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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

Channel Temperature Determination for AlGaN/GaN HEMTs on SiC and Sapphire

Numerical simulation results (with emphasis on channel temperature) for a single gate AlGaN/GaN High Electron Mobility Transistor (HEMT) with either a sapphire or SiC substrate are presented. The static I-V characteristics, with concomitant channel temperatures (T(sub ch)) are calculated using the software package ATLAS, from Silvaco, Inc. An in-depth study of analytical (and previous numerical) methods for the determination of T(sub ch) in both single and multiple gate devices is also included. We develop a method for calculating T(sub ch) for the single gate device with the temperature dependence of the thermal conductivity of all material layers included. We also present a new method for determining the temperature on each gate in a multi-gate array. These models are compared with experimental results, and show good agreement. We demonstrate that one may obtain the channel temperature within an accuracy of +/-10 C in some cases. Comparisons between different approaches are given to show the limits, sensitivities, and needed approximations, for reasonable agreement with measurements.

Freeman, Jon C.↗
NASA NTRS2008

Compact, Single-Stage MMIC InP HEMT Amplifier

A monolithic micro - wave integrated-circuit (MMIC) singlestage amplifier containing an InP-based high-electron-mobility transistor (HEMT) plus coplanar-waveguide (CPW) transmission lines for impedance matching and input and output coupling, all in a highly miniaturized layout as needed for high performance at operating frequencies of hundreds of gigahertz is described.

Pukala, David↗
NASA NTRS2019

A 220-GHz InP HEMT Direct Detection Polarimeter

In this article, a 220-GHz direct detection polarimetric receiver is reported. This polarimetric receiver is intended for sensing of the microphysical properties of cloud ice in the earth's upper atmosphere. In the article, we report the measured RF performance, including RF gain of approximately 35 dB per channel and integrated noise figure of the receiver. The noise figure is measured to be 5.1 dB for the horizontally polarized channel and 5.4 dB for the vertically polarized channel. The receiver measures only 1.8 cm × 3.0 cm × 6.4 cm and has a total regulated dc power consumption of 520 mW. This article represents the first 220-GHz polarimetric direct detection receiver and is enabled by an advanced 25-nm indium phosphide (InP) HEMT monolithic microwave integrated circuit (MMIC) technology.

Indium phosphide (InP)↗
NASA NTRSDate not supplied

Demonstration of GaN HEMT MMIC High-Power Amplifier for Lunar Proximity Communications

In this paper, we demonstrate a Ka-band high power, high efficiency, GaN HEMT MMIC based power amplifier for communications from the lunar orbit to lunar surface. The measured results include Pout, Gain, PAE, RMS EVM for Offset-QPSK, 8PSK, 16APSK, and 32APSK waveforms, 3rd-order IMD products, noise figure, and phase noise.

Ka-band↗
NASA NTRS2024

Demonstration of GaN HEMT MMIC High-Power Amplifier for Lunar Proximity Communications

In this paper, we demonstrate a high efficiency, Ka-band (23.15 to 23.55 GHz) GaN HEMT MMIC based single-ended high power amplifier (HPA). The measured Pout, Gain, PAE, RMS EVM for Offset-QPSK, 8PSK, 16APSK, and 32APSK waveforms, 3rd-order IMD products, noise figure, and phase noise are presented. The results indicate that the saturated output power (P sat ) and the small signal Gain are on the order of 38.8 dBm (7.6 W) and 29.3 dB, respectively. The PAE at Psat is 20.0%. At the 1-dB compression point, the RMS EVM and the out-of-band spectral regrowth are less than 6% and –26 dBc respectively, for all four waveforms. Additionally, the spectrum is in compliance with the NTIA mask requirements for all four waveforms. The output 3rd-order intercept point (OIP3) is on the order of 42 dBm. The noise figure is less than 9.5 dB. The SSB phase noise spectral density is compliant with the envelope defined by the MIL-STD-188-164C. The HPA can enable proximity forward links between the orbiting Gateway/relay satellites and the lunar surface elements and cross links between relay satellites.

Ka-band↗
NASA NTRS2003

MMIC HEMT radiometry

Explore the source record for details and available documents.

MMIC HEMT radiometry↗
NASA NTRSDate not supplied

Amplifier Output Power, Gain, Efficiency, and Bandwidth: A Comparative Study of GaN HEMT MMIC Multi-Stage Power Amplifiers versus Distributed Power Amplifiers

In this paper we present first, the results of a study conducted to investigate the microwave performance of a wideband (25-31 GHz) GaN MMIC distributed high power amplifier (HPA). Second, we compare and contrast the above performance with that of an alternate architecture that relies on two HPAs to provide contiguous 25-31 GHz coverage. The two HPAs operate across 25-28 GHz and 27-31 GHz, respectively, and can be switched in and out depending on the need at any given time. The parameters investigated includes the output power, gain, power added efficiency, bandwidth, RMS error vector magnitude for offset-QPSK, 8PSK, 16APSK, and 32 APSK waveforms, 3rd-order intermodulation distortion products, noise figure, and single sideband phase noise.

MMIC↗
DOE OSTI2025

Reduced thermal resistance of Al-rich AlGaN HEMTs via top-side diamond integration

We report back-end-of-line growth of nanocrystalline diamond (NCD) on ultrawide bandgap (UWBG) high Al content aluminum gallium nitride (AlGaN) channel high electron mobility transistors for thermal management. A thin (∼15 nm) silicon nitride (SiN x ) interlayer was deposited to protect the device surface before performing a low temperature (500 °C) NCD growth process in an attempt to protect the gates on these fully fabricated devices. Notably, atomic force microscopy showed that the maximum lateral grain size exceeded 300 nm even though the film thickness was ∼250 nm. Comparing electrical (DC) performance before and after NCD growth, the gate leakage increased by ∼10 2 after NCD growth. Despite the lower NCD growth temperature, intermixing of the Ni and Au was observed in the Schottky gate metal stack; however, we believe there is another mechanism, possibly hydrogen-related, that is responsible for the measured increase in gate leakage. Regarding thermal management, the device-level thermal resistance (quantified using the average gate temperature rise measured by thermoreflectance imaging) was reduced by 29% through the incorporation of the top-side diamond film. Using time-domain thermoreflectance, the thermal conductivity of the ≈250 nm thick NCD film was measured to be 45 ± 25 W m −1 K −1 . This is expected to be at least 5× greater than the thermal conductivity of the thin disordered AlGaN alloy. There could also be a coupled electrothermal component contributing to the reduced temperature rise from electric field spreading and consequent heat spreading. This study demonstrates a promising first step toward device-level thermal management of high power UWBG Al-rich AlGaN devices.

Lundh, James Spencer [U.S. Naval Research Laborato↗
DOE OSTI2020

Quantifying Dynamic On-State Resistance of GaN HEMTs for Power Converter Design via a Survey of Low and High Voltage Devices

Designing and optimizing high switching frequency, ultra-efficient converters requires detailed knowledge of the behavior and parasitic parameters for both active and passive components. Recently, wide bandgap transistors have enabled simultaneous increases in both switching frequency and efficiency due to higher maximum operating junction temperature limits, lower dc on-state resistances, and reduced parasitic inductances and capacitances. Yet, the early acceptance of gallium-nitride (GaN) switches was plagued by detrimental dynamic on-state resistance effects. This complex phenomenon for GaN devices is characterized by deviations in on-state resistance from dc operating characteristics based on design choices such as the magnitude and duration of both voltage and current stress, switching mode, and junction temperature. While device manufacturers have made improvements compared to early generation devices, experimental evidence from a survey of commercial GaN transistors highlight measurable change in on-state resistance still exists due to variations in voltage stress during hard-switching operation. After sharing insights for obtaining low noise measurements, an analysis method along with two metrics are proposed to characterize dynamic on-state resistance measurements for power electronics designers. Furthermore, quantifying the performance of GaN devices with standardized metrics facilitates a fair comparison between different GaN device technologies during converter development, enables manufacturing qualification for GaN switches, and provides a benchmark to catalyze improvement for the next generation of GaN device development.

14 SOLAR ENERGY↗