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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging

The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.

Chemistry↗
NASA NTRS1990

Printed-Circuit Tape Measures For X-Ray Inspections

Known pattern impressed on x-ray image for reference. Tapes made by flexible-printed-circuit technology provides identification and position references for x-ray images of weld joints. Proposed tapes consist of etched copper patterns on flexible substrates. X-rays record pattern of tape on film beneath butt-welded panels. Pattern becomes convenient reference for analysis and digitization of x-ray image.

Sullivan, John E., Jr.↗
DOE OSTI2023

An Integrated Testbed for Trojans in Printed Circuit Boards with Fuzzing Capabilities

This paper showcases an all-in-one testing environment that combines Trojan detection and fuzzing capabilities for printed circuit boards using the OpenPLC “NYU Trojan Edition” and a dedicated Trojan detection framework. The demo system is self-contained and equipped with two OpenPLC-based boards (one with a Trojan and one without), and automated tools for inserting the Trojan and collecting side-channel data. We developed a graphical user interface for interactive Trojan selection, data visualization, and anomaly detection analysis.

Trojan detection, anomaly detection, PCB, timing l↗
DOE OSTI2020

Authenticating a printed circuit board

A computing module is described herein, wherein the computing module is configured to perform acts including generating a digital signature for a printed circuit board (PCB), wherein the digital signature is based upon a sensor signal generated by a sensor that is electrically coupled to at least one of a trace of the PCB or an electrical component of the PCB. The acts further include determining that the PCB is authentic and is free of tampering based upon the digital signature. The acts additionally include outputting an indication that the PCB is authentic and is free of tampering responsive to determining that the PCB is authentic and is free of tampering.

97 MATHEMATICS AND COMPUTING↗
NASA NTRS2014

Advances in Current Rating Techniques for Flexible Printed Circuits

Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

Hayes, Ron↗
DOE OSTI2023

Modeling a Water-Cooled Printed Circuit Heat Exchanger Condensing CO2 for use in SCO2 Cycle System Optimization Studies

This work describes a one-dimensional model of a water-cooled printed circuit heat exchanger (PCHE) condensing supercritical CO2. The model is developed for use in cycle optimization studies (e.g., minimizing levelized cost of electricity) as either the main heat rejection cooler and/or a compressor intercooler for recompression closed Brayton supercritical CO2 power cycles. Sensitivity and case studies are used to illustrate the impact of important model parameters, and this includes allowing for independent variation of zig-zag channel wave angles on the CO2 and water side. Results show that for a given CO2 design pressure (and thus saturation temperature), the PCHE design inlet water temperature has a significant impact on the PCHE size. Results also demonstrate that if wave angles are the same on the CO2 and water side, the water side pressure drop will have more influence on determining the optimum PCHE mass than the CO2 side pressure drop. Reducing the water side wave angle to near straight channel flow offers a more compact design for a similar water side pressure drop (and pump power requirement). Cases are also shown for further increasing the compactness and how the PCHE mass is affected along with water pump power.

Liese, Eric↗
NASA NTRS2012

Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

Bradley, Arthur T.↗
NASA NTRS2004

Printed Circuit Board Design with HDL Designer

Staying up to date with the latest CAD tools both from a cost and time perspective is difficult. Within a given organization there may be experts in Printed Circuit Board Design tools and experts in FPGA/VHDL tools. Wouldn't it be great to have someone familiar with HDL Designer be able to design PCBs without having to learn another tool? This paper describes a limited experiment to do this.

Winkert, Thomas K.↗
DOE OSTI2022

Fabrication of Polymer Membrane-Suspended Microstructures on Printed Circuit Boards

When microelectromechanical systems are manufactured in high densities, the necessary routing layer structures can become complex and thus expensive if executed in silicon technology. If, additionally, the microstructures are also to be fabricated suspended on membranes, complex thinning processes become necessary to form these often rather fragile membranes. Here, a novel fabrication concept is demonstrated that allows for the fabrication of membrane-suspended microstructures using standard microfabrication techniques directly integrated with printed circuit boards (PCB) by laminating polyimide (PI) films over cavities in the PCB. This results in cost-effective routing layer fabrication and direct compatibility with common electronic component standards such as SMT (surface-mount technology) and THT (through-hole technology). To illustrate the capabilities of the fabrication process, we fabricated an array of membrane suspended microheaters. Individual platinum microheater elements are suspended on PI membranes that are 25 μm thick and 500 μm in diameter. The fabricated PCB carries a 10x10 array of suspended microheaters on an area of 26,mm x 26,mm. Here, the characterization of the microheater array shows that a yield of 86% functional microheaters was achieved. An individual microheater shows an almost linear heating characteristic at least up to 200°C demonstrating the viability of the technique for creating functional membrane-suspended microstructures on a PCB. [2021-0226]

47 OTHER INSTRUMENTATION↗
NASA NTRS1989

Using multiple sensors for printed circuit board insertion

As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

Sood, Deepak↗
NASA NTRS1969

Design of printed circuit coils

Spiral-like coil is printed with several extra turns which increase the realizable coil inductance. Included are shorting connections which not only short the extra turns, but also short out several turns of the main body. Coil tuning is accomplished by removing the shorts until the desired inductance is obtained.

Higgins, W. T.↗
NASA NTRSDate not supplied

A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed Circuit Boards↗