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At least 109 records · Page 6

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses has been conducted. It has been observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate has proven to be a determining factor in the prediction of failure in both the indium and tin/lead solder systems. This study has shown that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.

Partial discharge testing under direct voltage conditions

DC partial discharge (PD) (corona) testing is performed using a multichannel analyzer for pulse storing, and data is collected during increase of voltage and at quiescent voltage levels. Thus high voltage ceramic disk capacitors were evaluated by obtaining PD data interspersed during an accelerated life test. Increased PD activity was found early in samples that later failed catastrophically. By this technique, trends of insulation behavior are revealed sensitively and nondestructively in high voltage dc components.

Bever, R. S.

Uses of ceramics in microelectronics: A survey

The properties and behavior of ceramic materials used in components for electronic circuitry are examined to appraise the present and future directions for microelectronics, and to suggest further product development, and how innovations may be useful in other technologies. Ceramic and glass insulators, resistors, capacitors, and the use of ceramics and glasses in microcircuitry are discussed along with technology transfer to nonaerospace uses.

Bratschun, W. R.

Reliability Effects of Surge Current Testing of Solid Tantalum Capacitors

Solid tantalum capacitors are widely used in space applications to filter low-frequency ripple currents in power supply circuits and stabilize DC voltages in the system. Tantalum capacitors manufactured per military specifications (MIL-PRF-55365) are established reliability components and have less than 0.001% of failures per 1000 hours (the failure rate is less than 10 FIT) for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. This is due to a short-circuit failure mode, which might be damaging to a power supply, and also to the capability of tantalum capacitors with manganese cathodes to self-ignite when a failure occurs in low-impedance applications. During such a failure, a substantial amount of energy is released by exothermic reaction of the tantalum pellet with oxygen generated by the overheated manganese oxide cathode, resulting not only in destruction of the part, but also in damage of the board and surrounding components. A specific feature of tantalum capacitors, compared to ceramic parts, is a relatively large value of capacitance, which in contemporary low-size chip capacitors reaches dozens and hundreds of microfarads. This might result in so-called surge current or turn-on failures in the parts when the board is first powered up. Such a failure, which is considered as the most prevalent type of failures in tantalum capacitors [I], is due to fast changes of the voltage in the circuit, dV/dt, producing high surge current spikes, I(sub sp) = Cx(dV/dt), when current in the circuit is unrestricted. These spikes can reach hundreds of amperes and cause catastrophic failures in the system. The mechanism of surge current failures has not been understood completely yet, and different hypotheses were discussed in relevant literature. These include a sustained scintillation breakdown model [1-3]; electrical oscillations in circuits with a relatively high inductance [4-6]; local overheating of the cathode [5,7, 8]; mechanical damage to tantalum pentoxide dielectric caused by the impact of MnO2 crystals [2,9, 10]; or stress-induced-generation of electron traps caused by electromagnetic forces developed during current spikes [11]. A commonly accepted explanation of the surge current failures is that at unlimited current supply during surge current conditions, the self-healing mechanism in tantalum capacitors does not work, and what would be a minor scintillation spike if the current were limited, becomes a catastrophic failure of the part [l, 12]. However, our data show that the scintillation breakdown voltages are significantly greater that the surge current breakdown voltages, so it is still not clear why the part, which has no scintillations, would fail at the same voltage during surge current testing (SCT).

Teverovsky, Alexander

High-Temperature Passive Power Electronics

In many future NASA missions - such as deep-space exploration, the National AeroSpace Plane, minisatellites, integrated engine electronics, and ion or arcjet thrusters - high-power electrical components and systems must operate reliably and efficiently in high-temperature environments. The high-temperature power electronics program at the NASA Lewis Research Center focuses on dielectric and insulating material research, the development and characterization of high-temperature components, and the integration of the developed components into a demonstrable 200 C power system - such as an inverter. NASA Lewis has developed high-temperature power components through collaborative efforts with the Air Force Wright Laboratory, Northrop Grumman, and the University of Wisconsin. Ceramic and film capacitors, molypermalloy powder inductors, and a coaxially wound transformer were designed, developed, and evaluated for high-temperature operation.

Source record

Power Electronics Being Developed for Deep Space Cryogenic Applications

Electronic circuits and systems designed for deep space missions need to operate reliably and efficiently in harsh environments that include very low temperatures. Spacecraft that operate in such cold environments carry a large number of heaters so that the ambient temperature for the onboard electronics remains near 20 C. Electronics that can operate at cryogenic temperatures will simplify system design and reduce system size and weight by eliminating the heaters and their associated structures. As a result, system development and launch cost will be reduced. At the NASA Glenn Research Center, an ongoing program is focusing on the development of power electronics geared for deep space low-temperature environments. The research and development efforts include electrical components design, circuit design and construction, and system integration and demonstration at cryogenic temperatures. Investigations are being carried out on circuits and systems that are targeted for use in NASA missions where low temperatures will be encountered: devices such as ceramic and tantalum capacitors, metal film resistors, semiconductor switches, magnetics, and integrated circuits including dc/dc converters, operational amplifiers, voltage references, and motor controllers. Test activities cover a wide range of device and circuit performance under simple as well as complex test conditions, such as multistress and thermal cycling. The effect of low-temperature conditions on the switching characteristics of an advanced silicon-on-insulator field effect transistor is shown. For gate voltages (VGS) below 2.6 V, drain currents at -190 C are lower than drain currents at room temperature (20 C).

Patterson, Richard L.

Liquid-Metal-Fed Pulsed Plasma Thrusters

A short document proposes liquid-metal-fed pulsed plasma thrusters for small spacecraft. The propellant liquid for such a thruster would be a low-melting-temperature metal that would be stored molten in an unpressurized, heated reservoir and would be pumped to the thruster by a magnetohydrodynamic coupler. The liquid would enter the thruster via a metal tube inside an electrically insulating ceramic tube. A capacitor would be connected between the outlet of the metal tube and the outer electrode of the thruster. The pumping would cause a drop of liquid to form at the outlet, eventually growing large enough to make contact with the outer electrode. Contact would close the circuit through the capacitor, causing the capacitor to discharge through the drop. The capacitor would have been charged with enough energy that the discharge would vaporize, ionize, and electromagnetically accelerate the contents of the metal drop. The resulting plasma would be ejected at a speed of about 50 km/s. The vaporization of the drop would reopen the circuit through the capacitor, enabling recharging of the capacitor. As pumping continued, a new drop would grow and the process would repeat.

Markusic, Thomas

Plasmoid Thruster for High Specific-Impulse Propulsion

A report discusses a new multi-turn, multi-lead design for the first generation PT-1 (Plasmoid Thruster) that produces thrust by expelling plasmas with embedded magnetic fields (plasmoids) at high velocities. This thruster is completely electrodeless, capable of using in-situ resources, and offers efficiencies as high as 70 percent at a specific impulse, I(sub sp), of up to 8,000 s. This unit consists of drive and bias coils wound around a ceramic form, and the capacitor bank and switches are an integral part of the assembly. Multiple thrusters may be gauged to inductively recapture unused energy to boost efficiency and to increase the repetition rate, which, in turn increases the average thrust of the system. The thruster assembly can use storable propellants such as H2O, ammonia, and NO, among others. Any available propellant gases can be used to produce an I(sub sp) in the range of 2,000 to 8,000 s with a single-stage thruster. These capabilities will allow the transport of greater payloads to outer planets, especially in the case of an I(sub sp) greater than 6,000 s.

Fimognari, Peter

Rocket Propulsion 21 Steering Committee Meeting (RP21) NASA In-Space Propulsion Update

In-house Support of NEXT-C Contract Status Thruster NEXT Long Duration Test post-test destructive evaluation in progress Findings will be used to verify service life models identify potential design improvements Cathode heater fabrication initiated for cyclic life testing Thruster operating algorithm definition verification initiated to provide operating procedures for mission users High voltage propellant isolator life test voluntarily terminated after successfully operating 51,200 h Power processor unit (PPU) Replaced all problematic stacked multilayer ceramic dual inline pin capacitors within PPU Test bed Rebuilt installed discharge power supply primary power board Completed full functional performance characterization Final test report in progress Transferred PPU Testbed to contractor to support prototype design effort.

Electric Propulsion

Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination

Cracks and other defects in ceramic materials can be difficult or impossible to examine and photograph due to the extreme lack of contrast. A method for inspecting translucent ceramics using scattered light, also known as vicinal illumination, will be described. This method has been known in the ceramics industry for quite some time, but is not well known in the testing and failure analysis community. Electronics applications include substrates, packages, multilayer capacitors, and thin film resistors. Ceramic materials are used in electronic applications as microcircuit packages and substrates which carry signals and power between microcircuits. Fine cracks in ceramic materials can result in mechanical failures, electrical failures, and loss of hermeticity. Often, fine cracks are difficult or impossible to detect using standard nondestructive inspection techniques such as visual inspection, ultrasonic inspection, or vapor crack detection. Dye penetrant inspection is usually effective, but contaminates the part, which is unacceptable for space flight hardware. One effective nondestructive inspection method of detecting cracks involves examining the way in which light scatters through the ceramic material when viewed with a standard bright field reflected light microscope. This method, termed vicinal illumination, has been used for detecting cracks during failure analyses of several part types, and screening of space flight hardware. The technique has proven effective on several different types of ceramic materials as well. A related method for use with dark field equipment has also been used to successfully locate otherwise invisible cracks.

Hull, Scott M.

Using Defects to Create Ceramics with Giant Permittivity as Ultracapacitors

Dielectrics with a high and weakly- temperature-dependent permittivity are highly desirable for the development of high performance energy storage devices. It is well known that ferroelectrics (FEs) exhibit a high permittivity that is strongly dependent on the temperature due to phase transition. In this project, the FE BaTiO3 (BTO), based ceramics are developed as ultra-capacitors by introducing defects to eliminate the phase transition and enhance the permittivity. The ceramics are fabricated using a unique process: BTO nanoparticles are coated with a nano-layer of SiO2 and, then, sintered in vacuum using SPS process. The ceramics exhibit a giant permittivity and many other unique properties.

Talebinezhad, H.

Automatically Inspecting Thin Ceramics For Pinholes

Proposed apparatus for inspecting prefired ceramic materials detects minute flaws that might escape ordinary visual inspections. Method detects flaws and marks locations. Intended for such thin ceramic parts as insulation in capacitors and some radio-frequency filters.

Honaker, James R.

Casting Of Multilayer Ceramic Tapes

Procedure for casting thin, multilayer ceramic membranes, commonly called tapes, involves centrifugal casting at accelerations of 1,800 to 2,000 times normal gravitational acceleration. Layers of tape cast one at a time on top of any previous layer or layers. Each layer cast from slurry of ground ceramic suspended in mixture of solvents, binders, and other components. Used in capacitors, fuel cells, and electrolytic separation of oxygen from air.

Collins, Earl R., Jr.

Embedded Resistors and Capacitors in Organic and Inorganic Substrates

Embedded resistors and capacitors were purchased from two technology; organic PWB and inorganic low temperature co-fire ceramic (LTCC). Small groups of each substrate were exposed to four environmental tests and several characterization tests to evaluate their performance and reliability. Even though all passive components maintained electrical performance throughout environmental testing, differences between the two technologies were observed. Environmental testing was taken beyond manufacturers' reported testing, but general not taken to failure. When possible, data was quantitatively compared to manufacturer's data.

printed circuit board (PCB)

Sol-gel Technology and Advanced Electrochemical Energy Storage Materials

Advanced materials play an important role in the development of electrochemical energy devices such as batteries, fuel cells, and electrochemical capacitors. The sol-gel process is a versatile solution for use in the fabrication of ceramic materials with tailored stoichiometry, microstructure, and properties. This processing technique is particularly useful in producing porous materials with high surface area and low density, two of the most desirable characteristics for electrode materials. In addition,the porous surface of gels can be modified chemically to create tailored surface properties, and inorganic/organic micro-composites can be prepared for improved material performance device fabrication. Applications of several sol-gel derived electrode materials in different energy storage devices are illustrated in this paper. V2O5 gels are shown to be a promising cathode material for solid state lithium batteries. Carbon aerogels, amorphous RuO2 gels and sol-gel derived hafnium compounds have been studied as electrode materials for high energy density and high power density electrochemical capacitors.

Chung-tse Chu

Advanced Power Electronics Components

This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

Schwarze, Gene E.