NASA NTRS · 20210003316
A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-based HEMT
Abstract
We report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds.
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Martin, S., Fitzsimmons, M., Ksendzov, A., Smith, R., Gaier, T., Pinsukanjana, P., Samoska, L.. 1999-10-17. A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-based HEMT. https://ntrs.nasa.gov/citations/20210003316
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