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At least 91 records · Page 5

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

NASA Tech Briefs, November 2011

The topics include: 1) Flight Test Results from the Rake Airflow Gage Experiment on the F-15B; 2) Telemetry and Science Data Software System; 3) CropEx Web-Based Agricultural Monitoring and Decision Support; 4) High-Performance Data Analysis Tools for Sun-Earth Connection Missions; 5) Experiment in Onboard Synthetic Aperture Radar Data Processing; 6) Microfabrication of a High-Throughput Nanochannel Delivery/Filtration System; 7) Improved Design and Fabrication of Hydrated-Salt Pills; 8) Monolithic Flexure Pre-Stressed Ultrasonic Horns; 9) Cryogenic Quenching Process for Electronic Part Screening; 10) Broadband Via-Less Microwave Crossover Using Microstrip-CPW Transitions; 11) Wheel-Based Ice Sensors for Road Vehicles; 12) G-DYN Multibody Dynamics Engine; 13) Multibody Simulation Software Testbed for Small-Body Exploration and Sampling; 14) Propulsive Reaction Control System Model; 15) Licklider Transmission Protocol Implementation; 16) Core Recursive Hierarchical Image Segmentation; 17) Two-Stage Centrifugal Fan; 18) Combined Structural and Trajectory Control of Variable-Geometry Planetary Entry Systems; 19) Pressure Regulator With Internal Ejector Circulation Pump, Flow and Pressure Measurement Porting, and Fuel Cell System Integration Options; 20) Temperature-Sensitive Coating Sensor Based on Hematite; 21) Standardization of a Volumetric Displacement Measurement for Two-Body Abrasion Scratch Test Data Analysis; 22) Detection of Carbon Monoxide Using Polymer-Carbon Composite Films; 23) Substituted Quaternary Ammonium Salts Improve Low-Temperature Performance of Double-Layer Capacitors; 24) Sustainably Sourced, Thermally Resistant, Radiation Hard Biopolymer; 25) Integrated Lens Antennas for Multi-Pixel Receivers; 26) 180-GHz Interferometric Imager; 27) Maturation of Structural Health Management Systems for Solid Rocket Motors; 28) Validating Phasing and Geometry of Large Focal Plane Arrays; 29) Transverse Pupil Shifts for Adaptive Optics Non-Common Path Calibration; 30) Qualification of Fiber Optic Cables for Martian Extreme Temperature Environments; 31) Solid-State Spectral Light Source System; 32) Multiple-Event, Single-Photon Counting Imaging Sensor; 33) Surface Modeling to Support Small-Body Spacecraft Exploration and Proximity Operations; and 34) Achieving Exact and Constant Turnaround Ratio in a DDS-Based Coherent Transponder.

Source record↗

Towards Qualification and Certification of Laser Powder Bed Fusion Ti-6Al-4V with In-Situ Process Monitoring and Automated Defect Detection

Qualification and certification of laser powder bed fusion (LPBF) parts are two challenges that must be answered to ensure suitability for critical applications. In-situ monitoring using high frame rate thermal and conventional optical imaging sensors is applied to the LPBF build process. Currently, the large volume of data from such sensors becomes untenable for manual inspection in production environments. This presentation serves to address this in-situ monitoring deficiency in two ways. First, a framework for managing data streams from LPBF process monitoring sensors is described. Second, two candidate image analysis techniques are presented: one is a set of heuristics that are easily interpretable, and the other is an uninterpretable convolutional neural network. These strategies are compared in terms of performance, computational expense, and speed. These methodologies represent platforms for connecting processing conditions to process modeling efforts aligned with the qualification and certification mission for LPBF Ti-6Al-4V components.

Qualification↗

FPGA development for high altitude subsonic parachute testing

This paper describes a rapid, top down requirements-driven design of a Field Programmable Gate Array (FPGA) used in an Earth qualification test program for a new Mars subsonic parachute. The FPGA is used to process and control storage of telemetry data from multiple sensors throughout launch, ascent, deployment and descent phases of the subsonic parachute test.

Field Programmable Gate Array (FPGA)↗

High altitude subsonic parachute field programmable gate array

This paper describes a rapid, top down requirements-driven design of an FPGA used in an Earth qualification test program for a new Mars subsonic parachute. The FPGA is used to process and control storage of telemetry data from multiple sensors throughout; launch, ascent, deployment and descent phases of the subsonic parachute test.

FPGA methodology↗

Multi-Operator Multi-UAV (MOMU) Control: Exploring the Influence of Sensor Tools and Playbook Task Delegation

New concepts of operations for Unmanned Aerial Vehicles (UAVs) will require a change from the current 2:1 operator to vehicle crew configuration. One particular control paradigm, largely driven by logistics, manpower, and training burdens, as well as the desire to force multiply, involves a single operator simultaneously managing multiple UAVs. This mode of operations has shown to significantly increase cognitive workload and decrease situation awareness, as operators are required to simultaneously attend to multiple sources of information. One potential way to mitigate potential drawbacks of multi-vehicle control by a single operator is to migrate to a multi-operator multi-UAV (MOMU) crew configuration, whereby M operators control N (> M) vehicles. This type of crew configuration can be organized in several ways to dynamically manage cognitive workload, match operator qualifications and skills to mission requirements, increase utilization of available assets, and thereby achieve maximum force multiplication. The present experiment examined task performance in a simulated MOMU environment and evaluated the potential benefits of sensor management aids ("Tools") as well as integrated sensor and flight automation ("Plays") compared to a fully manual condition ("Manual"). Tools support the operator by facilitating rapid understanding and management of sensor information, while the Plays support the operator by offloading/automating subtasks. Six pairs of participants were recruited for this study and tasked with sharing a pool of UAVs in order to conduct reconnaissance, surveillance, and target acquisition (RSTA) missions in adjacent Areas of Operation (AOs). Participants were given four tasks to accomplish, in order of priority: 1) prosecute High Value Targets (HVTs); 2) identify / track targets (military vehicles); 3) identify / mark civilian vehicles; and 4) respond to chat messages. Performance on the mission tasks was measured in terms of accuracy and reaction time. A composite mission score was also calculated using a payoff matrix that weighted each task according to priority. The results indicate that Playbook demonstrated better performance overall with higher accuracy rates and the highest composite score compared to Tools and Manual. The implications of these results to supporting future MOMU concepts of operations is discussed.

Playbook↗

In-Situ Measurement of Hall Thruster Erosion Using a Fiber Optic Regression Probe

One potential life-limiting mechanism in a Hall thruster is the erosion of the ceramic material comprising the discharge channel. This is especially true for missions that require long thrusting periods and can be problematic for lifetime qualification, especially when attempting to qualify a thruster by analysis rather than a test lasting the full duration of the mission. In addition to lifetime, several analytical and numerical models include electrode erosion as a mechanism contributing to enhanced transport properties. However, there is still a great deal of dispute over the importance of erosion to transport in Hall thrusters. The capability to perform an in-situ measurement of discharge channel erosion is useful in addressing both the lifetime and transport concerns. An in-situ measurement would allow for real-time data regarding the erosion rates at different operating points, providing a quick method for empirically anchoring any analysis geared towards lifetime qualification. Erosion rate data over a thruster's operating envelope would also be useful in the modeling of the detailed physics inside the discharge chamber. A recent fundamental sensor development effort has led to a novel regression, erosion, and ablation sensor technology (REAST). The REAST sensor allows for measurement of real-time surface erosion rates at a discrete surface location. The sensor was tested using a linear Hall thruster geometry, which served as a means of producing plasma erosion of a ceramic discharge chamber. The mass flow rate, discharge voltage, and applied magnetic field strength could be varied, allowing for erosion measurements over a broad thruster operating envelope. Results are presented demonstrating the ability of the REAST sensor to capture not only the insulator erosion rates but also changes in these rates as a function of the discharge parameters.

Polzink, Kurt A.↗

In-Situ Measurement of Hall Thruster Erosion Using a Fiber Optic Regression Probe

One potential life-limiting mechanism in a Hall thruster is the erosion of the ceramic material comprising the discharge channel. This is especially true for missions that require long thrusting periods and can be problematic for lifetime qualification, especially when attempting to qualify a thruster by analysis rather than a test lasting the full duration of the mission. In addition to lifetime, several analytical and numerical models include electrode erosion as a mechanism contributing to enhanced transport properties. However, there is still a great deal of dispute over the importance of erosion to transport in Hall thrusters. The capability to perform an in-situ measurement of discharge channel erosion is useful in addressing both the lifetime and transport concerns. An in-situ measurement would allow for real-time data regarding the erosion rates at different operating points, providing a quick method for empirically anchoring any analysis geared towards lifetime qualification. Erosion rate data over a thruster s operating envelope would also be useful in the modeling of the detailed physics inside the discharge chamber. There are many different sensors and techniques that have been employed to quantify discharge channel erosion in Hall thrusters. Snapshots of the wear pattern can be obtained at regular shutdown intervals using laser profilometry. Many non-intrusive techniques of varying complexity and sensitivity have been employed to detect the time-varying presence of erosion products in the thruster plume. These include the use quartz crystal microbalances, emission spectroscopy, laser induced flourescence, and cavity ring-down spectroscopy. While these techniques can provide a very accurate picture of the level of eroded material in the thruster plume, it is more difficult to use them to determine the location from which the material was eroded. Furthermore, none of the methods cited provide a true in-situ measure of erosion at the channel surface while the thruster is in operation (i.e. none yield a continuous channel erosion measurement). A recent fundamental sensor development effort has led to a novel regression, erosion, and ablation sensor technology (REAST). The REAST sensor allows for measurement of real-time surface erosion rates at a discrete surface location. The sensor was tested using a linear Hall thruster geometry (see Fig. 1), which served as a means of producing plasma erosion of a ceramic discharge chamber. The mass flow rate, discharge voltage, and applied magnetic field strength could be varied, allowing for erosion measurements over a broad thruster operating envelope. Results are presented demonstrating the ability of the REAST sensor to capture not only the insulator erosion rates but also changes in these rates as a function of the discharge parameters.

Polzin, Kurt↗

A Spacecraft Housekeeping System-on-Chip in a Radiation Hardened Structured ASIC

Housekeeping systems are essential to health monitoring of spacecraft and instruments. Typically, sensors are distributed across various sub-systems and data is collected using components such as analog-to-digital converters, analog multiplexers and amplifiers. In most cases programmable devices are used to implement the data acquisition control and storage, and the interface to higher level systems. Such discrete implementations require additional size, weight, power and interconnect complexity versus an integrated circuit solution, as well as the qualification of multiple parts. Although commercial devices are readily available, they are not suitable for space applications due the radiation tolerance and qualification requirements. The Housekeeping System-o n-A-Chip (HKSOC) is a low power, radiation hardened integrated solution suitable for spacecraft and instrument control and data collection. A prototype has been designed and includes a wide variety of functions including a 16-channel analog front-end for driving and reading sensors, analog-to-digital and digital-to-analog converters, on-chip temperature sensor, power supply current sense circuits, general purpose comparators and amplifiers, a 32-bit processor, digital I/O, pulse-width modulation (PWM) generators, timers and I2C master and slave serial interfaces. In addition, the device can operate in a bypass mode where the processor is disabled and external logic is used to control the analog and mixed signal functions. The device is suitable for stand-alone or distributed systems where multiple chips can be deployed across different sub-systems as intelligent nodes with computing and processing capabilities.

Suarez, George↗

The use of real-time, hardware-in-the-loop simulation in the design and development of the new Hughes HS601 spacecraft attitude control system

Realtime simulation and hardware-in-the-loop testing is being used extensively in all phases of the design, development, and testing of the attitude control system (ACS) for the new Hughes HS601 satellite bus. Realtime, hardware-in-the-loop simulation, integrated with traditional analysis and pure simulation activities is shown to provide a highly efficient and productive overall development program. Implementation of high fidelity simulations of the satellite dynamics and control system algorithms, capable of real-time execution (using applied Dynamics International's System 100), provides a tool which is capable of being integrated with the critical flight microprocessor to create a mixed simulation test (MST). The MST creates a highly accurate, detailed simulated on-orbit test environment, capable of open and closed loop ACS testing, in which the ACS design can be validated. The MST is shown to provide a valuable extension of traditional test methods. A description of the MST configuration is presented, including the spacecraft dynamics simulation model, sensor and actuator emulators, and the test support system. Overall system performance parameters are presented. MST applications are discussed; supporting ACS design, developing on-orbit system performance predictions, flight software development and qualification testing (augmenting the traditional software-based testing), mission planning, and a cost-effective subsystem-level acceptance test. The MST is shown to provide an ideal tool in which the ACS designer can fly the spacecraft on the ground.

Slafer, Loren I.↗

Methods and Piezoelectric Imbedded Sensors for Damage Detection in Composite Plates Under Ambient and Cryogenic Conditions

New methods for structural health monitoring are being assessed, especially in high-performance, extreme environment, safety-critical applications. One such application is for composite cryogenic fuel tanks. The work presented here attempts to characterize and investigate the feasibility of using imbedded piezoelectric sensors to detect cracks and delaminations under cryogenic and ambient conditions. A variety of damage detection methods and different Sensors are employed in the different composite plate samples to aid in determining an optimal algorithm, sensor placement strategy, and type of imbedded sensor to use. Variations of frequency, impedance measurements, and pulse echoing techniques of the sensors are employed and compared. Statistical and analytic techniques are then used to determine which method is most desirable for a specific type of damage. These results are furthermore compared with previous work using externally mounted sensors. Results and optimized methods from this work can then be incorporated into a larger composite structure to validate and assess its structural health. This could prove to be important in the development and qualification of any 2" generation reusable launch vehicle using composites as a structural element.

Engberg, Robert↗

Environmental Test Screening Procedure

This procedure describes the methods to be used for environmental stress screening (ESS) of the Lightning Mapper Sensor (LMS) lens assembly. Unless otherwise specified, the procedures shall be completed in the order listed, prior to performance of the Acceptance Test Procedure (ATP). The first unit, S/N 001, will be subjected to the Qualification Vibration Levels, while the remainder will be tested at the Operational Level. Prior to ESS, all units will undergo Pre-ESS Functional Testing that includes measuring the on-axis and plus or minus 0.95 full field Modulation Transfer Function and Back Focal Length. Next, all units will undergo ESS testing, and then Acceptance testing per PR 460.

Zeidler, Janet↗

MELDI2 Do No Harm Test Series

Mars 2020 will fly the Mars Entry, Descent, and Landing Instrumentation II (MEDLI2) sensor suite consisting of a total of seventeen instrumented thermal sensor plugs, eight pressure transducers, two heat flux sensors, and one radiometer embedded in the thermal protection system (TPS). Of the MEDLI2 instrumentation, eleven instrumented thermal plugs and seven pressure transducers will be installed on the heatshield of the Mars 2020 vehicle while the rest will be installed on the backshell. The goal of the MEDLI2 instrumentation is to directly inform the large performance uncertainties that contribute to the design and validation of a Mars entry system. A better understanding of the entry environment and TPS performance could lead to reduced design margins enabling a greater payload mass-fraction and smaller landing ellipses. To prove that the MEDLI2 system will not degrade the performance of the Mars 2020 TPS, an Aerothermal Do No Harm (DNH) test series was designed and conducted. Like Mars 2020's predecessor, Mars Science Laboratory (MSL), the heatshield material will be Phenolic Impregnated Carbon Ablator (PICA); the Mars 2020 entry conditions are enveloped by the MSL design environments, therefore the development and qualification testing performed during MEDLI is sufficient to show that the similar MEDLI2 heatshield instrumentation will not degrade PICA performance. However, given that MEDLI did not include any backshell instrumentation, the MEDLI2 team was required to design and execute a DNH test series utilizing the backshell TPS material (SLA-561V) with the intended flight sensor suite. To meet the requirements handed down from Mars 2020, the MEDLI2 DNH test series emphasized the interaction between the MEDLI2 sensors and sensing locations with the surrounding backshell TPS and substrucutre. These interactions were characterized by performing environmental testing of four 12" by 12" test panels, which mimicked the construction of the backshell TPS and the integration of the MEDLI2 sensors as seen in Figure 1. The testing included thermal vacuum/ cycling, random vibration, shock, and arc jet testing. The test panels were fabricated by Lockheed Martin, establishing techniques that will be utilized during the Mars 2020 vehicle installation. Each test panel included one thermal sensor plug (two embedded thermocouples), one heat flux sensor, and multiple pressure port holes for evaluation. This presentation will discuss the planning and execution of the MEDLI2 DNH test series. Selected highlights and results of each environmental test will be presented, and lessons learned will be addressed that will feed forward into the planning for the MEDLI2 flight system certification testing.

Heatshield↗

In-Situ Process Monitoring, Synchronization, and Mapping Laser Powder Bed Fusion Builds of Ti6Al4V

The use of in-situ process monitoring is of interest to lower the cost of inspection for the qualification of laser powder bed fusion (LPBF) parts. Precise monitoring of the LPBF-AM build process constitutes a multi-scale and multi-discipline task. There are several significant challenges to the in-situ approach: the synchronization of sensor signals to process steps, the physical interpretation and classification of sensor signals, managing very large datasets, and comparing the inputs with the observed monitoring signals. At NASA Langley Research Center, a configurable architecture additive testbed has been developed to monitor the build process with synchronized sensors. The philosophy and method adopted for the synchronization of the cameras with laser power & position Ti-6Al-4V LPBF are described. The synchronized in-situ monitoring signals are compared with ex-situ nondestructive inspection and optical microscopy observations. Such comparisons permit a better understanding of how the sequential process actions of LPBF-AM can affect build quality.

Laser Powder Bed Fusion↗

Sensor Applications at Kennedy Space Center (KSC)

Transducers used at KSC (Kennedy Space Center), in support of processing and launch of flight vehicles and payloads, are designed and tested to meet specific program requirements. Any equipment, transducer or support instrumentation in direct contact or in support to flight vehicle operations is considered ground support equipment (GSE) and required to meet strict program requirements (i.e. Space Shuttle Program, Space Station Program, Evolved Expendable Launch Vehicles, etc.) Transducers used in KSC applications are based on commercial off-the-shelf (COTS) transducers and sensors. In order to fully meet KSC requirements, these transducers evolve from standard COTS to modified COTS. The Transducer and Data Acquisition Group of the Instrumentation Branch at Kennedy Space Center is responsible for providing the technical expertise as well as qualification-testing capability to transform these COTS transducers in modified COTS suitable for use around flight hardware.

Perotti, Jose M.↗

Development of Cryogenic Filter Wheels for the HERSCHEL Photodetector Array Camera & Spectrometer (PACS)

This paper describes the two PACS Filter Wheels that are direct-drive rotational mechanisms operated at a temperature below 5K inside the PACS focal plane unit of the Herschel Satellite. The purpose of the mechanisms is to switch between filters. The rotation axis is pivoted to the support structure via a slightly preloaded pair of ball bearings and driven by a Cryotorquer. Position sensing is realized by a pair of Hall effect sensors. Powerless positioning at the filter positions is achieved by a magnetic ratchet system. The key technologies are the Cryotorquer design and the magnetic ratchet design in the low temperature range. Furthermore, we will report on lessons learned during the development and qualification of the mechanism and the paint.

Koerner, Christian↗

Mars2020 Entry, Descent, and Landing Instrumentation 2 (MEDLI2) Do No Harm Test Series

A total of seventeen instrumented thermal sensor plugs, eight pressure transducers, two heat flux sensors, and one radiometer are planned to be utilized on the Mars 2020 missions thermal protection system (TPS) as part of the Mars Entry, Descent, and Landing Instrumentation II (MEDLI2) project. Of the MEDLI2 instrumentation, eleven instrumented thermal plugs and seven pressure transducers will be installed on the heatshield of the Mars 2020 vehicle while the rest will be installed on the backshell. The goal of the MEDLI2 instrumentation is to directly inform the large performance uncertainties that contribute to the design and validation of a Mars entry system. A better understanding of the entry environment and TPS performance could lead to reduced design margins enabling a greater payload mass-fraction and smaller landing ellipses. To prove that the MEDLI2 system will not degrade the performance of the Mars 2020 TPS, an Aerothermal Do No Harm (DNH) test series was designed and conducted. Like Mars 2020s predecessor, Mars Science Laboratory (MSL), the heatshield material will be Phenolic Impregnated Carbon Ablator (PICA); the Mars 2020 entry conditions are enveloped by the MSL design environments, therefore the development and qualification testing performed during MEDLI is sufficient to show that the similar MEDLI2 heatshield instrumentation will not degrade PICA performance. However, given that MEDLI did not include any backshell instrumentation, the MEDLI2 team was required to design and execute a DNH test series utilizing the backshell TPS material (SLA-561V) with the intended flight sensor suite. To meet the requirements handed down from Mars 2020, the MEDLI2 DNH test series emphasized the interaction between the MEDLI2 sensors and sensing locations with the surrounding backshell TPS and substrucutre. These interactions were characterized by performing environmental testing of four 12 by 12 test panels, which mimicked the construction of the backshell TPS and the integration of the MEDLI2 sensors as seen in Figure 1. The testing included thermal vacuumcycling, random vibration, shock, and arc jet testing. The test panels were fabricated by Lockheed Martin, establishing techniques that will be utilized during the Mars 2020 vehicle installation. Each test panel included one thermal sensor plug (two embedded thermocouples), one heat flux sensor, and multiple pressure port holes for evaluation.This presentation will discuss the planning and execution of the MEDLI2 DNH test series. Selected highlights and results of each environmental test will be presented, and lessons learned will be addressed that will feed forward into the planning for the MEDLI2 flight system certification testing.

backshell↗

MEMS Microshutter Array System for James Webb Space Telescope

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors.

Li, Mary J.↗