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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Radio frequency telemetry system for sensors and actuators

The present invention discloses and teaches apparatus for combining Radio Frequency (RF) technology with novel micro-inductor antennas and signal processing circuits for RF telemetry of real time, measured data, from microelectromechanical system (MEMS) sensors, through electromagnetic coupling with a remote powering/receiving device. Such technology has many applications, but is especially useful in the biomedical area.

Simons, Rainee N.↗
DOE OSTI2020

Iterative Learning Control for Video-rate Atomic Force Microscopy

We present a control scheme for video-rate atomic force microscopy with rosette pattern. The controller structure involves a feedback internal-model-based controller and a feedforward iterative learning controller. The iterative learning controller is designed to improve tracking performance of the feedback-controlled scanner by rejecting the repetitive disturbances arising from the system nonlinearities. We investigate the performance of two inversion techniques for constructing the learning filter. We conduct tracking experiments using a two-degree-of-freedom microelectromechanical system (MEMS) nanopositioner at frame rates ranging from 5 to 20 frames per second. Furthermore, the results reveal that the algorithm converges rapidly and the iterative learning controller significantly reduces both the transient and steady-state tracking errors. We acquire and report a series of high-resolution time-lapsed video-rate AFM images with the rosette pattern.

42 ENGINEERING↗
NASA NTRS2006

IMU/GPS System Provides Position and Attitude Data

A special navigation system is being developed to provide high-quality information on the position and attitude of a moving platform (an aircraft or spacecraft), for use in pointing and stabilization of a hyperspectral remote-sensing system carried aboard the platform. The system also serves to enable synchronization and interpretation of readouts of all onboard sensors. The heart of the system is a commercially available unit, small enough to be held in one hand, that contains an integral combination of an inertial measurement unit (IMU) of the microelectromechanical systems (MEMS) type, Global Positioning System (GPS) receivers, a differential GPS subsystem, and ancillary data-processing subsystems. The system utilizes GPS carrier-phase measurements to generate time data plus highly accurate and continuous data on the position, attitude, rotation, and acceleration of the platform. Relative to prior navigation systems based on IMU and GPS subsystems, this system is smaller, is less expensive, and performs better. Optionally, the system can easily be connected to a laptop computer for demonstration and evaluation. In addition to airborne and spaceborne remote-sensing applications, there are numerous potential terrestrial sensing, measurement, and navigation applications in diverse endeavors that include forestry, environmental monitoring, agriculture, mining, and robotics.

Lin, Ching Fang↗
NASA NTRS2010

Wavefront Correction for Large, Flexible Antenna Reflector

A wavefront-correction system has been proposed as part of an outer-space radio communication system that would include a large, somewhat flexible main reflector antenna, a smaller subreflector antenna, and a small array feed at the focal plane of these two reflector antennas. Part of the wavefront-correction system would reside in the subreflector, which would be a planar patch-element reflectarray antenna in which the phase shifts of the patch antenna elements would be controlled via microelectromechanical systems (MEMS) radio -frequency (RF) switches. The system would include the following sensing-and-computing subsystems: a) An optical photogrammetric subsystem built around two cameras would estimate geometric distortions of the main reflector; b) A second subsystem would estimate wavefront distortions from amplitudes and phases of signals received by the array feed elements; and c) A third subsystem, built around small probes on the subreflector plane, would estimate wavefront distortions from differences among phases of signals received by the probes. The distortion estimates from the three subsystems would be processed to generate control signals to be fed to the MEMS RF switches to correct for the distortions, thereby enabling collimation and aiming of the received or transmitted radio beam to the required precision.

Imbriale, William A.↗
NASA NTRS2008

Aerospace Sensor Systems: From Sensor Development To Vehicle Application

This paper presents an overview of years of sensor system development and application for aerospace systems. The emphasis of this work is on developing advanced capabilities for measurement and control of aeropropulsion and crew vehicle systems as well as monitoring the safety of those systems. Specific areas of work include chemical species sensors, thin film thermocouples and strain gages, heat flux gages, fuel gages, SiC based electronic devices and sensors, space qualified electronics, and MicroElectroMechanical Systems (MEMS) as well as integrated and multifunctional sensor systems. Each sensor type has its own technical challenges related to integration and reliability in a given application. The general approach has been to develop base sensor technology using microfabrication techniques, integrate sensors with "smart" hardware and software, and demonstrate those systems in a range of aerospace applications. Descriptions of the sensor elements, their integration into sensors systems, and examples of sensor system applications will be discussed. Finally, suggestions related to the future of sensor technology will be given. It is concluded that smart micro/nano sensor technology can revolutionize aerospace applications, but significant challenges exist in maturing the technology and demonstrating its value in real-life applications.

Hunter, Gary W.↗
NASA NTRS2008

Wearable Wireless Telemetry System for Implantable BioMEMS Sensors

Telemetry systems of a type that have been proposed for the monitoring of physiological functions in humans would include the following subsystems: Surgically implanted or ingested units that would comprise combinations of microelectromechanical systems (MEMS)- based sensors [bioMEMS sensors] and passive radio-frequency (RF) readout circuits that would include miniature loop antennas. Compact radio transceiver units integrated into external garments for wirelessly powering and interrogating the implanted or ingested units. The basic principles of operation of these systems are the same as those of the bioMEMS-sensor-unit/external-RFpowering- and-interrogating-unit systems described in "Printed Multi-Turn Loop Antennas for Biotelemetry" (LEW-17879-1) NASA Tech Briefs, Vol. 31, No. 6 (June 2007), page 48, and in the immediately preceding article, "Hand-Held Units for Short-Range Wireless Biotelemetry" (LEW-17483-1). The differences between what is reported here and what was reported in the cited prior articles lie in proposed design features and a proposed mode of operation. In a specific system of the type now proposed, the sensor unit would comprise mainly a capacitive MEMS pressure sensor located in the annular region of a loop antenna (more specifically, a square spiral inductor/ antenna), all fabricated as an integral unit on a high-resistivity silicon chip. The capacitor electrodes, the spiral inductor/antenna, and the conductor lines interconnecting them would all be made of gold. The dimensions of the sensor unit have been estimated to be about 110.4 mm. The external garment-mounted powering/ interrogating unit would include a multi-turn loop antenna and signal-processing circuits. During operation, this external unit would be positioned in proximity to the implanted or ingested unit to provide for near-field, inductive coupling between the loop antennas, which we have as the primary and secondary windings of an electrical transformer.

Simons, Rainee N.↗
NASA NTRS2014

Emerging Needs for Pervasive Passive Wireless Sensor Networks on Aerospace Vehicles

NASA is investigating passive wireless sensor technology to reduce instrumentation mass and volume in ground testing, air flight, and space exploration applications. Vehicle health monitoring systems (VHMS) are desired on all aerospace programs to ensure the safety of the crew and the vehicles. Pervasive passive wireless sensor networks facilitate VHMS on aerospace vehicles. Future wireless sensor networks on board aerospace vehicles will be heterogeneous and will require active and passive network systems. Since much has been published on active wireless sensor networks, this work will focus on the need for passive wireless sensor networks on aerospace vehicles. Several passive wireless technologies such as microelectromechanical systems MEMS, SAW, backscatter, and chipless RFID techniques, have all shown potential to meet the pervasive sensing needs for aerospace VHMS applications. A SAW VHMS application will be presented. In addition, application areas including ground testing, hypersonic aircraft and spacecraft will be explored along with some of the harsh environments found in aerospace applications.

Wilson, William C.↗
NASA NTRS2009

Wide-Angle-Scanning Reflectarray Antennas Actuated by MEMS

An effort to develop large-aperture, wide-angle-scanning reflectarray antennas for microwave radar and communication systems is underway. In an antenna of this type as envisioned, scanning of the radiated or incident microwave beam would be effected through mechanical rotation of the passive (reflective) patch antenna elements, using microelectromechanical systems (MEMS) stepping rotary actuators typified by piezoelectric micromotors. It is anticipated that the cost, mass, and complexity of such an antenna would be less than, and the reliability greater than, those of an electronically scanned phased-array antenna of comparable beam-scanning capability and angular resolution. In the design and operation of a reflectarray, one seeks to position and orient an array of passive patch elements in a geometric pattern such that, through constructive interference of the reflections from them, they collectively act as an efficient single reflector of radio waves within a desired frequency band. Typically, the patches lie in a common plane and radiation is incident upon them from a feed horn.

Fang, Houfei↗
NASA NTRS2008

High-Density, High-Bandwidth, Multilevel Holographic Memory

A proposed holographic memory system would be capable of storing data at unprecedentedly high density, and its data transfer performance in both reading and writing would be characterized by exceptionally high bandwidth. The capabilities of the proposed system would greatly exceed even those of a state-of-the art memory system, based on binary holograms (in which each pixel value represents 0 or 1), that can hold .1 terabyte of data and can support a reading or writing rate as high as 1 Gb/s. The storage capacity of the state-of-theart system cannot be increased without also increasing the volume and mass of the system. However, in principle, the storage capacity could be increased greatly, without significantly increasing the volume and mass, if multilevel holograms were used instead of binary holograms. For example, a 3-bit (8-level) hologram could store 8 terabytes, or an 8-bit (256-level) hologram could store 256 terabytes, in a system having little or no more size and mass than does the state-of-the-art 1-terabyte binary holographic memory. The proposed system would utilize multilevel holograms. The system would include lasers, imaging lenses and other beam-forming optics, a block photorefractive crystal wherein the holograms would be formed, and two multilevel spatial light modulators in the form of commercially available deformable-mirror-device spatial light modulators (DMDSLMs) made for use in high speed input conversion of data up to 12 bits. For readout, the system would also include two arrays of complementary metal oxide/semiconductor (CMOS) photodetectors matching the spatial light modulators. The system would further include a reference-beam sterring device (equivalent of a scanning mirror), containing no sliding parts, that could be either a liquid-crystal phased-array device or a microscopic mirror actuated by a high-speed microelectromechanical system. Time-multiplexing and the multilevel nature of the DMDSLM would be exploited to enable writing and reading of multilevel holograms. The DMDSLM would also enable transfer of data at a rate of 7.6 Gb/s or perhaps somewhat higher.

Chao, Tien-Hsin↗
NASA NTRS2001

Advanced RF Front End Technology

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

Herman, M. I.↗
NASA NTRS2004

Chapter 9: MEMS Applications in Spacecraft Thermal Control and Chapter 13: Handling and Contamination Control Considerations for Critical Space Applications

Thermal control systems (TCS) are an integral part of all spacecraft and instruments. To operate properly all spacecraft components must be maintained within a specified temperature band, which in some instances can be quite tight (less than 1 degree C). Traditionally this is accomplished by "passive" designs, but with modem spacecraft and instruments it is increasingly necessary to use active thermal control technologies. Microelectromechanical System (MEMS) can be useful in developing an active TCS, and may be especially useful for small spacecraft. As the MEMS knowledge matures, the applications of MEMS in spacecraft thermal control emerges as a viable technology for thermal engineers. Potential applications include specialized thermal control coatings, thermal switches, and specialized filters for instruments. Although MEMS technology demonstrates benefits, it also poses challenges for thermal en,oineers due to the lack of in-flight MEMS data. As a consequence, in order to design a MEMS thermal control device and receive the full advantage, it is important to understand the potential impact of the space environment on MEMS devices and the design/operational constraints imposed in their use. An entire chapter is devoted to handling and contamination controls for Micro Electro Mechanical Systems (MEMS) in space applications due to the importance of the topic area to final mission success. Handling and contamination control is discussed relative to the full life cycle from the very basic wafer level processing up through on orbit deployment. MEMS packaging will drive the need to tailor the Handling and Contamination Control Plan in order to assure adequacy of the overall program on a program by program basis. Plan elements are discussed at length to assist the user in preparing and implementing effective plans for both handling and contamination control to prevent deleterious effects.

Osiander, Robert↗
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS2011

Distributed Capacitive Sensor for Sample Mass Measurement

Previous robotic sample return missions lacked in situ sample verification/ quantity measurement instruments. Therefore, the outcome of the mission remained unclear until spacecraft return. In situ sample verification systems such as this Distributed Capacitive (DisC) sensor would enable an unmanned spacecraft system to re-attempt the sample acquisition procedures until the capture of desired sample quantity is positively confirmed, thereby maximizing the prospect for scientific reward. The DisC device contains a 10-cm-diameter pressure-sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in close proximity to an opposing rigid substrate with a narrow gap. The deformation of the membrane makes the gap narrower, resulting in increased capacitance between the two parallel plates (elastic membrane and rigid substrate). C-V conversion circuits on a nearby PCB (printed circuit board) provide capacitance readout via LVDS (low-voltage differential signaling) interface. The capacitance method was chosen over other potential approaches such as the piezoelectric method because of its inherent temperature stability advantage. A reference capacitor and temperature sensor are embedded in the system to compensate for temperature effects. The pressure-sensitive membranes are aluminum 6061, stainless steel (SUS) 403, and metal-coated polyimide plates. The thicknesses of these membranes range from 250 to 500 m. The rigid substrate is made with a 1- to 2-mm-thick wafer of one of the following materials depending on the application requirements glass, silicon, polyimide, PCB substrate. The glass substrate is fabricated by a microelectromechanical systems (MEMS) fabrication approach. Several concentric electrode patterns are printed on the substrate. The initial gap between the two plates, 100 m, is defined by a silicon spacer ring that is anodically bonded to the glass substrate. The fabricated proof-of-concept devices have successfully demonstrated tens to hundreds of picofarads of capacitance change when a simulated sample (100 g to 500 g) is placed on the membrane.

Toda, Risaku↗
NASA NTRSDate not supplied

Examining the Role of IMU Health Characterization and Monitoring in UAS Safety

Inertial measurement units (IMUs) can be vital for vehicle attitude and position estimation in unmanned aerial vehicles (UAVs). Degradation in these units could result in incorrect position estimates that are utilized in vehicle control, trajectory prediction, and other critical systems; however, the modes and effects of degradation in these IMUs are not well understood. In order to quantify the risk posed by degradation in these sensors, a study was conducted on the types of IMUs prevalent in the commercial market, their known failure modes, and the applicability to health monitoring methods for risk reduction and increased safety in an increasingly autonomous airspace. First, use cases and failure modes of the various types and reliability of commercially available IMUs were reviewed, and knowledge gaps and issues in the field were identified. Noting that inexpensive and lightweight MEMS (Microelectromechanical Systems) IMUs are some of the most commonly used but least reliable sensors in sUAS (small Unmanned Aerial Systems), five inexpensive MEMS IMUs were chosen for a performance evaluation study, selected from the Pixhawk autopilot systems, hobby sUAS, and prior NASA experimental studies. For each of these IMUs, a 10-minute bias test and a 12-hour drift test were performed for the accelerometers in a benchtop setting, using a BeagleBone Black for data collection. Using these results, the sensors’ performance is compared to their reported specifications, and the utility of implementing diagnostic methods for MEMS IMUs for research and commercial applications is evaluated. The paper concludes with a planned study for the evaluation of vibration-induced degradation for the selected sensors.

IMUs↗
NASA NTRS2000

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗
NASA NTRS2003

Carbon-Based Wear Coatings: Properties and Applications

The technical function of numerous engineering systems - such as vehicles, machines, and instruments - depends on the processes of motion and on the surface systems. Many processes in nature and technology depend on the motion and dynamic behavior of solids, liquids, and gases. Smart surface systems are essential because of the recent technological push toward higher speeds, loads, and operating temperatures; longer life; lighter weight and smaller size (including nanotechnology); and harsh environments in mechanical, mechatronic, and biomechanical systems. If proper attention is not given to surface systems, then vehicles, machines, instruments, and other technical systems could have short lives, consume excessive energy, experience breakdowns, result in liabilities, and fail to accomplish their missions. Surface systems strongly affect our national economy and our lifestyles. At the NASA Glenn Research Center, we believe that proper attention to surface systems, especially in education, research, and application, could lead to economic savings of between 1.3 and 1.6 percent of the gross domestic product. Wear coatings and surface systems continue to experience rapid growth as new coating and surface engineering technologies are discovered, more cost-effective coating and surface engineering solutions are developed, and marketers aggressively pursue, uncover, and exploit new applications for engineered surface systems in cutting tools and wear components. Wear coatings and smart surface systems have been used widely in industrial, consumer, automotive, aerospace, and biomedical applications. This presentation expresses the author's views of and insights into smart surface systems in wear coatings. A revolution is taking place in carbon science and technology. Diamond, an allotrope of carbon, joins graphite, fullerenes, and nanotubes as its major pure carbon structures. It has a unique combination of extreme properties: hardness and abrasion resistance; adhesion and friction; thermal conductivity; chemical and thermal inertness; corrosion and wear resistance; radiation resistance and biocompatibility; electronic, acoustic, and electrochemical characteristics; and environmental compatibility. These properties make diamond attractive for a wide range of diverse applications. In particular, chemical-vapor-deposited (CVD) diamond coatings offer a broad potential, since size and cost are not as limiting. The production of large, superhard diamond films or sheets at low cost make designer materials possible. This presentation is divided into two sections: properties and applications of hard coatings. The first section is concerned with the fundamental properties of the surfaces of CVD diamonds and related materials. The surface properties of hard coatings with favorable coefficients of friction (less than or equal to 0.1) and dimensional wear coefficients (less than or equal to 10(exp -6) cubic millimeters/N.m) in specific environments are discussed. The second section is devoted to applications. Examples of actual, successful applications and of potential challenging applications of the coatings.such as CVD diamond, diamondlike carbon, and cubic boron nitride-are described. Cutting tools coated with CVD diamond are of immediate commercial interest. Other applications, such as microelectromechanical systems (MEMS), valves, and bearings of CVD diamond, are being developed, but at a slow pace. There is a continually growing interest in commercializing diamondlike carbon for wear parts applications, such as biomedical parts and implants, forming dies, transport guides, magnetic tapes and disks, valves, and gears. Cubic boron nitride films are receiving attention because they can be used on tools to machine ferrous materials or on wear parts in sliding contact with ferrous materials.

Miyoshi, Kazuhisa↗
NASA NTRS2010

Propulsion Design With Freeform Fabrication (PDFF)

The nation is challenged to decrease the cost and schedule to develop new space transportation propulsion systems for commercial, scientific, and military purposes. Better design criteria and manufacturing techniques for small thrusters are needed to meet current applications in missile defense, space, and satellite propulsion. The requirements of these systems present size, performance, and environmental demands on these thrusters that have posed significant challenges to the current designers and manufacturers. Designers are limited by manufacturing processes, which are complex, costly, and time consuming, and ultimately limited in their capabilities. The PDFF innovation vastly extends the design opportunities of rocket engine components and systems by making use of the unique manufacturing freedom of solid freeform rapid prototype manufacturing technology combined with the benefits of ceramic materials. The unique features of PDFF are developing and implementing a design methodology that uses solid freeform fabrication (SFF) techniques to make propulsion components with significantly improved performance, thermal management, power density, and stability, while reducing development and production costs. PDFF extends the design process envelope beyond conventional constraints by leveraging the key feature of the SFF technique with the capability to form objects with nearly any geometric complexity without the need for elaborate machine setup. The marriage of SFF technology to propulsion components allows an evolution of design practice to harmonize material properties with functional design efficiency. Reduced density of materials when coupled with the capability to honeycomb structure used in the injector will have significant impact on overall mass reduction. Typical thrusters in use for attitude control have 60 90 percent of its mass in the valve and injector, which is typically made from titanium. The combination of material and structure envisioned for use in an SFF thruster design could reduce thruster weight by a factor of two or more. The thrust-to-weight ratios for such designs can achieve 1,000:1 or more, depending on chamber pressure. The potential exists for continued development in materials, size, speed, accuracy of SFF techniques, which can lead to speculative developments of PDFF processes such as fabrication of custom human interface devices like masks, chairs, and clothing, and advanced biomedical application to human organ reconstruction. Other potential applications are: higher fidelity lower cost test fixtures for probes and inspection, disposable thrusters, and ISRU (in situ resource utilization) for component production in space or on Lunar and Martian missions, and application for embedding MEMS (microelectromechanical systems) during construction process of form changing aerostructure/dynamic structures.

Barnes, Daudi↗