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At least 91 records · Page 5

Effect of stitching on the strength of bonded composite single lap joints

An experimental investigation has been conducted to determine the effect of stitching on the static and fatigue failure load of bonded composite single lap joints. The variables considered in the static tests included adherend thickness, overlap length, stitch spacing, and number of rows of stitches. A limited fatigue program was conducted for one configuration to compare the fatigue life of stitched and unstitched joints. Up to a 38 percent improvement in static failure load and an order of magnitude increase in fatigue life compared with unstiffened results are obtained by a single row of stitches near the end of the overlap. Additional rows of stitching or different stitch spacing has little effect on static joint failure load. Thicker adherends and larger overlap length result in larger improvements in static failure load with stitching. Further research is needed to refine the stitching process in order to obtain the maximum improvements in joint failure load.

Sawyer, J. W.↗

Bonded joint strength - Static versus fatigue

Adhesives are commonly characterized only by their static strength even though they are used in structural joints that are subjected to fatigue loads. This paper reviews the relationship between static and fatigue strength for four different specimen types: single-lap-shear, edge-delamination, double cantilever beam, and cracked-lap-shear. It was found that the ratio of static strength to fatigue strength varied from 2.3 to 4.7, depending on the adhesive and specimen configuration.

Johnson, W. S.↗

Acousto-ultrasonics

The theoretical development, methodology, and potential applications of acousto-ultrasonic nondestructive testing are set forth in an overview to assess the effectiveness of the technique. Stochastic wave propagation is utilized to isolate and describe defects in fiber-reinforced composites, particularly emphasizing the integrated effects of diffuse populations of subcritical flaws. The generation and nature of acousto-ultrasonic signals are described in detail, and stress-wave factor analysis of the signals is discussed. Applications of acousto-ultrasonics are listed including the prediction of failure sites, assessing fatique and impact damage, calculating ultimate tensile strength, and determining interlaminar bond strength. The method can identify subtle but important variations in fiber-reinforced composites, and development of the related instrumentation technology is emphasized.

Vary, Alex↗

Computational Simulation Of Fiber-Pushout Tests

Computational procedure to simulate fiber-pushout tests developed. Step-by-step procedures to perform computational simulation, establish bounds of interfacial bond strength, and interpret interfacial bond quality described. Simulation involves three-dimensional finite-element model.

Mital, Subodh K.↗

Induction Bonding of Prepreg Tape and Titanium Foil

Hybrid structural laminates made of titanium foil and carbon fiber reinforced polymer composite offer a potential for improved performance in aircraft structural applications. To obtain information needed for the automated fabrication of hybrid laminates, a series of bench scale tests were conducted of the magnetic induction bonding of titanium foil and thermoplastic prepreg tape. Foil and prepreg specimens were placed in the gap of a toroid magnet mounted in a bench press. Several magnet power supplies were used to study power at levels from 0.5 to 1.75 kW and frequencies from 50 to 120 kHz. Sol-gel surface-treated titanium foil, 0.0125 cm thick, and PIXA/IM7 prepreg tape were used in several lay-up configurations. Data were obtained on wedge peel bond strength, heating rate, and temperature ramp over a range of magnet power levels and frequencies at different "power-on" times for several magnet gap dimensions. These data will be utilized in assessing the potential for automated processing. Peel strengths of foil-tape bonds depended on the maximum temperature reached during heating and on the applied pressure. Maximum peel strengths were achieved at 1.25kW and 8OkHz. Induction heating of the foil appears to be capable of good bonding up to 10 plies of tape. Heat transfer calculations indicate that a 20-40 C temperature difference exists across the tape thickness during heat-up.

Messier, Bernadette C.↗

Investigation of Test Methods, Material Properties, and Processes for Solar Cell Encapsulants

During this quarter the technical activities were directed toward the reformulation of ethylene/vinyl acetate copolymer for use as a compound in solar cell module fabrication. Successful formulations were devised that lowered the temperature required for cure and raised the gel content. A major volatile component was also eliminated (acrylate crosslinking agent) which should aid in the production of bubble free laminates. Adhesive strengths and primers for the bonding of ethylene/vinyl acetate to supersyrate and substrate materials was assessed with encouraging results. The incorporation of silane compounds gave high bond strengths. A survey of scrim materials was also conducted.

Source record↗

Surface analysis in composite bonding

The role of the interfacial region in determining the bond strength and durability of composite bonds is discussed. The characterization of a variety of carbon fibers including Celion 6000 using both scanning electron microscopy and X-ray photoelectron spectroscopy is discussed. The emphasis is on composite bonding, that is, the adhesive bonding between composites in contrast to fiber-matrix interaction. The primary objective of the research is the characterization of composite surfaces before adhesive bonding and after fracture of bonded specimens. Work done on the analysis of composite samples pretreated in a number of ways prior to bonding is detailed.

Messick, D. L.↗

A critical study of the role of the surface oxide layer in titanium bonding

Scanning electron microscope/X-ray photoelectron spectroscopy (SEM/XPS) analysis of fractured adhesively bonded Ti 6-4 samples is discussed. The text adhesives incuded NR 056X polyimide, polypheylquinoxaline (PPQ), and LARC-13 polyimide. Differentiation between cohesive and interfacial failure was based on the absence of presence of a Ti 2p XPS photopeak. In addition, the surface oxide layer on Ti-(6A1-4V) adherends is characterized and bond strength and durability are addressed. Bond durability in various environmental conditions is discussed.

Dias, S.↗

Rapid adhesive bonding of advanced composites and titanium

Rapid adhesive bonding (RAB) concepts utilize a toroid induction technique to heat the adhesive bond line directly. This technique was used to bond titanium overlap shear specimens with 3 advanced thermoplastic adhesives and APC-2 (graphite/PEEK) composites with PEEK film. Bond strengths equivalent to standard heated-platen press bonds were produced with large reductions in process time. RAB produced very strong bonds in APC-2 adherend specimens; the APC-2 adherends were highly resistant to delamination. Thermal cycling did not significantly affect the shear strengths of RAB titanium bonds with polyimide adhesives. A simple ultrasonic non-destructive evaluation process was found promising for evaluating bond quality.

Stein, B. A.↗

The Evaluation of High Temperature Adhesive Bonding Processes for Rocket Engine Combustion Chamber Applications

NASA Glenn Research Center is currently evaluating the possibility of using high- temperature polymer matrix composites to reinforce the combustion chamber of a rocket engine. One potential design utilizes a honeycomb structure composed of a PMR-II- 50/M40J 4HS composite facesheet and titanium honeycomb core to reinforce a stainless steel shell. In order to properly fabricate this structure, adhesive bond PMR-II-50 composite. Proper prebond surface preparation is critical in order to obtain an acceptable adhesive bond. Improperly treated surfaces will exhibit decreased bond strength and durability, especially in metallic bonds where interface are susceptible to degradation due to heat and moisture. Most treatments for titanium and stainless steel alloys require the use of strong chemicals to etch and clean the surface. This processes are difficult to perform due to limited processing facilities as well as safety and environmental risks and they do not consistently yield optimum bond durability. Boeing Phantom Works previously developed sol-gel surface preparations for titanium alloys using a PETI-5 based polyimide adhesive. In support of part of NASA Glenn Research Center, UDRI and Boeing Phantom Works evaluated variations of this high temperature sol-gel surface preparation, primer type, and primer cure conditions on the adhesion performance of titanium and stainless steel using Cytec FM 680-1 polyimide adhesive. It was also found that a modified cure cycle of the FM 680-1 adhesive, i.e., 4 hrs at 370 F in vacuum + post cure, significantly increased the adhesion strength compared to the manufacturer's suggested cure cycle. In addition, the surface preparation of the PMR-II-50 composite was evaluated in terms of surface cleanness and roughness. This presentation will discuss the results of strength and durability testing conducted on titanium, stainless steel, and PMR-II-50 composite adherends to evaluate possible bonding processes.

McCray, Daniel↗

Hydroxide-Assisted Bonding of Ultra-Low-Expansion Glass

A process for hydroxide-assisted bonding has been developed as a means of joining optical components made of ultra-low-expansion (ULE) glass, while maintaining sufficiently precise alignment between. The process is intended mainly for use in applications in which (1) bonding of glass optical components by use of epoxy does not enable attainment of the required accuracy and dimensional stability and (2) conventional optical contacting (which affords the required accuracy and stability) does not afford adequate bond strength. The basic concept of hydroxide-assisted bonding is not new. The development of the present process was prompted by two considerations: (1) The expertise in hydroxide-assisted bonding has resided in very few places and the experts have not been willing to reveal the details of their processes and (2) data on the reliability and strength attainable by hydroxide-assisted bonding have been scarce.

Abramovici, Alexander↗

Investigation of the feasibility of developing low permeability polymeric films

The feasibility of reducing the gas permeability rate of Mylar and Kapton films without drastically effecting their flexibility characteristics at cryogenic temperatures was considered. This feasibility was established using a concept of diffusion bonding two layers of metallized films together forming a film-metal-film sandwich laminate. The permeability of kapton film to gaseous helium was reduced from a nominal ten = to the minus 9 power cc-mm/sq cm sec. cm Hg to ten to the minus 13 power cc-mm/ sq cm - sec. cm Hg with some values as low as ten to the minus 15 power cc - mm/sq cm m-sec - cm Hg being obtained. Similar reductions occurred in the liquid hydrogen permeability at -252 C. In the course of the program the permeability, flexibility and bond strength of plain, metalized and diffusion bond film were determined at +25 C, -195 C and -252 C. The cryogenic flexibility of Kapton film was reduced slightly due to the metallization process but no additional loss in flexibility resulted from the diffusion bonding process.

Hoggatt, J. T.↗

Investigation of interfacial shear strength in a SiC fibre/Ti-24Al-11Nb composite by a fibre push-out technique

A fiber push-out technique applied at several sample thicknesses was used to determine both the debond shear stress and the frictional shear stress at the fiber-matrix interface at room temperautre for a unidirectional SiC fiber-reinforced T-24Al-11Nb (in at. pct) composite prepared by a powder cloth technique. The push-out technique measures the separate contributions of bond strength and friction to the mechanical shear strength at the fiber-matrix interface. It was found that the fiber-matrix bond shear strength of this material is significantly higher than the fiber-matrix frictional shear stress (119.2 and 47.8 MPa, respectively).

Eldridge, J. I.↗

TAB interconnects for space concentrator solar cell arrays

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Avery, J.↗

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

Adherend surfaces and fractography were studied using electron spectroscopy for chemical analysis and scanning electron microscopy/energy dispersive analysis of X-rays. In addition, Auger Electron Spectroscopy with depth profiling capability was used. It is shown that contamination of adhesion systems plays an important role not only in determining initial bond strengths but also in the durability of adhesive bonds. It is concluded that the analytical techniques used to characterize and monitor such contamination.

Chen, W.↗