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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS1998

Evaluation of Capacitors at Cryogenic Temperatures for Space Applications

Advanced electronic systems designed for use in planetary exploration missions must operate efficiently and reliably under the extreme cold temperatures of deep space environment. In addition, spacecraft power electronics capable of cold temperature operation will greatly simplify the thermal management system by eliminating the need for heating units and associated equipment and thereby reduce the size and weight of the overall power system. In this study, film, mica, solid tantalum and electric double layer capacitors were evaluated as a function of temperature from room to liquid nitrogen in terms of their dielectric properties. These properties included capacitance stability and dielectric loss in the frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed on the capacitors. The results obtained are discussed and conclusions are made concerning the suitability of the capacitors investigated for low temperature applications.

Patterson, Richard L.↗

NASA NTRS2020

In-Situ Testing Methods for Mixed-Mode Harsh Environments

Future NASA missions are driving a need for instrumentation and space electronics that will operate at extreme temperatures, with low mass and extended deployments. This need results in devices that will experience dose damage at both low and high temperatures that will suppress annealing and induce accelerated wear out issues. Therefore, the ability to perform radiation tests on devices at temperature is critical. This paper analyses the methods and process to enable these test as developed at the JPL Dynamitron Facility. Since electronics are the radiation source for this facility, the steps to ensure parity with cobalt-60 testing are discussed. Also discussed are the implications for system level testing and mixed radiation mode testing for highly integrated and scaled devices.

Scheick, Leif Z↗

NASA NTRS2012

Multi-Mission Radioisotope Thermoelectric Generator Heat Exchangers for the Mars Science Laboratory Rover

The addition of the Multi-Mission Radioisotope Thermoelectric Generator (MMRTG) to the Mars Science Laboratory (MSL) Rover requires an advanced thermal control system that is able to both recover and reject the waste heat from the MMRTG as needed in order to maintain the onboard electronics at benign temperatures despite the extreme and widely varying environmental conditions experienced both on the way to Mars and on the Martian surface. Based on the previously successful Mars landed mission thermal control schemes, a mechanically pumped fluid loop (MPFL) architecture was selected as the most robust and efficient means for meeting the MSL thermal requirements. The MSL heat recovery and rejection system (HRS) is comprised of two Freon (CFC-11) MPFLs that interact closely with one another to provide comprehensive thermal management throughout all mission phases. The first loop, called the Rover HRS (RHRS), consists of a set of pumps, thermal control valves, and heat exchangers (HXs) that enables the transport of heat from the MMRTG to the rover electronics during cold conditions or from the electronics straight to the environment for immediate heat rejection during warm conditions. The second loop, called the Cruise HRS (CHRS), is thermally coupled to the RHRS during the cruise to Mars, and provides a means for dissipating the waste heat more directly from the MMRTG as well as from both the cruise stage and rover avionics by promoting circulation to the cruise stage radiators. A multifunctional structure was developed that is capable of both collecting waste heat from the MMRTG and rejecting the waste heat to the surrounding environment. It consists of a pair of honeycomb core sandwich panels with HRS tubes bonded to both sides. Two similar HX assemblies were designed to surround the MMRTG on the aft end of the rover. Heat acquisition is accomplished on the interior (MMRTG facing) surface of each HX while heat rejection is accomplished on the exterior surface of each HX. Since these two surfaces need to be at very different temperatures in order for the fluid loops to perform efficiently, they need to be thermally isolated from one another. The HXs were therefore designed for high in-plane thermal conductivity and extremely low through-thickness thermal conductivity by using aluminum facesheets and aerogel as insulation inside a composite honeycomb core. Complex assemblies of hand-welded and uniquely bent aluminum tubes are bonded onto each side of the HX panels, and are specifically designed to be easily mated and demated to the rest of the RHRS in order to ease the integration effort.

Mastropietro, A. J.↗

NASA NTRS2002

Low Temperature Reliability of Electronic Packages/Assemblies for Space Missions

A NASA-wide team, funded under the NASA Electronic Parts and Packaging Program (NEPP), was formed to collaborate and to establish reliability of various electronic parts/packaging and assemblies for operation under extreme cold temperatures. One of the primary objectives of the NEPP is to expedite the infusion of cutting edge technologies into the present and future NASA missions. Commercial-off-the-shelf (COTS) emerging electronic parts/packages due to their lower weight, increased functionality, and lower cost are excellent candidates for space missions if they are characterized to show that they will meet the stringent reliability and quality requirements. Characterizations, especially for the extreme cold temperatures, are required since very limited data are available by manufacturers or users. For severe military environments, the temperature conditions to -65 C are the lowest temperature for which these parts/packages and assemblies are qualified. New data beyond this relatively benign cold temperature are required for numerous NASA missions. Several parts/packages, based on the project recommendation for their immediate and future needs, were selected for detailed characterization to cold temperature regimes down to liquid nitrogen (-196 C), covering both Mars cold temperature (-125 C) and asteroid (- 180 C) lander environmental requirements. Numerous parts/packages and assemblies were characterized during extreme temperature environmental tests. Several electrical parameters were characterized at discrete temperatures to -185 C to determine if they remain within their specification ranges. Both packages and circuit boards were subjected to nondestructive testing including optical, X-ray, and acoustic microscopy to document their integrity prior to environment exposure. Package/board assemblies were also subjected to X-ray to characterize solder joint integrity including void levels. Both parts and assemblies were subjected to thermal cycling with a large temperature swing enveloping numerous NASA missions. Details of the performed tests and the results obtained are presented.

Patterson, Richard L.↗

NASA NTRS2019

Operation of Ultrafast, Low-Side MOSFET Driver, IXD609, over Wide Temperature Range

Electrical power and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. In addition, space-based infrared satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where system electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and very little data exist on their performance outside their specified range of operation. In this work, the performance of an ultrafast gate driver for controlling power-level transistors was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Boomer, Kristen↗

NASA NTRS2011

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗

NASA NTRS2011

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard↗

NASA NTRS2005

Experiences issues with plastic parts at cold temperatures

Missions to MARS/planets/asteroids require electronic parts to operate and survive at extreme cold conditions. At extreme cold temperatures many types of cold related failures can occur. Office 514 is currently evaluating plastic parts under various cold temperature conditions and applications. Evaluations, screens, and qualifications are conducted on flight parts.

cold temperatures↗

NASA NTRS2006

Temperature-Adaptive Circuits on Reconfigurable Analog Arrays

Demonstration of a self-reconfigurable Integrated Circuit (IC) that would operate under extreme temperature (-180 C and 120 C) and radiation (300krad), without the protection of thermal controls and radiation shields. Self-Reconfigurable Electronics platform: a) Evolutionary Processor (EP) to run reconfiguration mechanism; b) Reconfigurable chip (FPGA, FPAA, etc).

self-recovery↗

NASA NTRS2008

High Temperature Electronics for Intelligent Harsh Environment Sensors

The development of intelligent instrumentation systems is of high interest in both public and private sectors. In order to obtain this ideal in extreme environments (i.e., high temperature, extreme vibration, harsh chemical media, and high radiation), both sensors and electronics must be developed concurrently in order that the entire system will survive for extended periods of time. The semiconductor silicon carbide (SiC) has been studied for electronic and sensing applications in extreme environment that is beyond the capability of conventional semiconductors such as silicon. The advantages of SiC over conventional materials include its near inert chemistry, superior thermomechanical properties in harsh environments, and electronic properties that include high breakdown voltage and wide bandgap. An overview of SiC sensors and electronics work ongoing at NASA Glenn Research Center (NASA GRC) will be presented. The main focus will be two technologies currently being investigated: 1) harsh environment SiC pressure transducers and 2) high temperature SiC electronics. Work highlighted will include the design, fabrication, and application of SiC sensors and electronics, with recent advancements in state-of-the-art discussed as well. These combined technologies are studied for the goal of developing advanced capabilities for measurement and control of aeropropulsion systems, as well as enhancing tools for exploration systems.

Evans, Laura J.↗

DOE OSTI2023

In-Situ Observation of the Formation of Laser-Induced Periodic Surface Structures with Extreme Spatial and Temporal Resolution

Irradiation of solid surfaces with intense ultrashort laser pulses represents a unique way of depositing energy into materials. It allows to realize states of extreme electronic excitation and/or very high temperature and pressure and to drive materials close to and beyond fundamental stability limits. As a consequence, structural changes and phase transitions often occur along unusual pathways and under strongly nonequilibrium conditions. Furthermore, due to the inherent multiscale nature—both temporally and spatially—of these irreversible processes, their direct experimental observation requires techniques that combine high temporal resolution with the appropriate spatial resolution and the capability to obtain good quality data on a single pulse/event basis. In this respect, fourth-generation light sources, namely, short wavelength and short pulse free electron lasers (FELs), are offering new and fascinating possibilities. As an example, this chapter will discuss the results of scattering experiments carried out at the FLASH free electron laser at DESY (Hamburg, Germany), which allowed us to resolve laser-induced structure formation at surfaces on the nanometer to submicron length scale and in temporal regimes ranging from picoseconds to several nanoseconds with sub-picosecond resolution.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

NASA NTRS2019

Behavior of Triple Langmuir Probes in Non-Equilibrium Plasmas

A model of current collection in Langmuir probes is used to investigate the effect representative non- equilibrium plasmas under various conditions have on the electron temperature and number density that would be calculated through analysis of the probe collection characteristics. The model uses the distribution function to calculate the charged particle flux to a probe and then, for fixed applied voltages, the current values that satisfy continuity in the probes are determined. The triple probe is not scanned in voltage, so there is no practical way using experimental triple probe data to determine if the plasma is in equilibrium. As a consequence, a triple probe analysis typically relies on the assumption that the plasma is in equilibrium. Proceeding from this point, the numerically-generated non-equilibrium triple probe data are analyzed assuming that the plasma is in equilibrium, with the data compared to the initial distribution function inputs of plasma temperature and number density to determine the effect the non-equilibrium distribution has on plasma measurements. The temperature and number density are both significantly affected when a fraction of the particles in the distribution are shifted from the equilibrium configuration into the non-equilibrium part of the distribution function. For all instances studied, the computed electron temperature and number density are extremely sensitive to small deviations from equilibrium ( ≤ 5% of the plasma shifted into the non-equilibrium function). Shifting more of the plasma into the non-equilibrium distribution beyond this initial level does not produce a significant additional shift in the computed plasma properties.

Polzin, Kurt A.↗

NASA NTRS2004

Self-Recovery Experiments in Extreme Environments Using a Field Programmable Transistor Array

Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. However, current technology can only ensure very limited lifetime in extreme environments. This paper describes novel experiments that allow adaptive in-situ circuit redesign/reconfiguration during operation in extreme temperature and radiation environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. The approach is demonstrated on a mixed-signal programmable chip (FPTA-2), which recovers functionality for temperatures until 28 C and with total radiation dose up to 250kRad.

space vehicle electronics↗

DOE OSTI2025

Extreme Heating of Minor Ions in Imbalanced Solar-wind Turbulence

Minor ions in the solar corona are heated to extreme temperatures, far in excess of those of the electrons and protons that comprise the bulk of the plasma. These highly nonthermal distributions make minor ions sensitive probes of the collisionless processes that heat the corona and power the solar wind. The recent discovery of the "helicity barrier" offers a mechanism in which imbalanced Alfvénic turbulence in low-β plasmas preferentially heats protons over electrons, generating high-frequency, proton-cyclotron-resonant fluctuations. We use the hybrid-kinetic particle-in-cell code Pegasus++ to drive imbalanced Alfvénic turbulence in a 3D low-β plasma with additional passive ion species, He 2+ and O 5+ . A helicity barrier naturally develops, followed by clear phase-space signatures of oblique proton-cyclotron-wave heating and Landau-resonant heating from the imbalanced Alfvénic fluctuations. The former results in characteristically arced ion velocity distribution functions, whose non-bi-Maxwellian features are shown by linear ALPS calculations to be critical to the heating process. Additional features include a steep transition-range electromagnetic spectrum, proton-cyclotron waves propagating in the direction of the imbalance, significantly enhanced proton-to-electron heating ratios, ion temperatures that are considerably more perpendicular with respect to magnetic field, and extreme heating of heavier species in a manner consistent with mass scalings inferred from spacecraft measurements. None of these features are realized in an otherwise equivalent simulation of balanced turbulence. If seen simultaneously in the fast solar wind, these signatures of the helicity barrier would testify to the necessity of incorporating turbulence imbalance in a complete theory for the evolution of the solar wind.

79 ASTRONOMY AND ASTROPHYSICS↗

NASA NTRS2007

Silicon Carbide Sensors and Electronics for Harsh Environment Applications

Silicon carbide (SiC) semiconductor has been studied for electronic and sensing applications in extreme environment (high temperature, extreme vibration, harsh chemical media, and high radiation) that is beyond the capability of conventional semiconductors such as silicon. This is due to its near inert chemistry, superior thermomechanical and electronic properties that include high breakdown voltage and wide bandgap. An overview of SiC sensors and electronics work ongoing at NASA Glenn Research Center (NASA GRC) will be presented. The main focus will be two technologies currently being investigated: 1) harsh environment SiC pressure transducers and 2) high temperature SiC electronics. Work highlighted will include the design, fabrication, and application of SiC sensors and electronics, with recent advancements in state-of-the-art discussed as well. These combined technologies are studied for the goal of developing advanced capabilities for measurement and control of aeropropulsion systems, as well as enhancing tools for exploration systems.

Evans, Laura J.↗

NASA NTRS2007

High-Performance, Radiation-Hardened Electronics for Space Environments

The Radiation Hardened Electronics for Space Environments (RHESE) project endeavors to advance the current state-of-the-art in high-performance, radiation-hardened electronics and processors, ensuring successful performance of space systems required to operate within extreme radiation and temperature environments. Because RHESE is a project within the Exploration Technology Development Program (ETDP), RHESE's primary customers will be the human and robotic missions being developed by NASA's Exploration Systems Mission Directorate (ESMD) in partial fulfillment of the Vision for Space Exploration. Benefits are also anticipated for NASA's science missions to planetary and deep-space destinations. As a technology development effort, RHESE provides a broad-scoped, full spectrum of approaches to environmentally harden space electronics, including new materials, advanced design processes, reconfigurable hardware techniques, and software modeling of the radiation environment. The RHESE sub-project tasks are: SelfReconfigurable Electronics for Extreme Environments, Radiation Effects Predictive Modeling, Radiation Hardened Memory, Single Event Effects (SEE) Immune Reconfigurable Field Programmable Gate Array (FPGA) (SIRF), Radiation Hardening by Software, Radiation Hardened High Performance Processors (HPP), Reconfigurable Computing, Low Temperature Tolerant MEMS by Design, and Silicon-Germanium (SiGe) Integrated Electronics for Extreme Environments. These nine sub-project tasks are managed by technical leads as located across five different NASA field centers, including Ames Research Center, Goddard Space Flight Center, the Jet Propulsion Laboratory, Langley Research Center, and Marshall Space Flight Center. The overall RHESE integrated project management responsibility resides with NASA's Marshall Space Flight Center (MSFC). Initial technology development emphasis within RHESE focuses on the hardening of Field Programmable Gate Arrays (FPGA)s and Field Programmable Analog Arrays (FPAA)s for use in reconfigurable architectures. As these component/chip level technologies mature, the RHESE project emphasis shifts to focus on efforts encompassing total processor hardening techniques and board-level electronic reconfiguration techniques featuring spare and interface modularity. This phased approach to distributing emphasis between technology developments provides hardened FPGA/FPAAs for early mission infusion, then migrates to hardened, board-level, high speed processors with associated memory elements and high density storage for the longer duration missions encountered for Lunar Outpost and Mars Exploration occurring later in the Constellation schedule.

Keys, Andrew S.↗

NASA NTRS2017

Evaluation of Fast Switching Diode 1N4448 Over a Wide Temperature Range

Electronic parts used in the design of power systems geared for space applications are often exposed to extreme temperatures and thermal cycling. Limited data exist on the performance and reliability of commercial-off-the-shelf (COTS) electronic parts at temperatures beyond the manufacturers specified operating temperature range. This report summarizes preliminary results obtained on the evaluation of automotive-grade, fast switching diodes over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these diodes and to determine suitability for use outside their recommended temperature limits.

Thermal Cycling↗

DOE OSTI2024

Nonvolatile electrochemical memory at 600°C enabled by composition phase separation

Silicon-based microelectronics are limited to ~150°C and therefore not suitable for the extremely high temperatures in aerospace, energy, and space applications. While wide-band-gap semiconductors can provide high-temperature logic, nonvolatile memory devices at high temperatures have been challenging. In this work, we develop a nonvolatile electrochemical memory cell that stores and retains analog and digital information at temperatures as high as 600°C. Through correlative scanning transmission electron microscopy, we show that this high-temperature information retention is a result of composition phase separation between the oxidized and reduced forms of amorphous tantalum oxide. This result demonstrates a memory concept that is resilient at extreme temperatures and reveals phase separation as the principal mechanism that enables nonvolatile information storage in these electrochemical memory cells.

42 ENGINEERING↗