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Electric gathering of sheet stock edges forms metal sheets in the shape of gore sections with heavier edge areas that can be welded without loss of strength. The edges are gathered by progressive resistance heating and upsetting, and are formed automatically. This process avoids disturbance of the metals internal structure.
Magnetic force upset welding of dissimilar thickness stainless steel T-joints
Stainless steel sheet-to-plate tee joint resistance welded by Magnetic Force Upset Welding process, testing performance
An approach to the fault analysis of digital systems is proposed which combines faults, hardware, and software into one overall model. The model is useful for the consideration of intermittent/transient faults, and supports a new method, based on the concept of a containment set, for realizing transient fault tolerance without massive redundancy. The model also serves as the basis for a new approach to system fault tolerance evaluation and validation using a transition matrix defined in terms of the containment set. The application of upset theory to the design of transient fault-tolerant microprocessor controllers is discussed.
Low earth orbit satellite and Jupiter orbiter probe semiconductor devices may incur soft errors or single event upsets, manifested as bit flips, during exposure to such nuclear particles or heavy ions as trapped protons with energies ranging up to 1000 MeV. Experimental data is given on the average proton fluence needed to cause a bit flip as a function of proton energy for isoplanar bipolar TTL RAMs. Error dependence data shape and threshold energy can be related to the existing body of theoretical data on energy deposition following proton nuclear reactions. Experimental data also show that the relative cross sectional amplitude for functionally identical devices can be related to the device's power consumption.
When an energetic particle (kinetic energy 0.5 MeV) originating from a radioactive decay or a cosmic ray transverse the active regions of semiconductor devices used in integrated circuit (IC) chips, it leaves along its track a high density electron hole plasma. The subsequent decay of this plasma by drift and diffusion leads to charge collection at the electrodes large enough in most cases to engender a false reading, hence the name single-event upset (SEU). The problem of SEU's is particularly severe within the harsh environment of Jupiter's radiation belts and constitutes therefore a matter of concern for the Galileo mission. The physics of an SEU event is analyzed in some detail. Owing to the predominance of nonlinear space charge effects and the fact that positive (holes) and negative (electrons) charges must be treated on an equal footing, analytical models for the ionized-charge collection and their corresponding currents as a function of time prove to be inadequate even in the simplest case of uniformly doped, abrupt p-n junctions in a one-dimensional geometry. The necessity for full-fledged computer simulation of the pertinent equations governing the electron-hole plasma therefore becomes imperative.
A guideline for heavy ion radiation testing for single event upset was prepared to assist new experimenters in preparing and directing tests. How to estimate parts vulnerability and select an irradiation facility is described. A broad brush description of JPL equipment is given, certain necessary pre-test procedures are outlined and the roles and testing guidelines for on-site test personnel are indicated. Detailed descriptions of equipment needed to interface with JPL test crew and equipment are not provided, nor does it meet the more generalized and broader requirements of a MIL-STD document. A detailed equipment description is available upon request, and a MIL-STD document is in the early stages of preparation.
The results of work done on the quantitative characterization of single-event upset (SEU) in bipolar random-access memories (RAMs) have been obtained through computer simulation of SEU in RAM cells that contain circuit models for bipolar transistors. The models include current generators that emulate the charge collected from ion tracks. The computer simulation results are compared with test data obtained from a RAM in a bipolar microprocessor chip. This methodology is applicable to other bipolar integrated circuit constructions in addition to RAM cells.
Document summarizes 15 studies of single-event upsets covering 60 different types of semiconductor devices. Studies discussed in document include verification of basic reactions induced by heavy ions and protons and surveys of latchup and bit-flip susceptibility of several types of devices and device-fabrication technologies.
Single-Event Upset (SEU) in bipolar integrated circuits (ICs) is caused by charge collection from ion tracks in various regions of a bipolar transistor. This paper presents experimental data which have been obtained wherein the range-energy characteristics of heavy ions (Br) have been utilized to determine the cross section for soft-error generation as a function of charge collected from single-particle tracks which penetrate a bipolar static RAM. The results of this work provide a basis for the experimental verification of circuit-simulation SEU modeling in bipolar ICs.
A summary of single event upset data for 42 device types (including RAMs, 4-bit slices, microprocessors, 4-bit counters, and flip-flops) studied at 11 different accelerator tests (performed chiefly with the Berkeley 88-inch cyclotron and the Cal Tech Van de Graaff) is presented. All bipolar and NMOS RAMs were found to be SEU sensitive, some with very low LET thresholds. Some CMOS or CMOS/SOS RAMs were hard; and the CMOS microprocessors were hard, but the bipolar and NMOS microprocessors were soft. Several devices were found to exhibit a cross section that depends strongly on LET, even when the LET is well above the LET threshold. A ranking of hardness is presented for the logic devices tested.
Simulation technique saves testing. Uses interactive version of SPICE (Simulation Program with Integrated Circuit Emphasis). Device and subcircuit models available in software used to construct macromodel for an integrated bipolar transistor. Time-dependent current generators placed inside transistor macromodel to simulate charge collection from ion track. Significant finding of experiments is standard design practice of reducing power in unaddressed bipolar RAM cell increases sensitivity of cell to single-event upsets.
Single-Event Upset (SEU) response of a bipolar low-power Schottky-diode-clamped TTL static RAM has been observed using Br ions in the 100-240 MeV energy range and O ions in the 20-100 MeV range. These data complete the experimental verification of circuit-simulation SEU modeling for this device. The threshold for onset of SEU has been observed by the variation of energy, ion species and angle of incidence. The results obtained from the computer circuit-simulation modeling and experimental model verification demonstrate a viable methodology for modeling SEU in bipolar integrated circuits.
New test data have been combined with published data to form a nearly comprehensive body of single event upset (SEU) test data for heavy ion irradiations. These data have been arranged to exibit the SEU susceptibility of devices by function, technology, and manufacturer. Clear trends emerge which should be useful in predicting future device performance.
Charged-particle interactions in microelectronic circuit chips (integrated circuits) present a particularly insidious problem for solid-state electronic systems due to the generation of soft errors or single-particle event upset (SEU) by either cosmic rays or other radiation sources. Particle accelerators are used to provide both light and heavy ions in order to assess the propensity of integrated circuit chips for SEU. Critical aspects of this assessment involve the ability to analytically model SEU for the prediction of error rates in known radiation environments. In order to accurately model SEU, the measurement and prediction of energy deposition in the form of an electron-hole plasma generated along an ion track is of paramount importance. This requires the use of accelerators which allow for ease in both energy control (change of energy) and change of ion species. This and other aspects of ion-beam control and diagnostics (e.g., uniformity and flux) are of critical concern for the experimental verification of theoretical SEU models.
New test data from the Jet Propulsion Laboratory (JPL), The Aerospace Corporation, Rockwell International (ANAHEIM) and IRT have been combined with published data of JPL and Aerospace to form a nearly comprehensive body of single event upset (SEU) test data for heavy ion irradiations. This data has been arranged to exhibit the SEU susceptibility of devices by function, technology and manufacturer. Clear trends emerge which should be useful in predicting future device performance.
A detailed experimental investigation of single-event upset (SEU) in static RAM (SRAM) chips fabricated using a family of high-performance NMOS (HMOS) depletion-mode-load process technologies, has been done. Empirical SEU models have been developed with the aid of heavy-ion data obtained with a three-stage tandem van de Graaff accelerator. The results of this work demonstrate a method by which SEU may be empirically modeled in NMOS integrated circuits.
The Galileo probe will be subject to radiation fields and energetic particle bombardment during its outward bound journey and in orbit around Jupiter and its moons. To avoid the occurrence and propagation of effects of single event upset (SEU) bit state changes induced by the bombardments attempts were made to harden the Galileo electronics against SEUs. The hazards are especially acute for Schottky diode and low-power Schottky TTL parts. The preventive action options which were scheduled are reviewed, noting the selection of CMOS chips as replacements for SEU-susceptible devices. The simulation and risk assessment that were performed to evaluate the potential success of the replacements are summarized, with emphasis on the data employed to ensure the accuracy of the assessments and the predicted effects of SEUs in the various Galileo subsystems.