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DOE OSTI2026

MIP dQ/dx Calibration in DUNE ND-LAr Prototypes with Pixelated Charge Readout

The Deep Underground Neutrino Experiment (DUNE) will be a next-generation long baseline neutrino oscillation experiment that will employ LArTPC technology in a near detector placed at Fermilab and a far detector at the Sanford Underground Research Facility, at a baseline of 1300 km. The DUNE Liquid Argon Near Detector (ND-LAr) design takes into account the high neutrino intensity expected from the beam at the Long-Baseline Neutrino Facility (LBNF): 35 modules, each containing two optically separated time projection chambers, are instrumented with a pixel-based, true 3D charge readout alongside scintillation light traps to disentangle the O(100) interactions expected per 10us beam spill. A robust prototyping program supports ND-LAr’s design: the 2x2 Demonstrator consists of four scaled-down ND-LAr modules exposed to the NuMI beam at Fermilab, and the Full Scale Demonstrator (FSD) is a single ND-LAr module tested with cosmic rays at the University of Bern. We present here an analysis of minimum ionizing particle (MIP) tracks selected from 2x2 beam data and FSD cosmic ray data used to benchmark the pixel-based charge readout simulation and calibration in both detectors, with the ultimate goal of validating the design of DUNE ND-LAr as well as informing future calibration methods. This poster will showcase the dependence of the charge response on track inclination as well as a per-pixel dQ/dX extraction.

Mandujano, Roberto [UC, Irvine]↗

DOE OSTI2022

Tunable infrared pixels having unpatterned graphene layer and conductive metasurface

A monolithically integrated, tunable infrared pixel comprises a combined broadband detector and graphene-enabled tunable metasurface filter that operate as a single solid-state device with no moving parts. Functionally, tunability results from the plasmonic properties of graphene that are acutely dependent upon the carrier concentration within the infrared. Voltage induced changes in graphene's carrier concentration can be leveraged to change the metasurface filter's transmission thereby altering the “colors” of light reaching the broadband detector and hence its spectral responsivity. The invention enables spectrally agile infrared detection with independent pixel-to-pixel spectral tunability.

Beechem, III, Thomas Edwin↗

DOE OSTI2024

Intelligent Pixel Detectors: Towards a Radiation Hard ASIC with On-Chip Machine Learning in 28 nm CMOS

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout channels. With event rates as high as 40 MHz, these detectors will generate petabytes of data per second. To enable discovery within strict bandwidth and latency constraints, future trackers must be capable of fast, power efficient, and radiation hard data-reduction at the source. We are developing a radiation hard readout integrated circuit (ROIC) in 28nm CMOS with on-chip machine learning (ML) for future intelligent pixel detectors. We will show track parameter predictions using a neural network within a single layer of silicon and hardware tests on the first tape-outs produced with TSMC. Preliminary results indicate that reading out featurized clusters from particles above a modest momentum threshold could enable using pixel information at 40 MHz.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2024

Pixelated, large active area scintillating screens

A pixelated X-ray conversion screen includes a metal aperture sheet having a pixel hole filled with a scintillator material, wherein an area of the pixel hole is equal to or less than about 0.25 mm 2 .

Wiggins, Brenden W.↗

DOE OSTI2026

Evaluation of 3D pixel silicon sensors for the CMS Phase-2 Inner Tracker

The high-luminosity upgrade of the CERN LHC requires the replacement of the CMS tracking detector to cope with the increased radiation fluence while maintaining its excellent performance. An extensive R&D program, aiming at using 3D pixel silicon sensors in the innermost barrel layer of the detector, has been carried out by CMS in collaboration with the FBK (Trento, Italy) and CNM (Barcelona, Spain) foundries. The sensors will feature a pixel cell size of 25 × 100 µm 2 , with a centrally located electrode connected to the readout chip. The sensors are read out by the RD53A and CROCv1 chips, developed in 65 nm CMOS technology by the RD53 Collaboration, a joint effort between the ATLAS and CMS groups. This paper reports the results achieved in beam test experiments before and after irradiation, up to a fluence of approximately 2 . 6 × 1 0 16 n eq /cm 2 . Measurements of assemblies irradiated to a fluence of 1 × 10 16 n˙eq/cm 2 show a hit detection efficiency higher than 96% at normal incidence, with fewer than 2% of channels masked, across a bias voltage range greater than 50 V . Even after irradiation to a higher fluence of 1.6 × 10 16 n˙eq/cm 2 , similar performance is maintained over a bias voltage range of 30 V , remaining well within CMS requirements.

3D pixel↗

DOE OSTI2025

A 28 nm multiply-accumulate ASIC architecture for on-chip data compression in MHz frame rate X-ray and electron pixel detectors

Modern X-ray detector systems urgently require compact, efficient, and fast data compression schemes to handle the transmission of big data from pixel arrays, enabling frame rates in the MHz regime. Here, in this work, a data compression ASIC that implements a streaming fixed-length lossy compression scheme is introduced and analyzed, proving the feasibility and benefits of on-chip compression. The compression scheme utilizes a vector matrix product logic, which performs a number of floating-point multiplications, additions, and accumulations. The logic is verified, synthesized, and shown to fit in the area resource available for the X-ray detector under study, which comprises 192 × 168 pixels each of 12-bit width, and having a total area of 20 mm× 20 mm, about 2 mm× 20 mm of which are available for the digital logic. Several system architectures, precisions, and compression ratios ranging from 100 to 250 were analyzed to pave the way for on-chip fixed-length compression (e.g., principal component analysis, singular value decomposition) and data reduction (e.g., azimuthal integration) for X-ray and electron detectors.

Data compression↗

DOE OSTI2024

Anti-distortion bioinspired camera with an inhomogeneous photo-pixel array

The bioinspired camera, comprising a single lens and a curved image sensor—a photodiode array on a curved surface—, was born of flexible electronics. Its economical build lends itself well to space-constrained machine vision applications. The curved sensor, much akin to the retina, helps image focusing, but the curvature also creates a problem of image distortion, which can undermine machine vision tasks such as object recognition. Here we report an anti-distortion single-lens camera, where 4096 silicon photodiodes arrayed on a curved surface in a nonuniform pattern assimilated to the distorting optics are the key to anti-distortion engineering. That is, the photo-pixel distribution pattern itself is warped in the same manner as images are warped, which correctively reverses distortion. Acquired images feature no appreciable distortion across a 120° horizontal view, as confirmed by their neural-network recognition accuracies. This distortion correction via photo-pixel array reconfiguration is a form of in-sensor computing.

77 NANOSCIENCE AND NANOTECHNOLOGY↗

DOE OSTI2022

Robotic four-dimensional pixel assembly of van der Waals solids

Van der Waals (vdW) solids can be engineered with atomically precise vertical composition through the assembly of layered two-dimensional materials. However, the artisanal assembly of structures from micromechanically exfoliated flakes is not compatible with scalable and rapid manufacturing. Further engineering of vdW solids requires precisely designed and controlled composition over all three spatial dimensions and interlayer rotation. Here, we report a robotic four-dimensional pixel assembly method for manufacturing vdW solids with unprecedented speed, deliberate design, large area and angle control. We used the robotic assembly of prepatterned 'pixels' made from atomically thin two-dimensional components. Wafer-scale two-dimensional material films were grown, patterned through a clean, contact-free process and assembled using engineered adhesive stamps actuated by a high-vacuum robot. We fabricated vdW solids with up to 80 individual layers, consisting of 100 x 100 μm 2 areas with predesigned patterned shapes, laterally/vertically programmed composition and controlled interlayer angle. This enabled efficient optical spectroscopic assays of the vdW solids, revealing new excitonic and absorbance layer dependencies in MoS 2 . Furthermore, we fabricated twisted $N$-layer assemblies, where we observed atomic reconstruction of twisted four-layer WS 2 at high interlayer twist angles of >= 4°. In conclusion, our method enables the rapid manufacturing of atomically resolved quantum materials, which could help realize the full potential of vdW heterostructures as a platform for novel physics and advanced electronic technologies.

42 ENGINEERING↗

DOE OSTI2021

Effects of overlapping sources on cosmic shear estimation: Statistical sensitivity and pixel-noise bias

The next generation of dark-energy imaging surveys — so called “Stage-IV” surveys, such as that of the Rubin Observatory Legacy Survey of Space and Time (LSST) — will cross a threshold in the number density of detected sources on the sky that requires qualitatively different image analysis and measurement techniques compared to the current generation of Stage-III surveys. In Stage-IV surveys, a significant amount of the cosmologically useful information is due to sources whose images overlap with those of other sources on the sky. Here, we focus on the weak gravitational lensing probe, for which we expect the largest impact since the cosmic shear signal is primarily encoded in the estimated shapes of observed galaxies and thus directly impacted by overlaps. We introduce a framework based on the Fisher formalism to analyze the effect of the overlapping sources (“blending”) on the estimation of cosmic shear. This method gives concrete predictions for the minimum loss of information due to noise and blending for any choice of “deblending” scheme and shape-measurement algorithm. Our studies account for undetected sources but do not address their full effects and biases they may introduce. We use simulated images and predict this impact of blending for three surveys: the Dark Energy Survey (DES), the Hyper-Suprime Cam Subaru Strategic Program (HSC-SSP), and the Rubin LSST. Our methodology successfully estimates the statistical sensitivity to weak lensing for DES and HSC early results. For LSST, we present the expected loss in statistical sensitivity for the ten-year survey due to blending. We find that for approximately 62% of galaxies that are likely to be detected in full-depth LSST images, at least 1% of the flux in their pixels is from overlapping sources. We also find that the statistical correlations between measures of overlapping galaxies and, to a much lesser extent (0.2%) the higher shot noise level due to their presence, decrease the effective number density of galaxies, N eff , by ~ 18%. We calculate an upper limit on N eff of 39.4 galaxies per arcmin 2 in r band. We study the impact of stars on as a function of stellar density and illustrate the diminishing returns of extending the survey into lower Galactic latitudes. We extend the simulation-based Fisher formalism to predict the expected increase in pixel-noise bias due to blending for maximum-likelihood (ML) shape estimators. We find that noise bias depends sensitively on the particular shape estimator and measure of ensemble-average shape that is used, and properties of the galaxy that include redshift-dependent quantities such as size and luminosity. The source code for these studies is available online.[The documented software developed for the catalog-level studies are available in the open-source LSST DESC github repository https://github.com/LSSTDESC/WeakLensingDeblending. The software for analyzing one or two galaxies with user-defined parameters is in the open-source github repository https://github.com/ismael-mendoza/ShapeMeasurementFisherFormalism.]

79 ASTRONOMY AND ASTROPHYSICS↗

DOE OSTI2023

Conceptual study of a two-layer silicon pixel detector to tag the passage of muons from cosmic sources through quantum processors

Abstract Recent studies in quantum computing have shown that quantum error correction with large numbers of physical qubits are limited by ionizing radiation from high-energy particles. Depending on the physical setup of the quantum processor, the contribution of muons from cosmic sources can constitute a significant fraction of these interactions. As most of these muons are difficult to stop, we perform a conceptual study of a two-layer silicon pixel detector to tag their hits on a solid-state quantum processor instead. With a typical dilution refrigerator geometry model, we find that efficiencies greater than 50% are most likely to be achieved if at least one of the layers is operated at the deep-cryogenic (<1 K) flanges of the refrigerator. Following this finding, we further propose a novel research program that could allow the development of silicon pixel detectors that are fast enough to provide input to quantum error correction algorithms, can operate at deep-cryogenic temperatures, and have very low power consumption.

Instruments & Instrumentation↗

DOE OSTI2025

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L↗

DOE OSTI2025

High-energy X-ray imaging with a Germanium MM-PAD hybrid pixel detector

Germanium is a high-Z sensor material with excellent energy resolution and attractive properties for high-energy photon detection. Despite its advantages, the need for cryogenic operation and challenges in the fabrication of pixelated high-purity germanium have hindered the development of segmented detectors. We report on the fabrication and performance of a germanium imaging detector with 150 μm pixel pitch hybridized to the MM-PAD ASIC. The detector was capable of high-resolution radiographic imaging and has a fast temporal response. Additionally, we describe the detector's upper operating temperature limits using both the MM-PAD and MARS ASICs, achieving stable operation up to 130 K and 190 K, respectively.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2021

2021 GeoAI Workshop Report: The Trillion Pixel Challenge

The convergence of geospatial big data with advancements from artificial intelligence, cloud infrastructure, and high-performance computing continues to revolutionize mapping and analysis of Earth's surface in unprecedented detail. Rapid innovations in sensing technologies will soon collect geospatial data in even higher resolution and throughput. These developments offer the potential for breakthroughs in science, policy, and national security via end-to-end GeoAI systems that can provide fresh insights into how humans occupy and alter their environment over time. At the 2021 GeoAI Trillion Pixel workshop, international subject matter experts from government, academia, industry, and nonprofit organizations gathered virtually to discuss the Trillion Pixel GeoAI Challenge. The event focused on six major themes currently influencing scientific innovation and breakthroughs. Particular focus was paid to societal impacts. As an additional takeaway message, the gathering identified remaining application gaps and challenges that are in need of stronger community partnerships and collaborations.

58 GEOSCIENCES↗

DOE OSTI2023

A self-certifying FPGA based pixel readout chip test system for CMS ETL upgrade

A flexible self-certifying pixel readout test system for testing the Endcap Timing Read-Out Chip (ETROC) has been developed for the CMS MIP Timing Detector (MTD), part of the upgrade for the HL-LHC. The system includes an FPGA-based (Xilinx KC705) test system that can take data from an emulator or up to four ETROC boards in telescope mode. A python based DAQ system simplifies configuration, calibration, and testing of the chips. The system provides an efficient & reliable solution for testing ETROC (ETROC2 since April 2023 with 16x16 pixels, full-size, full functionality prototype) and can be extended to other readout chips with similar architecture (AIDA integration is currently being explored).

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

DOE OSTI2023

Smart Pixels: towards on-sensor inference of charged particle track parameters and uncertainties

The combinatorics of track seeding has long been a computational bottleneck for triggering and offline computing in High Energy Physics (HEP), and remains so for the HL-LHC. Next-generation pixel sensors will be sufficiently fine-grained to determine angular information of the charged particle passing through from pixel-cluster properties. This detector technology immediately improves the situation for offline tracking, but any major improvements in physics reach are unrealized since they are dominated by lowest-level hardware trigger acceptance. We will demonstrate track angle and hit position prediction, including errors, using a mixture density network within a single layer of silicon as well as the progress towards and status of implementing the neural network in hardware on both FPGAs and ASICs.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

DOE OSTI2024

Smart Pixel Sensors for the HL-LHC

Large-scale particle physics experiments produce tens of terabytes of data every second. Innovative methods to manage the data rate at the HL-LHC, which expects to operate at 10x the luminosity of what the LHC was initially designed for, are needed. AI-on the chip provides a way to intelligently filter out low momentum clusters in the pixel detector. This will open up an opportunity to use the pixel detector for the first time in the CMS Level-1 trigger, and lead to increased sensitivity to new physics measurements and searches. We have taped out our first chip, which incorporates a $p_T$ filtering algorithm on an ASIC chip. Our initial $p_T$ filtering algorithm considers clusters that are tracked by CMS. We will report on ongoing studies seeking to enhance the performance of our filter by utilizing unsupervised learning on untracked clusters, thus increasing background rejection.

43 PARTICLE ACCELERATORS↗

DOE OSTI2020

Dynamically Reconfigurable Data Readout of Pixel Detectors for Automatic Synchronization with Data Acquisition Systems

Reconfigurable detectors with dynamically selectable sensing and readout modes are highly desirable for implementing edge computing as well as enabling advanced imaging techniques such as foveation. The concept of a camera system capable of simultaneous passive imaging and dynamic ranging in different regions of the detector is presented. Such an adaptive-autonomous detector with both spatial and temporal control requires programmable window of exposure (time frames), ability to switch between readout modes such as full-frame imaging and zero-suppressed data, modification of the number of pixel data bits and independent programmability for distinct detector regions. In this work, a method is presented for seamlessly changing time frames and readout modes without data corruption while still ensuring that the data acquisition system (DAQ) does not need to stop and resynchronize at each change of setting, thus avoiding significant dead time. Data throughput is maximized by using a minimum unique data format, rather than lengthy frame headers, to differentiate between consecutive frames. A data control and transmitter (DCT) synchronizes data transfer from the pixel to the periphery, reconfigures the data to transmit it serially off-chip, while providing optimized decision support based on a DAQ definable mode. Measurements on a test structure demonstrate that the DCT can operate at 1 GHz in a 65 nm LP CMOS process.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗