic shrinking of a gel-like SWNT-water paste by very slow evaporation. Approximately 35 g of Raw HiPco nanotubes were cleaned by the method of soft baking (250 C for 15 hours in air saturated with water vapor) in a glass beaker followed by leaching with concentrated hydrochloric acid. Typically, one liter of concentrated hydrochloric acid was added to the soft-baked voluminous mass in the same large beaker, and allowed to digest at room temperature with stirring overnight. The acid-digested SWNT slurry was filtered through a large porcelain Buchner funnel under atmospheric pressure. The slurry was continuously flushed, while still in the funnel, with a very slow but steady stream of deionized water employing a peristaltic pump. This process, referred to as gwashing, h continued until the filtrate water dripping from the Buchner funnel was clear, colorless, and neutral to a pH paper. This took about 15 liters of water to flow through the slurry over a day. At this point, the water pump was stopped and the SWNT-water slurry was allowed to drain the excess water for about 10 hours. The resulting thick paste of SWNT-neutral water was transferred to a beaker. The beaker was covered with aluminum foil with few holes and allowed to dry very slowly in a hood at room temperature. In about eight weeks, the sample gradually dried isotropically to a cylindrical dense mass referred to as a carbon nanotube block (CNB). There was no carbonaceous matter sticking to any of the glass surface where the SWNT-water paste made contact. The approximate dimensions of the cylindrical SWNT block that weighed 28 g were 1.5 in. (.3.8 cm) in diameter and 1.25 in. (.3.2 cm) in height. The bottom portion of the cylinder that was in contact with the beaker surface was slightly wider, indicating some resistance to shrinking. The cylindrical mass also consisted of several pores. The cylindrical mass was very tough and could not be broken with a small hammer using considerable force. The mass of the solid could be polished over a fine grain emery paper or even a smooth, stainless steel surface indicative of alignment at finer levels.

Smalley, Richard E.↗

Integration of Product, Package, Process, and Environment: A Food System Optimization

The food systems slated for future NASA missions must meet crew nutritional needs, be acceptable for consumption, and use resources efficiently. Although the current food system of prepackaged, moderately stabilized food items works well for International Space Station (ISS) missions, many of the current space menu items do not maintain acceptability and/or nutritive value beyond 2 years. Longer space missions require that the food system can sustain the crew for 3 to 5 years without replenishment. The task "Integration of Product, Package, Process, and Environment: A Food System Optimization" has the objective of optimizing food-product shelf life for the space-food system through product recipe adjustments, new packaging and processing technologies, and modified storage conditions. Two emergent food processing technologies were examined to identify a pathway to stable, wet-pack foods without the detrimental color and texture effects. Both microwave-assisted thermal sterilization (MATS) and pressure-assisted thermal stabilization (PATS) were evaluated against traditional retort processing to determine if lower heat inputs during processing would produce a product with higher micronutrient quality and longer shelf life. While MATS products did have brighter color and better texture initially, the advantages were not sustained. The non-metallized packaging film used in the process likely provided inadequate oxygen barrier. No difference in vitamin stability was evident between MATS and retort processed foods. Similarly, fruit products produced using PATS showed improved color and texture through 3 years of storage compared to retort fruit, but the vitamin stability was not improved. The final processing study involved freeze drying. Five processing factors were tested in factorial design to assess potential impact of each to the quality of freeze-dried food, including the integrity of the microstructure. The initial freezing rate and primary freeze drying temperature and pressure were linked to final product quality in freeze-dried corn, indicating processing modifications that could lead to improved product shelf life. Storage temperatures and packaging systems were also assessed for the impact to food quality. Reduced temperature storage had inconclusive impact to the progression of rancidity in butter cookies. Frozen storage was detrimental to fruit and vegetable textural attributes but refrigerated storage helped to sustain color and organoleptic ratings for plant-based foods. With regard to packaging systems, the metallized film overwrap significantly decreased the progression of the rancidity of butter cookies as compared to the highest barrier non-metallized film. The inclusion of oxygen scavengers resulted in noticeable moisture gains in butter cookies over time, independent of packaging film systems. Neither emergent processing technology nor the freeze dry optimization resulted in compelling quality differences from current space food provisions such that a five-year shelf life is likely with these processing changes alone. Using a combination of refrigeration and PATS processing is expected to result in organoleptically-acceptable fruit quality for most fruits through five years. The vitamin degradation will be aided somewhat by the cold temperatures but, given the labile nature of vitamin C, a more stable fortification method, such as encapsulation, should also be investigated to ensure vitamin delivery throughout the product life. Similarly, significant improvement to the packaging film used in the MATS processing, optimization of formulation for dielectric properties, vitamin fortification, and reduced temperature storage should be investigated as a hurdle approach to reach a five year shelf life in wet-pack entrees and soups. Baked goods and other environmentally-sensitive spaceflight foods will require an almost impenetrable barrier to protect the foods from oxygen and moisture ingress but scavengers and reduced storage temperature did not improve baked good shelf life and are not recommended at this time for these foods.

Cooper, Maya R.↗

Modeling Contamination Migration on the Chandra X-Ray Observatory - IV

During its first 18 years of operation, the cold (about -60degC) optical blocking filters of the Advanced CCD Imaging Spectrometer (ACIS), aboard the Chandra X-ray Observatory, has accumulated a growing layer of molecular contamination, which attenuates low-energy x rays. Over the past several years, the accumulation rate, spatial distribution, and composition have changed. This evolution has motivated further analysis of contamination migration within and near the ACIS cavity, in part to evaluate potential bake-out scenarios intended to reduce the level of contamination. This paper, the fourth on this topic, reports the results of recent contamination-migration simulations and their relevance to a decision whether to bake-out the ACIS instrument.

X-ray astronomy CCDs↗

Outgassing Characterization of Rod Heaters Used for GOES-R Thermal Vacuum Testing

This talk summarizes experimental effort to characterize the outgassing rate of rod heaters (Watrods) used for GOES-R thermal vacuum testing. QCM data obtained with unbaked rods indicated that the outgassing exceeded the allowable budget. We then pre-baked the watrods for 16 hours at ambient pressure and determined that pre-baking reduced the amount of outgassed material by a factor of 4.

watrods↗

An Examination of Heater Bar Outgassing

Presentation for AIAA Space Simulation Working Group that shows the concern about outgassing from heater bars and how the outgassing was mitigated using an outgassing characterization test, followed by a high-vacuum bake out. Some test results are shown from the bake-out and the subsequent Integrated Facility Systems Test.

Reed, Erin↗

Effect of Soldering on Polymer and MnO2 Tantalum Capacitors

Soldering might have a strong effect on performance and reliability of most surface mount technology components, including tantalum capacitors. High quality tantalum capacitors are likely the only type of components where soldering simulation is the first step during screening. Nevertheless, post-soldering failures of tantalum capacitors happen and require additional analysis. Popcorning is a well-known effect in plastic encapsulated microcircuits (PEM) and it occurs also in chip tantalum capacitors. The sensitivity of parts to the presence of moisture during soldering is characterized by the moisture sensitivity level (MSL); however, contrary to PEMs, there is no standard procedure for establishing MSL for tantalum capacitors. The effect of absorbed moisture on soldering related degradation and failures in tantalum capacitors have not been studied properly yet, and there is no sufficient information regarding the difference in the sensitivity to soldering between polymer and MnO2 tantalum capacitors. In this work, 16 types of polymer and 9 types of MnO2 cathodes tantalum capacitors with different moisture content have been tested before and after reflow soldering. The level of moisture release after soldering has been estimated and thermo-mechanical analysis used to assess deformation of capacitors during soldering simulations. Results show that moisture uptake in similar parts is approximately two times greater in polymer than in MnO2 capacitors. Cracking of the case and degradation of parameters can occur in both types of parts, but MnO2 capacitors are much more likely to fail catastrophically with a short circuit and possible ignition during the first power-on cycle. This type of failure in MnO2 capacitors is lot-related, can occur even at derated voltages and relatively low levels of moisture sorption corresponding to room conditions. Baking before soldering is an effective measure to prevent failures even in lots susceptible to popcorning damage. Recommendations for baking and testing to establish MSL are suggested.

Alexander Teverovsky↗

Effect of Preconditioning on Post-Soldering Failures in Tantalum Capacitors

Soldering have a strong effect on performance and reliability of most surface mount technology components, including tantalum capacitors. High quality tantalum capacitors are likely the only type of components where soldering simulation is the first step during screening. Nevertheless, post-soldering failures of tantalum capacitors do happen and require additional analysis. Popcorning is a well-known effect in plastic encapsulated microcircuits (PEM) and it occurs also in chip tantalum capacitors. The sensitivity of parts to the presence of moisture during soldering is characterized by the moisture sensitivity level (MSL); however, contrary to PEMs, there is no standard procedure for establishing MSL for tantalum capacitors, and standard J-STD-020 is applicable partially only. In this work, the effect of absorbed moisture on soldering related degradation and failures in tantalum capacitors have been studied using 22 types of polymer and 11 types of MnO2 cathodes tantalum capacitors including single and multianode parts. The amount of moisture released during soldering has been estimated by measurements of mass and capacitance variations. Results show that moisture uptake in similar parts is approximately two times greater in polymer than in MnO2 capacitors. Cracking of the case and degradation of parameters can occur in both types of parts, but MnO2 capacitors are much more susceptible to catastrophic short circuit failures and their ignition is possible during the first power-on cycle. This type of failure in MnO2 capacitors is lot-related, can occur even at derated voltages and relatively low levels of moisture sorption corresponding to room conditions. Baking before soldering is an effective measure to prevent failures even in lots susceptible to popcorning damage. Recommendations for testing to establish MSL and for baking to reduce the probability of failures are suggested.

tantalum polymer capacitors↗

Effect of Vacuum on Force Response of an Ultrasonic Penetrator

Introduction: The Apollo astronauts encountered higher than expected resistances when interacting with the lunar soil via the Apollo Lunar Surface Drill (ALSD) and the trenching tool. Reducing the force required to move tools or other mechanical components through regolith will impact many steps of the resource extraction process. Force reduction has been achieved in soil materials by imparting vibration to tooling interfaces such as a vibratory farming cultivator, a percussive scoop, and ultrasonically resonant penetrators. Vibration-assisted tools in granular media reduce interaction forces by fluidizing a volume around the tool, allowing the tool to progress through a dynamic (fluid) medium instead of a static (solid) medium. This work seeks to quantify ultrasonic vibration’s effect on the force response of a penetrator in lunar soil simulant in vacuum sufficient to be within the molecular flow regime of any disturbed gases. Methods: A custom vacuum chamber setup, CUBEvac, was designed and built to facilitate penetration testing in a high vacuum environment, for comparison to penetration behavior in ambient terrestrial environment. A two-stage pumping system (Agilent Triscroll 600 roughing pump, Agilent VHS-6 oil diffusion pump) reached chamber pressures of about 5x10-6 Torr with regolith simulant in place. Figure 1 is a schematic of the heart of the assembly (note the penetration drive mechanisms above the chamber feedthrough and the regolith simulant sample in the bottom are not shown). The penetration actuation stack was comprised of a stepper motor driving a lead screw to move the ultra-sonic probe vertically inside the chamber. Motion was coordinated with an Arduino Uno. GRC-3 lunar simulant was used for this set of experiments. Samples were prepared in a four-liter stain-less steel, cylindrical pot with an internal diameter of approximately 15.56 cm (6.125 in) and a depth of 19.37 cm (7 5/8 in) for testing. The soil was baked out prior to compaction preparation as a measure to reduce soil moisture which interfered with pump down capacity. The soil was not baked again if it was removed from the vacuum chamber, prepped, and immediately returned to the vacuum chamber for pump down. The soil was compacted using a 60 Hz vibration table with a surcharge of 34 kg place on top of the soil in the container. Prepared soil samples weighed approximately 6.5 kg (bulk density 1.895-1.934 g/cm3). Two probe end effectors were tested: A cone penetrometer (static only) with a nominal diameter of 12.7 mm (0.5 in) and a nominal height of 28.6 mm (1.125 in); and a vibrating cylindrical probe measuring 12.7 mm in diameter and 50.8 mm in effective length from the tip (Figure 2). The cylindrical probe vibrated resonantly at 20 kHz with an amplitude 23 μm. The cone penetration tests were conducted to assess potential soil behavior differences in vacuum. The cylinder probe tests were conducted as the primary subject of this investigation to assess force response in vacuum. For each test, a regolith simulant sample was load-ed and compacted in the chamber, which was then evacuated for roughly 18 hours to reach the lowest possible pressure (approximately 5x10-6 Torr for most tests). The probe was then moved to about 10 mm above the soil surface before being pushed to a depth of 50 mm for the cylinder probe tests and to a depth of 100 mm for the cone penetrometer tests, both at a speed of 2 mm/s. The simulant samples were prepared the same for all tests. Ideally, they would respond consistently to probe penetration under ambient and vacuum conditions. This was evaluated by measuring the resistance of representative prepared simulant beds with a standard cone penetrometer in both environments. Results and Discussion: The resistance of the simulant samples in the vacuum tests was consistently lower than in the ambient tests as determined by the cone penetration tests. Thus, the ambient and vacuum results cannot be compared directly; work is underway to de-confound and better correlate the data. Still, figures 3-6 show that probe penetration forces are lower overall in the vacuum environment. In both environments, resonant vibration of the probe provides two useful effects: It reduces the probe penetration force and smooths the force-depth curve, significantly reducing local maxima. These effects have implications for various potential applications, such as astronaut hand-tools, where benefits (reducing astronaut effort) outweigh the cost of the additional energy re-quired to generate vibration. These results demonstrate that resonantly vibrating tools can meaningfully reduce the penetration force required for excavation, probing, and drilling tools in simulated lunar regolith deposits under vacuum levels approaching those that will be experience on the Moon’s surface. Lunar-gravity, ambient environment tests are scheduled soon. The effects of realistic temperatures and temperature gradients and deeper vacuum remain to be tested.

E Rezich↗

Effect of Negative Ions on the Conductivity of the Titan Atmosphere

In an earlier paper, Borucki et al (1987) calculated the electrical conductivity and electrical charge on aerosols in Titan's atmosphere due to the ionization by galactic cosmic rays and electron precipitation from Saturn's magnetosphere. The lower atmosphere was predicted to be substantially more conducting than the atmospheres of Earth and Venus because of the high concentration of free electrons. The prediction of a high conductivity is based on the lack of electrophillic species which form negative ions with low mobility and which reduce the number of free electrons. At that time, no molecular species capable of forming negative ions in concentrations sufficient to perturb the atmospheric conductivity were identified. Recently, E. Bakes and her colleagues have been investigating the formation of nitrogenous macromolecules using quantum mechanical methods. Their calculations indicate that the molecules will be highly electrophillic and are likely to be present in the atmosphere at mixing ratios of order 10(exp -7). This mixing ratio is sufficiently large that a substantial reduction in the conductivity is expected at altitudes below 100 km. Revision of the atmospheric model to accommodate the presence of negative ions and to increase the fidelity of the modeling will be described.

Borucki, W. J.↗

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗

Molecular Layer Deposited Aluminum‐Based Hybrid Resist for High‐Resolution Nanolithography and Direct Ultra‐High Aspect Ratio Pattern Transfer

Inorganic-containing hybrid photoresists are critical for next-generation extreme ultraviolet (EUV) lithography and angstrom-era semiconductor miniaturization. However, associated conventional solution processing struggles to achieve ultrathin, uniform films with high conformality and compositional control, limiting overall patterning performance. Here, this study reports the systematic lithographic patterning characterization of an Al-based hybrid resist synthesized via vapor-phase molecular layer deposition (MLD), using the trimethylaluminum (TMA) metal precursor and the hydroquinone (HQ) aromatic organic linker. The resist supports both sub-20 nm high-resolution nanolithography and virtually infinite silicon plasma etch selectivity. Lithographic performance studied using electron beam lithography (EBL) as a proxy for EUV shows that, under an optimized process adopting post-exposure bake, the resist achieves the best resolution of 15.4 nm linewidth under stringent 1:1 line-space high-density patterning—limited only by the minimum beam size of the EBL system. The resist also shows wide dose latitude and balanced performance in resolution, roughness, and sensitivity. The infinite silicon etch selectivity, stemming from spontaneous aluminum oxyfluoride passivation layer formation, enables fabrication of micrometer-tall, 40 nm-wide silicon nanofin structures using only a ≈30 nm-thick resist layer, without no hard mask. These results highlight the potential of MLD-based hybrid resists for developing next-generation resist materials for micro/nanoelectronics manufacturing.

36 MATERIALS SCIENCE↗

Improved liquid lithium surfaces in the Lithium Tokamak Experiment-β

Advances in vacuum, surface, and lithium conditioning techniques throughout five years of continuous operations in LTX-β have produced mirror-like liquid lithium surfaces and demonstrated the feasibility of high-performance tokamak discharges fully surrounded by liquid metal without significant operational problems. Improvements in conditioning techniques and procedures, including many weeks of baking and accumulation of 70 g of Li, led to reduced residual gasses and clean Li surfaces - all while still maintaining enough operational flexibility for multiple in-vacuum diagnostic upgrades and calibrations. Coatings had a visibly clean appearance, with reflective liquid metal demonstrating good wetting and surface adhesion with films that were now macroscopically thick. Solidified Li showed large crystal grains, while surface science measurements observed reduced impurities in the lithium. Steadily improved plasma performance was achieved with liquid lithium, with discharges able to match solid Li in terms of evolution of I p and n e , including rapid density pumping indicating low recycling. There were indications of moderately increased Li impurity influx, though few significant disturbances by the large liquid surfaces on tokamak operations over hundreds of discharges. Liquid metal plasma facing components are a potential solution to the extreme heat and particle fluxes that could cause unacceptable damage to solid materials, while liquid lithium also has the potential for greatly increased confinement in the low-recycling regime. While many liquid metal approaches are possible, and numerous experiments have been conducted in test stands and small modules in fusion devices, LTX-β is the only tokamak operated while fully surrounded by liquid metal.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Bismuth-oxo Clusters for Next Generation Extreme Ultraviolet Light Photolithography

Photolithography is the primary technique used for the patterning of semiconducting materials for chip manufacturing; however, as requisite pattern dimensions and feature sizes continue to decrease, state-of-the-art lithographic methods now require the use of 13.5 nm extreme ultraviolet (EUV) light. The shift toward these higher energy wavelengths of light has resulted in a need for new single component materials, with high EUV absorption cross sections and high etch resistance. Herein, we report the exploration of Bi 9 O 7 (hfac) 13 as the first bismuth oxo cluster based EUV photoresist. It was determined this material has an exceptional EUV linear absorption coefficient (24 μm –1 ), nearly an order of magnitude larger than commercially available chemically amplified resists (CARs) (∼5 μm –1 ). Additionally, the resist was determined to be highly sensitive to EUV exposure and displayed a dose-to-gel of 10 mJ/cm 2 , undergoing ligand decomposition during exposure and cross-linking during the postexposure bake, which was supported by FTIR and residual gas analysis. In conclusion, this class of bismuth-oxo cluster resists can lead to the development of more efficient, effective and safe EUV resist materials required for next-generation photolithography.

MacKenzie, Harvey K. [Univ. of Victoria, BC (Canad↗

Integrated Strategies for Overcoming Resolution Limits in Electron Beam Lithography of Chemically Amplified Resists

Electron beam lithography (EBL) of chemically amplified resists (CARs) faces fundamental challenges, including stochastic electron scattering and acid diffusion, that limit resolution and reproducibility. Using SU-8 as a model CAR, this study systematically investigated complementary strategies to address these challenges, combining multipass exposure, proximity effect correction (PEC) with midrange correction factors, base quencher incorporation, and post-exposure bake (PEB) suppression. Monte Carlo simulations and calibrated PEC modeling revealed that extending the point spread function to include a midrange scattering component significantly improved critical dimension (CD) control across varying pattern densities, correcting deviations that conventional two-term PEC failed to capture. Multipass exposure, particularly 4-pass writing with a 25% offset, redistributed the dose to average stochastic beam and scattering fluctuations, reducing line-width roughness by more than 50% and yielding more uniform nanoscale features. Photoacid confinement was investigated by adding urea as a base quencher, which successfully reduced acid diffusion but introduced substantial sensitivity penalties without improving ultimate resolution or Z-factor performance, underscoring the trade-offs of chemical versus physical confinement. Suppressing PEB most directly minimized acid diffusion, resulting in improved Z-factors and reproducible 30 nm half-pitch dense line/space patterns. Overall, these results demonstrated that PEC with midrange correction, multipass strategies, quencher additives, and PEB-free processing addresses different aspects of the EBL process window and that their integration provides a comprehensive framework for managing stochastic scattering, diffusion, and chemical amplification effects. This framework advances dense nanoscale patterning in CARs and establishes guiding principles for optimizing resist design and process strategies in high-resolution EBL and potentially other advanced lithographies, such as extreme ultraviolet (EUV) lithography.

36 MATERIALS SCIENCE↗

Design, Manufacturing, and Installation of DIII-D Lower Hybrid Current Drive Outer Wall Waveguides and Expandable Vacuum Interface

High field side lower hybrid current drive (HFS LHCD) is promising method for efficient, off axis current drive. To operate this system, development of an expandable combination radio frequency (RF) and vacuum interface was necessary to allow the long (~2 m) waveguides to thermally expand with respect to the DIII-D 0 degree R-1 port extension without damage to the waveguide or excessive force on the vacuum seals which was previously observed when baking the waveguides during operations that were installed in 2024. Design of a custom bellows assembly with RF feedthrough that allows >20mm of waveguide thermal expansion is presented. Fabrication of this bellows assembly required simultaneously vacuum brazing multiple 304 stainless steel flanges to an oxygen free high conductivity copper waveguide section which required significant manufacturing development.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Development of advanced vacuum technologies for extending plasma pulse duration on EAST

Advanced vacuum technologies, including pumping, fueling and wall conditioning, have been successfully developed or upgraded to efficiently control the fuel and impurity particles to extend the plasma pulse duration in the experimental advanced superconducting tokamak (EAST). To improve the particle exhaust rate cryopumps with a 60% increase in pumping speed and ∼2 times increase in saturation capacity have been developed, and molecular pumps with a ∼30% increase in pumping speed have been upgraded. In order to monitor the molecular pump status while avoiding bearing faults and overload accidents, a fault detection system has been built which can offer an early warning to avoid more losses within the fusion device. A series of fueling technologies have been developed including gas injection system, supersonic molecular beam injector, pellet injector (PI), massive gas injector and shattered pellet injector, installed at the midplane and divertor positions at different ports to improve fueling uniformity and efficiency. Meanwhile, routine wall conditioning such as electric and hot N 2 baking, ion cyclotron wall conditioning and glow discharge cleaning have been successfully developed to remove the impurity particles from the inner component and materials. The low Z material wall coating and real-time powder injection during plasma discharge are also designed and applied to further improve particle control capability. Finally, by using these advanced vacuum related technologies, good vacuum (<2 × 10 −6 Pa) and wall conditions are realized, and the fuel and impurity particles can be effectively and stably controlled, which promotes the achievement of the record plasma of ∼1056 s pulse duration with the line-averaged electron density of 1.8 × 10 19 m −3 on EAST. They provide a very important reference for vacuum system design and operation for future fusion devices.

EAST↗

Electropolishing-induced topographic defects in niobium: insights and implications for superconducting radio frequency applications

Electropolishing (EP) is the premier surface preparation method for high-Q, high-gradient superconducting RF cavities made of Nb. This leaves behind an apparently smooth surface, yet the achievable peak magnetic fields fall well below the superheating field of Nb, in most cases. Here, in this work, the ultimate surface finish of EP was investigated by studying its effect on highly polished Nb samples. EP introduces high slope angle sloped-steps at grain boundaries. The magnetic field enhancement and superheating field suppression factors associated with such a geometry are calculated in the London theory. Despite the by-eye smoothness of electropolished Nb, such defects compromise the stability of the low-loss Meissner state, likely limiting the achievable peak accelerating fields in superconducting RF cavities. Finally, the impact of surface roughness on impurity diffusion is investigated which can link surface roughness to the effectiveness of heat treatments like low-temperature baking or nitrogen infusion in the vortex nucleation or hydride hypotheses. Surface roughness tends to decrease the effective dose of impurities as a result of the expansion of impurities into regions with greater internal angle. The effective dose of impurities can be protected by minimizing slope angles and step heights, ensuring uniformity.

Hryhorenko, Oleksandr [Thomas Jefferson National A↗

Improved high-gradient performance for medium-velocity superconducting half-wave resonators: Surface preparation and trapped flux mitigation

A development effort to improve the performance of superconducting radio-frequency half-wave resonators (SRF HWRs) is underway at the Facility for Rare Isotope Beams (FRIB), where 220 such resonators are in operation. Our goal was to achieve an intrinsic quality factor (𝑄 0 ) of ≥ 2 × 10 10 at an accelerating gradient (𝐸 acc ) of 12 MV/m. FRIB production resonators were prepared with buffered chemical polishing. First trials of electropolishing (EP) and post-EP low-temperature baking of FRIB HWRs allowed us to reach higher gradient (15 MV/m, limited by quench) with a higher quality factor at high gradient, but 𝑄 0 was still below our goal. Trapped magnetic flux during the Dewar test was found to be a source of 𝑄 0 reduction. Three strategies were used to reduce the trapped flux: (i) adding a local magnetic shield (LMGS) to supplement the “global” magnetic shield around the Dewar for reduction of the ambient magnetic field; (ii) performing a “uniform cooldown” (UC) to reduce the thermoelectric currents; and (iii) using a compensation coil to further reduce the ambient field with active field cancellation (AFC). The LMGS improved the 𝑄 0 , but not enough to reach our goal. With UC and AFC, we exceeded our goal, reaching 𝑄 0 = 2.8 ×10 10 at 𝐸 acc = 12 MV/m.

Cryogenics & vacuum technology↗