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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Gallium Arsenide Semiconductor Opening Switches: Enabling Nanosecond High Powering Pulsed Systems

The goal of this work awas to investigate design manufacturing semiconductor opening switches (SOS) in both silicon and gallium arsenide (GaAs). Solid-state opening switches are critical components for pulsed power systems and applications in directed energy, dielectric wall accelerators, and novel semiconductor manufacturing techniques. Under this funding, we have developed silicon SOS designs that suppresses an unwanted prepulse, increases the peak output voltage by about 10 percent, and reduces the pulse rise time by ~ 4x compared with more conventional profiles. Through this effort we have improved device fabrication and bonding techniques. Additionally, work on this the GaAs opening switch has defined a unique application space that these devices are suited for. GaAs opening switches have short risetimes and pulse widths compared to silicon devices, however the short carrier lifetime of GaAs makes the circuit design more challenging than in silicon. For high PRF operation, the lifetime of the GaAs is an advantage compared to silicon. TCAD simulations of GaAs devices have been used to optimize a GaAs profile. Additionally, we have designed pulsers with sub 50ns reserve pump times and tested GaAs COTs PIN diodes in them.

42 ENGINEERING↗
NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗
NASA NTRS2001

Requirements, Verification, and Compliance (RVC) Database Tool

This paper describes the development, design, and implementation of the Requirements, Verification, and Compliance (RVC) database used on the International Space Welding Experiment (ISWE) project managed at Marshall Space Flight Center. The RVC is a systems engineer's tool for automating and managing the following information: requirements; requirements traceability; verification requirements; verification planning; verification success criteria; and compliance status. This information normally contained within documents (e.g. specifications, plans) is contained in an electronic database that allows the project team members to access, query, and status the requirements, verification, and compliance information from their individual desktop computers. Using commercial-off-the-shelf (COTS) database software that contains networking capabilities, the RVC was developed not only with cost savings in mind but primarily for the purpose of providing a more efficient and effective automated method of maintaining and distributing the systems engineering information. In addition, the RVC approach provides the systems engineer the capability to develop and tailor various reports containing the requirements, verification, and compliance information that meets the needs of the project team members. The automated approach of the RVC for capturing and distributing the information improves the productivity of the systems engineer by allowing that person to concentrate more on the job of developing good requirements and verification programs and not on the effort of being a "document developer".

Rainwater, Neil E., II↗
NASA NTRS2005

A Hardware and Software Perspective of the Fifth Materials on the International Space Station Experiment (MISSE-5)

Conducting space experiments with small budgets is a fact of life for many design groups with low-visibility science programs. One major consequence is that specialized space grade electronic components are often too costly to incorporate into the design. Radiation mitigation now becomes more complex as a result of being restricted to the use of commercial off-the-shelf (COTS) parts. Unique hardware and software design techniques are required to succeed in producing a viable instrument suited for use in space. This paper highlights some of the design challenges and associated solutions encountered in the production of a highly capable, low cost space experiment package.

Krasowski, Michael↗
NASA NTRS2007

Big Science, Small-Budget Space Experiment Package Aka MISSE-5: A Hardware And Software Perspective

Conducting space experiments with small budgets is a fact of life for many design groups with low-visibility science programs. One major consequence is that specialized space grade electronic components are often too costly to incorporate into the design. Radiation mitigation now becomes more complex as a result of being restricted to the use of commercial off-the-shelf (COTS) parts. Unique hardware and software design techniques are required to succeed in producing a viable instrument suited for use in space. This paper highlights some of the design challenges and associated solutions encountered in the production of a highly capable, low cost space experiment package.

Krasowski, Michael↗
NASA NTRS2008

Performance of MEMS Silicon Oscillator, ASFLM1, under Wide Operating Temperature Range

Over the last few years, MEMS (Micro-Electro-Mechanical Systems) resonator-based oscillators began to be offered as commercial-off-the-shelf (COTS) parts by a few companies [1-2]. These quartz-free, miniature silicon devices could compete with the traditional crystal oscillators in providing the timing (clock function) for many digital and analog electronic circuits. They provide stable output frequency, offer great tolerance to shock and vibration, and are immune to electro-static discharge [1-2]. In addition, they are encapsulated in compact lead-free packages, cover a wide frequency range (1 MHz to 125 MHz), and are specified, depending on the grade, for extended temperature operation from -40 C to +85 C. The small size of the MEMS oscillators along with their reliability and thermal stability make them candidates for use in space exploration missions. Limited data, however, exist on the performance and reliability of these devices under operation in applications where extreme temperatures or thermal cycling swings, which are typical of space missions, are encountered. This report presents the results of the work obtained on the evaluation of an ABRACON Corporation MEMS silicon oscillator chip, type ASFLM1, under extreme temperatures.

Patterson, Richard L.↗
NASA NTRS2009

SOI N-Channel Field Effect Transistors, CHT-NMOS80, for Extreme Temperatures

Extreme temperatures, both hot and cold, are anticipated in many of NASA space exploration missions as well as in terrestrial applications. One can seldom find electronics that are capable of operation under both regimes. Even for operation under one (hot or cold) temperature extreme, some thermal controls need to be introduced to provide appropriate ambient temperatures so that spacecraft on-board or field on-site electronic systems work properly. The inclusion of these controls, which comprise of heating elements and radiators along with their associated structures, adds to the complexity in the design of the system, increases cost and weight, and affects overall reliability. Thus, it would be highly desirable and very beneficial to eliminate these thermal measures in order to simplify system's design, improve efficiency, reduce development and launch costs, and improve reliability. These requirements can only be met through the development of electronic parts that are designed for proper and efficient operation under extreme temperature conditions. Silicon-on-insulator (SOI) based devices are finding more use in harsh environments due to the benefits that their inherent design offers in terms of reduced leakage currents, less power consumption, faster switching speeds, good radiation tolerance, and extreme temperature operability. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. The objective of this work was to evaluate the performance of a new commercial-off-the-shelf (COTS) SOI parts over an extended temperature range and to determine the effects of thermal cycling on their performance. The results will establish a baseline on the suitability of such devices for use in space exploration missions under extreme temperatures, and will aid mission planners and circuit designers in the proper selection of electronic parts and circuits. The electronic part investigated in this work comprised of a CHT-NMOS80 high temperature N-channel MOSFET (metal-oxide semiconductor field-effect transistor) device that was manufactured by CISSOID. This high voltage, medium-power transistor is fabricated using SOI processes and is designed for extreme wide temperature applications such as geothermal well logging, aerospace and avionics, and automotive industry. It has a high DC current capability and is specified for operation in the temperature range of -55 C to +225 C

Patterson, Richard L.↗
NASA NTRS2016

NEPP Roadmaps, COTS, and Small Missions

This presentation provides an overview of the NEPP Program as well as the current roadmap for NEPP tasks.

NASA Electronic Parts and Packaging (NEPP) Program↗
NASA NTRS2011

Integrated Procedures for Flight and Ground Operations Using International Standards

Imagine astronauts using the same Interactive Electronic Technical Manuals (IETM's) as the ground personnel who assemble or maintain their flight hardware, and having all of that data interoperable with design, logistics, reliability analysis, and training. Modern international standards and their corresponding COTS tools already used in other industries provide a good foundation for streamlined technical publications in the space industry. These standards cover everything from data exchange to product breakdown structure to business rules flexibility. Full Product Lifecycle Support (PLCS) is supported. The concept is to organize, build once, reuse many ways, and integrate. This should apply to all future and some current launch vehicles, payloads, space stations/habitats, spacecraft, facilities, support equipment, and retrieval ships.

Ingalls, John↗
NASA NTRS2024

AC and DC Fault Management for Megawatt Electrified Aircraft Electrical Powertrains - Task 2: Power Quality Filtering Using Nanocrystalline Soft Magnetic Inductor

The NASA RTAPS program on AC and DC Fault Management for Megawatt Electrified Power Train is a multi-year joint project with Pratt & Whitney (P&W), Collins Aerospace (CA), and RTX Technology Research Center (RTRC). This research program focuses on the high-voltage distribution issues that present a significant technological obstacle in the adoption of Electrified Aviation Propulsion (EAP) systems. One challenge to the adoption of high-voltage distribution systems with power electronic converters is the need for filter elements to limit the generation and propagation of noise, protect the cable systems from premature aging and prevent against excessive heating within subcomponents due to high-frequency induced currents. While increased distribution voltages aide in reducing the cable mass for a fixed power system, the associated mass with the filtering elements for power electronic converter can grow with increasing distribution voltages – thereby mitigating any benefit associated with increasing the distribution system voltage. To enable high-voltage distribution systems with high system specific power densities, new magnetic materials must be developed. Therefore, the second task of the NASA RTAPS program is associated with the design and application of advanced soft magnetic components for Megawatt class electric propulsion systems, specifically the motor drive system. This report covers the collaborative work between NASA Glenn Research Center (GRC), RTRC, P&W and CA in the development of three types of magnetic components over the span of the three-year program. These critical magnetic components are the DC side EMI filter, which limits the propagation of harmful electromagnetic noise to the rise of the distribution system, and the AC side damping with the dv/dt filter, which limits the fast rise time of the power electronic converter output voltage to limit the degradation on the cable/motor insulation systems. Each of these components are investigated from component level design and are optimized at the system level with a combined modelling and testing effort. In the final experimental evaluation of the NASA developed soft magnetic material with a dv/dt filter, a commercial-off-the-shelf (COTS) magnetic core and the GRC magnetic core are optimized and loaded at 320Arms to evaluate their difference in performance. After a run time of 30 minutes in a MW-class motor driver at RTRC, the NASA GRC cores were found to not only offer a lower temperature rise of nearly 25°𝐶, but also a reduction in measured core loss of 25% (12.75W to 9.5W).

Elecrified Aircraft Propulsion↗
NASA NTRS2006

Self-Adaptive System based on Field Programmable Gate Array for Extreme Temperature Electronics

In this work, we report the implementation of a self-adaptive system using a field programmable gate array (FPGA) and data converters. The self-adaptive system can autonomously recover the lost functionality of a reconfigurable analog array (RAA) integrated circuit (IC) [3]. Both the RAA IC and the self-adaptive system are operating in extreme temperatures (from 120 C down to -180 C). The RAA IC consists of reconfigurable analog blocks interconnected by several switches and programmable by bias voltages. It implements filters/amplifiers with bandwidth up to 20 MHz. The self-adaptive system controls the RAA IC and is realized on Commercial-Off-The-Shelf (COTS) parts. It implements a basic compensation algorithm that corrects a RAA IC in less than a few milliseconds. Experimental results for the cold temperature environment (down to -180 C) demonstrate the feasibility of this approach.

adaptive hardwares↗
NASA NTRS2007

Radiation-Tolerant Dual Data Bus

An architecture, and a method of utilizing the architecture, have been proposed to enable error-free operation of a data bus that includes, and is connected to, commercial off-the-shelf (COTS) circuits and components that are inherently susceptible to singleevent upsets [SEUs (bit flips caused by impinging high-energy particles and photons)]. The architecture and method are applicable, more specifically, to data-bus circuitry based on the Institute for Electrical and Electronics Engineers (IEEE) 1394b standard for a high-speed serial bus.

Kinstler, Gary A.↗
NASA NTRS2018

High Performance Space Computing with System-on-Chip Instrument Avionics for Space-based Next Generation Imaging Spectrometers (NGIS).

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind stateof-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Smith, Adam↗
NASA NTRS2018

LiveCheckHSI: a Hardware/Software Co-verification Tool for Hyperspectral Imaging Systems with Embedded System-on-Chip Instrument Avionics

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This paper describes hardware/software co-verification tools for the Xilinx Zynq-based control and data handling system that have been developed at the Jet Propulsion Laboratory (JPL) for visible-infrared imaging spectrometers. The system acquires and compresses images in real-time, in addition to programming the spectrometer (frame rate, exposure time), focus step motor, and heaters and reporting telemetry.

Dolman, David↗
NASA NTRS2018

High Performance Space Computing with System-on-Chip Instrument Avionics for Space-based Next Generation Imaging Spectrometers (NGIS).

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Dolinar, Sam↗
NASA NTRS2019

High performance space computing with system-on-chip instrument avionics for space-based Next Generation Imaging Spectrometers (NGIS)

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Dolinar, Sam↗
NASA NTRS2020

Performance Evaluation of Isolated Gate Driver, ADuM4121, Under Exposure to Extreme Temperature

Electronics designed for use in space missions are expected to be exposed to harsh environment including radiation and extreme temperature, to name a few. Severe thermal swings are also encountered depending on planetary exploration, orbital orientation, and mission duration. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and very little data exist on their performance outside their specified range of operation. In this work, the performance of an isolated gate driver for controlling power-level transistors, including gallium nitride (GaN) and silicon carbide (SiC) devices, was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Boomer, Kristen↗