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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1997

A Simple Procedure for Constructing 5'-Amino-Terminated Oligodeoxynucleotides in Aqueous Solution

A rapid method for the synthesis of oligodeoxynucleotides (ODNs) terminated by 5'-amino-5'-deoxythymidine is described. A 3'-phosphorylated ODN (the donor) is incubated in aqueous solution with 5'-amino- 5'-deoxythymidine in the presence of N-(3-dimethylaminopropyl)-)N'-ethylcarbodiimide hydrochloride (EDC), extending the donor by one residue via a phosphoramidate bond. Template- directed ligation of the extended donor and an acceptor ODN, followed by acid hydrolysis, yields the acceptor ODN extended by a single 5'-amino-5'-deoxythymidine residue at its 5'terminus.

Bruick, Richard K.↗
NASA NTRS1996

Low Temperature Unbalanced Magnetron Deposition of Hard, Wear-Resistant Coatings for Liquid-Film Bearing Applications

The original program for evaluating the tribological properties several different hard coatings for liquid film bearing applications was curtailed when the time for the program was reduced from 3 years to 1. Of the several different coatings originally planned for evaluation, we decided to concentrate on one coating, carbon nitride. At BIRL, we have been instrumental in the development of reactively sputtered carbon nitride coatings, and we have found that it is a very interesting new material with very good tribological properties. In this program, we found that the reactively sputtered carbon nitride does not bond well directly to hardened 440C stainless steel; but if an interlayer of titanium nitride is added between the carbon nitride and the 440C, the adhesion of the dual coating combination is very good. Statistically designed experiments were run with the dual layer combination, and 3 variables were chosen for the Box-Benken design, which were the titanium nitride interlayer thickness, the nitrogen partial pressure during the reactive sputtering of the carbon nitride, and the carbon nitride substrate bias voltage. Two responses were studied from these three variables; the adhesion of the dual coating combination to the 440C substrate and the friction coefficient of the carbon nitride in dry sliding contact with 52100 steel in air. The best adhesion came with the thickness interlayer thickness studied, which was 4 micrometers, and the lowest coefficient of friction was 0.1, which was achieved when the bias voltage was in the range of -80 to - 120 V and the nitrogen partial pressure was 3 mTorr.

Sproul, William D.↗
NASA NTRS1993

Viewpoint 9--molecular structure of aqueous interfaces

In this review we summarize recent progress in our understanding of the structure of aqueous interfaces emerging from molecular level computer simulations. It is emphasized that the presence of the interface induces specific structural effects which, in turn, influence a wide variety of phenomena occurring near the phase boundaries. At the liquid-vapor interface, the most probable orientations of a water molecule is such that its dipole moment lies parallel to the interface, one O-H bond points toward the vapor and the other O-H bond is directed toward the liquid. The orientational distributions are broad and slightly asymmetric, resulting in an excess dipole moment pointing toward the liquid. These structural preferences persist at interfaces between water and nonpolar liquids, indicating that the interactions between the two liquids in contact are weak. It was found that liquid-liquid interfaces are locally sharp but broadened by capillary waves. One consequence of anisotropic orientations of interfacial water molecules is asymmetric interactions, with respect to the sign of the charge, of ions with the water surface. It was found that even very close to the surface ions retain their hydration shells. New features of aqueous interfaces have been revealed in studies of water-membrane and water-monolayer systems. In particular, water molecules are strongly oriented by the polar head groups of the amphiphilic phase, and they penetrate the hydrophilic head-group region, but not the hydrophobic core. At infinite dilution near interfaces, amphiphilic molecules exhibit behavior different from that in the gas phase or in bulk water. This result sheds new light on the nature of hydrophobic effect in the interfacial regions. The presence of interfaces was also shown to affect both equilibrium and dynamic components of rates of chemical reactions. Applications of continuum models to interfacial problems have been, so far, unsuccessful. This, again, underscores the importance of molecular-level information about interfaces.

Review, Tutorial↗
NASA NTRS2005

Mechanical Properties of Nanostructured Materials Determined Through Molecular Modeling Techniques

The potential for gains in material properties over conventional materials has motivated an effort to develop novel nanostructured materials for aerospace applications. These novel materials typically consist of a polymer matrix reinforced with particles on the nanometer length scale. In this study, molecular modeling is used to construct fully atomistic models of a carbon nanotube embedded in an epoxy polymer matrix. Functionalization of the nanotube which consists of the introduction of direct chemical bonding between the polymer matrix and the nanotube, hence providing a load transfer mechanism, is systematically varied. The relative effectiveness of functionalization in a nanostructured material may depend on a variety of factors related to the details of the chemical bonding and the polymer structure at the nanotube-polymer interface. The objective of this modeling is to determine what influence the details of functionalization of the carbon nanotube with the polymer matrix has on the resulting mechanical properties. By considering a range of degree of functionalization, the structure-property relationships of these materials is examined and mechanical properties of these models are calculated using standard techniques.

Clancy, Thomas C.↗
NASA NTRS2014

AE (Acoustic Emission) for Flip-Chip CGA/FCBGA Defect Detection

C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.

Ghaffarian, Reza↗
NASA NTRSDate not supplied

The Interplay of Humor and Team Cohesion Over Time

Team bonding and interpersonal relationships are increasingly important as we continue understanding the effects of the pandemic on team dynamics. Specifically, team cohesion, defined as having a sense of belonging and commitment towards the group, has been found to be important for key team outcomes such as performance, relationships, and productivity (Beal, Cohen, Burke, & McLendon, 2003; Bell & Marentette, 2011). Research has stressed the benefits of positive humor on cohesion, with humor creating positive emotions and decreasing social distance (e.g., Robert & Wilbanks, 2012; Robinson & Smith-Lovin, 2001; Romero & Pescosolido, 2008). However, research around the impact of negative humor on cohesion is scarce. This study aims to examine the impact of both positive and negative humor on cohesion for teams over time. The longitudinal design allows us to examine the interplay of humor and cohesion throughout a team’s lifecycle to guide relationship development and management (Romero & Pescosolido, 2008). Humor is defined as remarks recognized as amusing or funny (Martin, 2007). Positive humor can be categorized as good-natured aimed to create mutual agreement, while negative humor is defined as aggressive, hostile, and unreciprocated (Coan & Gottman, 2007). Research has concluded the many benefits of positive humor, showing it can increase open communication, social support, and create a pleasant environment (Martineau, 1972; Robinson & Smith-Lovin, 2001; Romero & Pescosolido, 2008). The Humor Wheel model suggests that positive humor is contagious due to the positive affect produced and mimicked (Lehmann-Willenbrock & Allen 2014). Research has suggested positive humor would increase over time based on the norm of reciprocity; those treated positively are likely to respond similarly (Gouldner, 1960). Multiple parties’ involvement in humor exchanges highlights the interpersonal nature of humor. Thus, long-term consequences on relationships should be considered, such as cohesion (Robert & Wilbanks, 2012). It would be instrumental to understand how humor interactions could weaken or strengthen group cohesion through relational and emotional bonds over time (Martineau, 1972; Romero & Pescosolido, 2008). Positive humor should fundamentally increase team cohesion (Mesmer-Magnus, Glew, & Viswesvaran, 2012; Walter & Baruch, 2008) by promoting group harmony, team member attractiveness, and ingroup identity (Holmes, 2006). Thus, it is expected there is a positive relationship between positive humor and team cohesion over time (hypothesis 1). Humor is not always beneficial, especially when it elicits negative emotions (Dikkers, Doosje, & de Lange, 2011). Negative humor can be used to humiliate, tease, or insult (Coan & Gottman, 2007; Collinson, 1988; Romero & Cruthirds, 2006). It tends to cause distress and damage relationships, and in turn, decrease organizational performance and production (Avolio, Howell, & Sosik, 1999; Janes & Olson, 2000; Yerkes, 2001). Research concludes negative humor may create subgroups and decrease cooperation (Romero & Arendt, 2011). Research has also indicated positive implications for negative humor under specific circumstances. Negative humor could help to solidify ingroup identity and strengthen bonds when directed outside the team (Terrion & Ashforth, 2002; Thomae & Pina, 2015). For example, sport teams may use negative humor towards their opponent before a game, which emphasizes their differences and lowers the status and power of their opponent, ultimately promoting solidarity and cohesion inside the group. For this study, it is anticipated that negative humor toward other teammates will decrease team cohesion over time due to the damage to relationships and negative affect produced (Duncan, Smeltzer, & Leap, 1990; Maples, Dupey, Torres‐Rivera, Phan, Vereen, & Garrett, 2001). We also predicted that negative humor focused on something or someone outside the team will increase cohesion by enhancing ingroup ties and creating a common identity (Thomae & Pina, 2015). Thus, the relationship between negative humor and cohesion will be moderated by the target of the humor. The relationship will be negative when the target is within the team and positive when the target is outside (hypothesis 2).

Melissa M. Vazquez↗
NASA NTRS1994

Effects of Thermal Cycling on Thermal Expansion and Mechanical Properties of Sic Fiber-reinforced Reaction-bonded Si3n4 Composites

Thermal expansion curves for SiC fiber-reinforced reaction-bonded Si3N4 matrix composites (SiC/RBSN) and unreinforced RBSN were measured from 25 to 1400 C in nitrogen and in oxygen. The effects of fiber/matrix bonding and cycling on the thermal expansion curves and room-temperature tensile properties of unidirectional composites were determined. The measured thermal expansion curves were compared with those predicted from composite theory. Predicted thermal expansion curves parallel to the fiber direction for both bonding cases were similar to that of the weakly bonded composites, but those normal to the fiber direction for both bonding cases resulted in no net dimensional changes at room temperature, and no loss in tensile properties from the as-fabricated condition. In contrast, thermal cycling in oxygen for both composites caused volume expansion primarily due to internal oxidation of RBSN. Cyclic oxidation affected the mechanical properties of the weakly bonded SiC/RBSN composites the most, resulting in loss of strain capability beyond matrix fracture and catastrophic, brittle fracture. Increased bonding between the SiC fiber and RBSN matrix due to oxidation of the carbon-rich fiber surface coating and an altered residual stress pattern in the composite due to internal oxidation of the matrix are the main reasons for the poor mechanical performance of these composites.

Bhatt, R. T.↗
NASA NTRS2010

Shape Bonding method

The present invention is directed to a method of bonding at least two surfaces together. The methods step of the present invention include applying a strip of adhesive to a first surface along a predefined outer boundary of a bond area and thereby defining a remaining open area there within. A second surface, or gusset plate, is affixed onto the adhesive before the adhesive cures. The strip of adhesive is allowed to cure and then a second amount of adhesive is applied to cover the remaining open area and substantially fill a void between said first and second surfaces about said bond area. A stencil may be used to precisely apply the strip of adhesive. When the strip cures, it acts as a dam to prevent overflow of the subsequent application of adhesive to undesired areas. The method results in a precise bond area free of undesired shapes and of a preferred profile which eliminate the drawbacks of the prior art bonds.

Pontius, James T.↗
NASA NTRS1984

Rapid adhesive bonding concepts

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process is often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid adhesive bonding concepts were developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens are cut by a factor of 10 to 100 compared to standard press bonding. The development of rapid adhesive bonding for lap shear specimens (per ASTM D1003 and D3163), for aerospace panel bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric matrix composite structures are reviewed.

Stein, B. A.↗
NASA NTRS1985

Rapid adhesive bonding and field repair of aerospace materials

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process are often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid Adhesive Bonding concepts are developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens can be cut by a factor of 10 to 100 compared to standard press or autoclave bonding. The development of Rapid Adhesive Bonding for lap shear specimens (per ASTM D1002 and D3163), for aerospace panel or component bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric-matrix composite structures is reviewed. Equipment and procedures are described for bonding and repairing thin sheets, simple geometries, and honeycomb core panels.

Stein, B. A.↗
NASA NTRS1989

RSRM nozzle fixed housing cooldown test

Flight 5 aft segments with nozzles were exposed to -17 F temperatures while awaiting shipment to KSC in February, 1989. No records were found which show that any previous nozzles were exposed to air temperatures as low as those seen by the Flight 5 nozzles. Thermal analysis shows that the temperature of the fixed housing, and forward and aft exit cone components dropped as low as -10 F. Structural analysis of the nozzles at these low temperatures show the forward and aft exit cone adhesive bonds to have a positive margin of safety, based on a 2.0 safety factor. These analyses show the normal and shear stresses in the fixed housing bond as low values. However, the hoop and meridinal stresses were predicted to be in the 4000 psi range; the failure stress allowable of EA913NA adhesive at -7 F. If the bonds did break in directions perpendicular to the surfaces, called bond crazing, no normal bond strength would be lost. Testing was conducted in two phases, showing that no degradation to the adhesive bonds occurred while the Flight 5 nozzles were subjected to subzero temperatures. The results of these tests are documented. Phase 1 testing cooled a full-scale RSRM insulated fixed housing to -13 F, with extensive bondline inspections. Phase 2 testing cooled the witness panel adhesive tensile buttions to -13 F, with failure strengths recorded before, during, and after the cooldown.

Bolieau, D. J.↗
NASA NTRS1985

Equipment and techniques for rapid bonding of composites

Rapid adhesive bonding concepts have been developed at NASA Langley which employ induction heating of thermoplastic composite matrices directly along the bond line and/or adherends without heating the entire structure, the supports, and the fixtures of the bonding assembly. Short term thermal cycling and water boil exposures have shown encouraging environmental stability for these rapid bonds. These bonding techniques have been extended to continuous seam bonding of metallic and composite panels with promising results for the bonding of both like and unlike adherends; the portability of the apparatus suggests that field repairs of damaged structures are possible.

Buckley, John D.↗
NASA NTRS1991

Rapid induction bonding of composites, plastics, and metals

The Toroid Bonding Gun is and induction heating device. It is a self contained, portable, low powered induction welding system developed for bonding or joining plastic, ceramic, or metallic parts. Structures can be bonded in a factory or in a the field. This type of equipment allows for applying heat directly to the bond lines and/or to the adhesives without heating the entire structure, supports, and fixtures of a bonding assembly. The induction heating gun originally developed for use in the fabrication of space Gangs of bonders are now used to rapidly join composite sheet and structural components. Other NASA-developed applications of this bonding technique include the joining of thermoplastic composites, thermosetting composites, metals, and combinations of these materials.

Buckley, John D.↗
NASA NTRS1989

Removing Bonded Integrated Circuits From Boards

Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

Rice, John T.↗
NASA NTRS1996

Nonenzymatic, template-directed ligation of oligoribonucleotides is highly regioselective for the formation of 3'-5' phosphodiester bonds

We have found that nonenzymatic, template-directed ligation reactions of oligoribonucleotides display high selectivity for the formation of 3'-5' rather than 2'-5' phosphodiester bonds. Formation of the 3'-5'-linked product is favored regardless of the metal ion catalyst or the leaving group, and for several different ligation junction sequences. The degree of selectivity depends on the leaving group: the ratio of 3'-5'- to 2'-5'-linked products was 10-15:1 when the 5'-phosphate was activated as the imidazolide, and 60-80:1 when the 5'-phosphate was activated by the formation of a 5'-triphosphate. Comparison of oligonucleotide ligation reactions with previously characterized single nucleotide primer extension reactions suggests that the strong preference for 3'-5'-linkages in oligonucleotide ligation is primarily due to occurence of ligation within the context of an extended Watston-Crick duplex. The ability of RNA to correctly self-assemble by template-directed ligation is an intrinsic consequence of its chemical structure and need not be imposed by an external catalyst (i.e., an enzyme polymerase); RNA therefore provides a reasonable structural basis for a self-replicating system in a prebiological world.

Non-NASA Center↗
NASA NTRS1999

Corrugated Quantum Well Infrared Photodetector Focal Plane Array Test Results

The corrugated quantum-well infrared photodetector (C-QWIP) uses total internal reflection to couple normal incident light into the optically active quantum wells. The coupling efficiency has been shown to be relatively independent of the pixel size and wavelength thus making the C-QWIP a candidate for detectors over the entire infrared spectrum. The broadband coupling efficiency of the C-QWIP makes it an ideal candidate for multiwavelength detectors. We fabricated and tested C-QWIP focal plane arrays (FPAs) with cutoff wavelengths of 11.2 and 16.2 micrometers. Each FPA has 256 x 256 pixels that are bump-bonded to a direct injection readout circuit. Both FPAs provided infrared imagery with good aesthetic attributes. For the 11.2-micrometers FPA, background-limited performance (BLIP) was observed at 60 K with f/3 optics. For the 16.2-micrometers FPA, BLIP was observed at 38 K. Besides the reduction of dark current in C-QWIP structures, the measured internal quantum efficiency (eta) remains to be high. The values for responsivity and quantum efficiency obtained from the FPA results agree well with those measured for single devices.

Goldberg, A.↗
NASA NTRS1994

The C-H Dissociation Energy of C2H6

The C-H bond energy in C2H6 is computed to be 99.76 +/- 0.35 kcal/mol, which is in excellent agreement with the most recent experimental values. The calculation of the C-H bond energy by direct dissociation and by an isodesmic reaction is discussed.

Bauschlicher, Charles W., Jr.↗
NASA NTRS2008

Tunable Optical Assembly with Vibration Dampening

Since their market introduction in 1995, fiber Bragg gratings (FBGs) have emerged as excellent means of measuring such parameters as strain and temperature. Distributed-grating sensing is particularly beneficial for such structural-health monitoring applications such as those of 'smart' structures or integrated vehicle health management in aerospace vehicles. Because of the variability of their output wavelengths, tunable lasers have become widely used as means of measuring FBGs. Several versions of a lightweight assembly for strain-tuning an FBG and dampening its vibrations have been constructed. The main components of such an assembly are one or more piezoelectric actuators, an optical fiber containing one or more Bragg grating(s), a Bragg-grating strain-measurement system, and a voltage source for actuation. The piezoelectric actuators are, more specifically, piezoceramic fiber composite actuators and, can be, still more specifically, of a type known in the art as macro-fiber composite (MFC) actuators. In fabrication of one version of the assembly, the optical fiber containing the Bragg grating(s) is sandwiched between the piezoelectric actuators along with an epoxy that is used to bond the optical fiber to both actuators, then the assembly is placed in a vacuum bag and kept there until the epoxy is cured. Bonding an FBG directly into an MFC actuator greatly reduces the complexity, relative to assemblies, that include piezoceramic fiber composite actuators, hinges, ferrules, and clamp blocks with setscrews. Unlike curved actuators, MFC actuators are used in a flat configuration and are less bulky. In addition, the MFC offers some vibration dampening and support for the optical fiber whereas, in a curved piezoelectric actuator assembly, the optical fiber is exposed, and there is nothing to keep the exposed portion from vibrating.

Shams, Qamar A.↗