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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Rollback Chip (RBC) module is computer circuit board containing special-purpose memory circuits for use in multiprocessor computer system. Designed to help realize speedup potential of parallel processing for simulation of discrete events by use of Time Warp operating system.
Individual ''fingerprint'' signals are produced when system photoexcites chips. ''Fingerprints'' are analyzed for characteristics associated with defects, including many not visible to the naked eye. Electromagnetic radiation photogenerates free electrons and holes in semiconductor chip. These carriers produce electrical signals at terminals. Signals vary depending on what defects are present.
Recent advances in the development of several micropropulsion components performed at JPL for microscpacecraft applications are reported upon.
In this paper, the near field coupling between an external hand-held loop antenna and an implantable miniature (1x1 mm) printed square spiral chip antenna used in bio-MEMS sensors for contact-less powering and RF telemetry is investigated. The loop and the spiral are inductively coupled and effectively form a transformer. The numerical results include the quasi-stationary magnetic field pattern of the implanted antenna, near zone wave impedance as a function of the radial distance and the values of the lumped elements in the equivalent circuit model for the transformer.
The Kamina, Sam and Cyranose electronic nose systems were evaluated and partially trained. Much work was performed on the Kamina as it has the ability to respond to low (less than 10 ppb) concentrations of hydrazine compounds. We were able to tell the difference between Hydrazine (Hz) and Monomethylhydrazine (MMH) in standard clean humid air. We were able to detect MMH in reduced pressure (1/3 atm) at about 250 ppb, however the training set was to far from the real situation to be useful now. Various engineering and usability aspects of both the noses was noted, especially the software. One serious physical engineering flaw was remedied in the Kamina system. A gas flow manifold was created for the Sam system. Different chips were evaluated for the Kamina system. It is still unclear if they can be exchanged without retraining the software.The Sam Detect commercial unit was evaluated for solvent detection and evaluation. It was able to successfully identify some solvents. The Cyranose, was observed and evaluated for two days. It has the ability to detect gasses in the 100 parts per million level but not the 10 parts per billion level. It is very sensitive to humidity changes; there is software to partially handle this.
Current spaceborne applications desire compact, low weight, and high capacity data storage systems along with the additional requirement of radiation tolerance. This paper discusses a memory system on a multi-chip module (MCM) that is designed for space applications.
I will discuss several processors: 1. The Cray proprietary processor used in the Cray X1; 2. The IBM Power 3 and Power 4 used in an IBM SP 3 and IBM SP 4 systems; 3. The Intel Itanium and Xeon, used in the SGI Altix systems and clusters respectively; 4. IBM System-on-a-Chip used in IBM BlueGene/L; 5. HP Alpha EV68 processor used in DOE ASCI Q cluster; 6. SPARC64 V processor, which is used in the Fujitsu PRIMEPOWER HPC2500; 7. An NEC proprietary processor, which is used in NEC SX-6/7; 8. Power 4+ processor, which is used in Hitachi SR11000; 9. NEC proprietary processor, which is used in Earth Simulator. The IBM POWER5 and Red Storm Computing Systems will also be discussed. The architectures of these processors will first be presented, followed by interconnection networks and a description of high-end computer systems based on these processors and networks. The performance of various hardware/programming model combinations will then be compared, based on latest NAS Parallel Benchmark results (MPI, OpenMP/HPF and hybrid (MPI + OpenMP). The tutorial will conclude with a discussion of general trends in the field of high performance computing, (quantum computing, DNA computing, cellular engineering, and neural networks).
A relatively inexpensive instrumentation system that includes units that are connected to thermocouples and that are parts of a radio-communication network has been developed to enable monitoring of temperatures at multiple locations. Because there is no need to string wires or cables for communication, the system is well suited for monitoring temperatures at remote locations and for applications in which frequent changes of monitored or monitoring locations are needed. The system can also be adapted to monitoring of slowly varying physical quantities, other than temperature, that can be transduced by solid-state electronic sensors. electronic sensors. The system comprises any number of transmitting units and a single receiving unit. Each transmitting unit includes connections for as many as four external thermocouples, a signal-conditioning module, a control module, and a radio-communication module. The signal-conditioning module acts as an interface between the thermocouples and the rest of the transmitting unit and includes a built-in solid ambient temperature sensor that is in addition to the external thermocouples. The control module is a system-on-chip embedded processor that includes analog-to-digital converters, serial and parallel data ports, and an interface for local connection to an analog meter that is used during installation to verify correct operation. The radio-communication module contains a commercial spread-spectrum transceiver that operates in the 900-MHz industrial, scientific, and medical (ISM) frequency band. This transceiver transmits data to the receiving unit at a rate of 19,200 baud. The receiving unit includes a transceiver like that of a transmitting unit, plus a control module that contains a system-on-chip processor that includes serial data port for output to a computer that runs monitoring and/or control software, a parallel data port for output to a printer, and a seven-segment light-emitting-diode display. Each transmitting unit is battery-powered and can operate for at least seven days continuously while reporting temperatures every half hour. The receiving unit is powered by a wall-mounted transformer source. The receiving unit responds to each transmitting unit and reports the readings of each of the four thermocouples and of the ambient-temperature sensor of the transmitting unit. The end-to-end accuracy of the system is plus or minus 0.2 C over the temperature range from 0 to 100 C. The radio-communication range between the receiving and transmitting units is approximately equal to 0.5 mile (approximately equal to 0.8 km).
A relatively inexpensive instrumentation system that includes units that are connected to thermocouples and that are parts of a radio-communication network has been developed to enable monitoring of temperatures at multiple locations. Because there is no need to string wires or cables for communication, the system is well suited for monitoring temperatures at remote locations and for applications in which frequent changes of monitored or monitoring locations are needed. The system can also be adapted to monitoring of slowly varying physical quantities, other than temperature, that can be transduced by solid-state electronic sensors. The system comprises any number of transmitting units and a single receiving unit (see figure). Each transmitting unit includes connections for as many as four external thermocouples, a signal-conditioning module, a control module, and a radio-communication module. The signal- conditioning module acts as an interface between the thermocouples and the rest of the transmitting unit and includes a built-in solid ambient-temperature sensor that is in addition to the external thermocouples. The control module is a "system-on-chip" embedded processor that includes analog-to-digital converters, serial and parallel data ports, and an interface for local connection to an analog meter that is used during installation to verify correct operation. The radio-communication module contains a commercial spread-spectrum transceiver that operates in the 900-MHz industrial, scientific, and medical (ISM) frequency band. This transceiver transmits data to the receiving unit at a rate of 19,200 baud. The receiving unit includes a transceiver like that of a transmitting unit, plus a control module that contains a system-on-chip processor that includes serial data port for output to a computer that runs monitoring and/or control software, a parallel data port for output to a printer, and a seven-segment light-emitting-diode display.
Several years ago when INTEL and China Lake designed the ETANN chip, analog VLSI appeared to be the only way to do high density neural computing. In the last five years, however, digital parallel processing chips capable of performing neural computation functions have evolved to the point of rough equality with analog chips in system level computational density. The Naval Air Warfare Center, China Lake, has developed a real time, hardware and software system designed to implement and evaluate biologically inspired retinal and cortical models. The hardware is based on the Adaptive Solutions Inc. massively parallel CNAPS system COHO boards. Each COHO board is a standard size 6U VME card featuring 256 fixed point, RISC processors running at 20 MHz in a SIMD configuration. Each COHO board has a companion board built to support a real time VSB interface to an imaging seeker, a NTSC camera, and to other COHO boards. The system is designed to have multiple SIMD machines each performing different corticomorphic functions. The system level software has been developed which allows a high level description of corticomorphic structures to be translated into the native microcode of the CNAPS chips. Corticomorphic structures are those neural structures with a form similar to that of the retina, the lateral geniculate nucleus, or the visual cortex. This real time hardware system is designed to be shrunk into a volume compatible with air launched tactical missiles. Initial versions of the software and hardware have been completed and are in the early stages of integration with a missile seeker.
Eddy current probes have been used for many years for numerous sensing applications including crack detection in metals. However, these applications have traditionally used the eddy current effect in the form of a physically wound single or different probe pairs which of necessity must be made quite large compared to microelectronics dimensions. Also, the traditional wound probe can only take a point reading, although that point might include tens of individual cracks or crack arrays; thus, conventional eddy current probes are beset by two major problems: (1) no detailed information can be obtained about the crack or crack array; and (2) for applications such as quality assurance, a vast amount of time must be taken to scan a complete surface. Laboratory efforts have been made to fabricate linear arrays of single turn probes in a thick film format on a ceramic substrate as well as in a flexible cable format; however, such efforts inherently suffer from relatively large size requirements as well as sensitivity issues. Preliminary efforts to fully extend eddy current probing from a point or single dimensional level to a two dimensional micro-eddy current format on a silicon chip, which might overcome all of the above problems, are presented.
No abstract available
This paper presents the design, fabrication and characterization of a wireless capacitive pressure sensor with directional RF chip antenna that is envisioned for the health monitoring of aircraft engines operating in harsh environments. The sensing system is characterized from room temperature (25 C) to 300 C for a pressure range from 0 to 100 psi. The wireless pressure system consists of a Clapp-type oscillator design with a capacitive MEMS pressure sensor located in the LC-tank circuit of the oscillator. Therefore, as the pressure of the aircraft engine changes, so does the output resonant frequency of the sensing system. A chip antenna is integrated to transmit the system output to a receive antenna 10 m away.The design frequency of the wireless pressure sensor is 127 MHz and a 2 increase in resonant frequency over the temperature range of 25 to 300 C from 0 to 100 psi is observed. The phase noise is less than minus 30 dBcHz at the 1 kHz offset and decreases to less than minus 80 dBcHz at 10 kHz over the entire temperature range. The RF radiation patterns for two cuts of the wireless system have been measured and show that the system is highly directional and the MEMS pressure sensor is extremely linear from 0 to 100 psi.
Single-Event Effects (SEE) testing was conducted on the nVidia Jetson TX2 System on Chip (SOC). Testing was conducted at Massachusetts General Hospital's (MGH) Francis H. Burr Proton Therapy Center on June 2nd, 2019.
A computer aided design (CAD) system that is being used at the Jet Propulsion Laboratory for the design of custom and semicustom very large scale integrated (VLSI) chips is described. The system consists of a Digital Equipment Corporation VAX computer with the UNIX operating system and a collection of software tools for the layout, simulation, and verification of microcircuits. Most of these tools were written by the academic community and are, therefore, available to JPL at little or no cost. Some small pieces of software have been written in-house in order to make all the tools interact with each other with a minimal amount of effort on the part of the designer.
A folding, multi-platform assembly has been developed for the packaging of a multi-chip microinstrumentation system. The assembly includes three solid platforms connected by flexible micromachined ribbon cables and it can be populated by sensors and electronics from a variety of technologies including surface mount and integrated circuit (IC) processes. The entire structure is fabricated from a four-inch silicon wafer using a simple four mask process and a post-process EDP etch. The micromachined ribbon cables allow the platform assembly to be folded into a three level structure with control electronics on the bottom level, microsensors and interface electronics on the second level, and sensors that need environmental access on the top level. Using the silicon multi-platform assembly, a prototype microinstrumentation system has been developed that includes a microcontroller unit and sensors for measuring temperature, barometric pressure, humidity, altitude, and acceleration as well as a telemetry device for wireless communication. When folded in the three level structure, this microsystem occupies only 5 cc and can be placed in an outer case the size of a wristwatch.
This paper presents the results of the systems level thermal modeling for a conceptual Chemical Heat Integrated Power Source (CHIPS). This proposed system offers a combined thermal and electrical power source to support survival of spacecraft operating in extreme low temperature lunar environments, without the use of radioisotope-based sources. A conceptual design study has been completed for this system, that uses heat generated by an exothermic chemical reaction in place of radioisotope or electrical heat sources. The goal of the study was to evaluate the feasibility of such as system through thermodynamic and chemical analysis and thermal modeling, and to identify technology gaps to inform a technology development and maturation plan. The specific technical objectives focused on delivery of 90-100 Wth thermal power and 30-40 We electrical power for 336 hours to a representative Commercial Lunar Payload Services (CLPS) lander, to support lunar surface survival and limited operations through a lunar night. The total system mass was targeted at ≤50 kg. A highly exothermic chemical reaction system is used to generate on-board electrical power for spacecraft systems, and thermal power to maintain critical spacecraft/lander systems within their allowable flight temperature (AFTs). Based on the very high energy content of the chemical reaction system, a much higher amount of heat per unit mass can be delivered to the spacecraft, relative to a rechargeable lithium-ion battery and electrical heater(s). Since radioisotope heaters or generators are not used, the system will be orders of magnitude lower in cost than a radioisotope heating/power unit, without the attendant regulatory complexities. As part of the CHIPS concept, a fraction of the thermal power generated is converted to electrical power via an appropriate thermal-to-electric converter technology (such as a free piston Stirling converter or a thermoelectric generator module), to provide power to critical loads. This approach is ideally suited to support operation of commercial landers (e.g., via the CLPS program). In most cases, these landers are only designed to operate during a portion of the lunar day, with no provision for survival through the lunar night. By supporting lunar night survival, a mission can be extended through the lunar night and at least into another lunar day, thus turning a nominal eight-day mission into a 36-day mission. Therefore, the current system demonstration will focus on scalability to support at least 336 hours (one lunar night) of continuous thermal and electrical power generation. Although initially targeted to support lunar equatorial landings, the technology is extensible to missions at the lunar poles, other extreme environments in the Solar System or even air-independent applications on Earth (e.g., ocean exploration).
Single-Event Effects (SEE) testing was conducted on the nVidia Jetson TX1 System on Chip (SOC); herein referred to as device under test (DUT). Testing was conducted at Massachusetts General Hospitals (MGH) Francis H. Burr Proton Therapy Center on October 16th, 2016 using 200MeV protons. This testing trip was purposed to provide a baseline assessment of the radiation susceptibility of the DUT as no previous testing had been conducted on this component.