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Recommendations on the Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions - Phase II

This assessment had two Phases. Phase I captured NASA Centers’ current practices for commercial-off-the-shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) parts 1 used in spaceflight systems and ground support equipment (available at https://ntrs.nasa.gov/citations/20205011579) [ref. 1]. The Phase II report provides guidance for selecting and using COTS parts in NASA missions. The approaches proposed in this report differ from current agency practices. This top-level executive summary touches on these new approaches for using COTS parts but does not provide the detailed information that is critical in understanding the rationale behind these new approaches. Readers will need to read the entire report to gain full understanding and effectively use the recommendations herein. NASA’s historical approach to selecting and applying parts has been to define certain parts, primarily specific classes of military specification (MIL-SPEC) parts, as “standard”, leaving all others, including COTS parts, as nonstandard. Standard parts typically are used without further testing (“use-as-is”). Nonstandard parts are subjected to initial screening and subsequent lot acceptance testing of representative samples from each procured lot per MIL-SPEC or similar requirements. Decades later, top-tier commercial part manufacturers have evolved significant manufacturing, statistical control, and technological improvements that can now provide parts as reliable or more reliable than MIL-SPEC parts, when used within their datasheet limits. Concurrently, the space science and exploration community’s needs demand technological advances unavailable with MIL-SPEC parts. This ongoing change necessitates using COTS parts for space missions. Properly selected COTS parts in appropriate applications can offer performance and supply availability advantages compared to MIL-SPEC parts. Their utility and demonstrated reliability result from large volumes and automated production and testing processes. However, careful review and a thorough understanding of their specifications (i.e., datasheet limitations) is needed, and verifying that manufacturer specifications and reliability meet space hardware application needs are necessary. This report recommends MIL-SPEC screening and non-radiation-related lot acceptance testing be reduced or eliminated in cases where evidence of sufficient quality and reliability exists for COTS parts. The extent of NASA's insight into COTS manufacturers and the amount and nature of the needed evidence will differ by mission and will likely be driven by a mission's resources and associated risk posture. To facilitate this goal, two new terminologies have been defined and described: “Industry Leading Parts Manufacturer (ILPM)” and “Established COTS parts.” An ILPM is a COTS manufacturer that produces high quality and reliable parts. Some parts produced by ILPMs, defined as Established COTS parts, do not need any additional MIL-SPEC or NASA screening and lot acceptance testing to be used in space applications. This report provides guidance for selecting, procuring, and applying COTS parts and for performing part-, board-, and system-level COTS parts verification. The recommendation to select Established COTS parts from ILPMs will assure those COTS parts will have comparable quality to corresponding MIL-SPEC parts. Selecting, applying, and verifying Established COTS parts from ILPMs requires a holistic team approach, engaging parts engineers, circuit designers, quality, reliability, and systems engineers, procurement specialists, radiation specialists, avionics leads, and program/project managers. A mission-specific approach tailored to a project’s Mission, Environment, Applications and Lifetime (MEAL) [ref. 2] requirements should be developed and approved by program/project managers. Any associated risks should be clearly identified, quantified, mitigated, and/or accepted. Different approaches are recommended according to program/project Risk Classes A, B, C, and D [ref. 3] and human-rated missions [ref. 4]: 1. Recommend Classes A and B and human-rated missions consider a “MIL-SPEC parts- based design” approach. ”MIL-SPEC parts-based design” approach is one in which most parts are MIL-SPEC parts and Established COTS parts from ILPMs are used only when an equivalent MIL-SPEC part does not meet functional or size, weight, and power (SWaP) or performance requirements, or is not available. 2. Recommend Classes D and Sub-D missions consider a “System of COTS” approach. “System of COTS” approach is one which most parts are Established COTS parts from ILPMs. 3. Recommend Class C missions determine which approach is the best for their projects; that is, use either a “MIL-SPEC parts-based design” approach, “System of COTS” approach, or a combined approach utilizing elements of both. This report intends to provide guidance in using COTS parts for NASA missions with risk classifications of A through D and human-rated missions; but it does not address the costs of using COTS parts. Costs of using COTS parts in different NASA mission classes can vary significantly even if the same parts are used in different risk postures, due to differing verification levels needed. The guidance does not distinguish between critical or non-critical systems, and a given project will need to apply the appropriate guidance based on their risk posture. The intended audience of this report are NASA personnel and commercial practitioners who support NASA’s spaceflight missions, including spaceflight program or project managers, parts engineers, parts manufacturers, radiation engineers, avionics engineers, system engineers, circuit design engineers, reliability engineers, safety and mission assurance (SMA) personnel, and parts procurement specialists. The NEPP Program will perform a pathfinder study to explore implementing the guidance in this NESC report. An ILPM verification process is not the same as conventional vendor qualification processes performed according to military standards and specifications. This NESC report intends to provide guidance in utilizing available parts data from ILPM manufacturers for parts assurance assessments needed for NASA missions. The report also captured the current practices from DoD and Federal Aviation Administration (FAA) in Section 10. Note each DoD and FAA report was provided by the corresponding agencies regarding their practices, which are independent from the NESC recommendations in the report.

Commercial-Off-The-Shelf↗

Appendix A: Proposed statement of work, 1994

This NRA effort is devoted to developing new techniques and methodologies which utilize and/or provide support to Integrated Vehicle Health Management (IVHM) concepts and techniques, modern design processes, and open architectures to realize an avionics system architecture that relieves the flight control system (FCS) of the requirement of maintaining intimate knowledge and control of the vehicle subsystems (for instance, the reaction control system (RCS)). The benefit of this architecture is that future upgrades and enhancements to the system(s) or to individual components within the system(s) are greatly simplified. This approach also allows a much more straightforward treatment of failure analysis, system diagnosis, and the design of fault containment domains. This NRA effort is also devoted to realizing capabilities to provide an available avionics system (and subsystem(s)) at minimum operational cost. This thrust provides a direct benefit to NASA in that it seeks to accelerate the design cycle to allow state of the art components and designs to actually appear in the fielded system rather than merely in the initial design. To achieve this, this effort is intended to benefit from efforts already underway at Lockheed and other major contractors. For instance, Lockheed Sanders is currently engaged in a major DoD funded development program which has the goal of cutting design cycle time of high performance electronics by a factor of four while simultaneously improving quality also by a factor of four. The early work on this program was used to enable the rapid prototyping of the Reaction Jet Drive Controller which was accomplished in 1993. Similarly, maximum leverage will be derived from recent NASA and DoD efforts to increase the content of high quality commercial grade electronic components in systems for aerospace applications. Both of these goals result in a system with enhanced cost effectiveness, increased reliability, and greatly increased performance compared to a system developed using a more conventional approach.

Source record↗

High Frequency Electronic Packaging Technology

Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

high frequency packaging commercial Materials Scie↗

Recommendations on Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions

The NASA Electronic Parts & Packaging Program Manager, requested a NASA Engineering and Safety Center independent assessment to summarize Commercial Crew Program and NASA Centers’ current and best practices, and lessons learned, on use of commercial-off-the-shelf (COTS) for all mission risk classifications, and provide recommendations that could lead to future NASA Electronic Parts and Packaging Program and/or Agency guidance on COTS parts. This document contains the outcome of the assessment.

Commercial-Off-The-Shelf↗

Grain quality inspection system

A review of grain quality indicators and measurement methods was conducted in order to assess the feasibility of using remote sensing technology to develop a continuous monitoring system for use during grain transfer operations. Most detection methods were found to be too slow or too expensive to be incorporated into the normal inspection procedure of a grain elevator on a continuous basis. Two indicators, moisture content and broken corn and foreign material, show potential for automation and are of an economic value. A microprocessor based system which utilizes commercially available electronic moisture meter was developed and tested. A method for automating BCFM measurement is described. A complete system description is presented along with performance test results.

Flood, C. A., Jr.↗

Economic Comparison of Processes Using Spreadsheet Programs

Inexpensive approach aids plant-design decisions. Commercially available electronic spreadsheet programs aid economic comparison of different processes for producing particular end products. Facilitates plantdesign decisions without requiring large expenditures for powerful mainframe computers.

Ferrall, J. F.↗

Equivalent circuit models for ac impedance data analysis

A least-squares fitting routine has been developed for the analysis of ac impedance data. It has been determined that the checking of the derived equations for a particular circuit with a commercially available electronics circuit program is essential. As a result of the investigation described, three equivalent circuit models were selected for use in the analysis of ac impedance data.

Danford, M. D.↗

Avalanche photodiode photon counting receivers for space-borne lidars

Avalanche photodiodes (APD) are studied for uses as photon counting detectors in spaceborne lidars. Non-breakdown APD photon counters, in which the APD's are biased below the breakdown point, are shown to outperform: (1) conventional APD photon counters biased above the breakdown point; (2) conventional APD photon counters biased above the breakdown point; and (3) APD's in analog mode when the received optical signal is extremely weak. Non-breakdown APD photon counters were shown experimentally to achieve an effective photon counting quantum efficiency of 5.0 percent at lambda = 820 nm with a dead time of 15 ns and a dark count rate of 7000/s which agreed with the theoretically predicted values. The interarrival times of the counts followed an exponential distribution and the counting statistics appeared to follow a Poisson distribution with no after pulsing. It is predicted that the effective photon counting quantum efficiency can be improved to 18.7 percent at lambda = 820 nm and 1.46 percent at lambda = 1060 nm with a dead time of a few nanoseconds by using more advanced commercially available electronic components.

Sun, Xiaoli↗

Fabrication of Advanced Thermoelectric Materials by Hierarchical Nanovoid Generation

A novel method to prepare an advanced thermoelectric material has hierarchical structures embedded with nanometer-sized voids which are key to enhancement of the thermoelectric performance. Solution-based thin film deposition technique enables preparation of stable film of thermoelectric material and void generator (voigen). A subsequent thermal process creates hierarchical nanovoid structure inside the thermoelectric material. Potential application areas of this advanced thermoelectric material with nanovoid structure are commercial applications (electronics cooling), medical and scientific applications (biological analysis device, medical imaging systems), telecommunications, and defense and military applications (night vision equipments).

Choi, Sang Hyouk↗

Radiation-Tolerant DC-DC Converters

A document discusses power converters suitable for space use that meet the DSCC MIL-PRF-38534 Appendix G radiation hardness level P classification. A method for qualifying commercially produced electronic parts for DC-DC converters per the Defense Supply Center Columbus (DSCC) radiation hardened assurance requirements was developed. Development and compliance testing of standard hybrid converters suitable for space use were completed for missions with total dose radiation requirements of up to 30 kRad. This innovation provides the same overall performance as standard hybrid converters, but includes assurance of radiation- tolerant design through components and design compliance testing. This availability of design-certified radiation-tolerant converters can significantly reduce total cost and delivery time for power converters for space applications that fit the appropriate DSCC classification (30 kRad).

Skutt, Glenn↗

Understanding Radiation Thermometry

This document is a two-part course on the theory and practice of radiation thermometry. Radiation thermometry is the technique for determining the temperature of a surface or a volume by measuring the electromagnetic radiation it emits. This course covers the theory and practice of radiative thermometry and emphasizes the modern application of the field using commercially available electronic detectors and optical components. The course covers the historical development of the field, the fundamental physics of radiative surfaces, along with modern measurement methods and equipment.

Risch Timothy K.↗

Understanding Radiation Thermometry

This document is a two-part course on the theory and practice of radiation thermometry. Radiation thermometry is the technique for determining the temperature of a surface or a volume by measuring the electromagnetic radiation it emits. This course covers the theory and practice of radiative thermometry and emphasizes the modern application of the field using commercially available electronic detectors and optical components. The course covers the historical development of the field, the fundamental physics of radiative surfaces, along with modern measurement methods and equipment.

Risch, Timothy K.↗

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

Elmes, John↗

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗

Fire Detector

Because the liquid hydrogen which NASA stores for the space shuttle engines is easily ignited, a hand held ultraviolet fire detector was developed by detector electronics under NASA contract. The system was commercialized by Detector Electronics for use in other hydrogen handling facilities. The detector sensors spot a hydrogen flame at 100 feet, show radiation levels and provide an aural fire alert.

Source record↗

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗