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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Development and evaluation of die and container materials

Commercial high purity ultrafine Si3N4, Al2O3, and SiO2 powders were vacuum dried and stored under nitrogen in sealed containers. Extensive analysis of the chemical, physical, and morphological characteristics of these powders was performed. The interaction of molten silicon with fused quartz was examined in a Knudsen cell using a mass spectrometer. The solubility of oxygen at the melting point of silicon was calculated to be 1.78 times 10 to the 18th power atoms/cu cm, and the activity coefficients of oxygen and silicon monoxide, the major vapor species, were calculated to be 4.83 times 10 to the minus 24th power and 0.0000701, respectively.

Wills, R. R.↗

Until the sun dies

This book gives a popular account of the forces that have shaped human beings into their present form and created the power of human intelligence, and considers the prospects for intelligent life on other planets in the solar system and elsewhere in the universe. The chain of events leading from the big bang to the origin of life on earth is reviewed together with the observations that established the expansion of the universe. Philosophical difficulties with the concept of a universe that has both a beginning and an end are pondered, steady-state cosmology is briefly explained, and the discovery of the relict microwave background is discussed. The formation of the solar system is recounted along with the scientific view of the origin of terrestrial life. Attention is given to the origin of cells and the evolution of oxygen-breathing life, multicelled creatures, armored animals, fishes, amphibians, early reptiles, dinosaurs, and mammals. The development of mammalian intelligence is traced from the early tree dwellers through monkeys, apes, ape men, humanoid tool makers, and primitive members of the genus Homo, to Homo sapiens. Possible evidence for the existence of life on Mars is evaluated together with prospects for communication or other contact with extraterrestrial intelligence.

Jastrow, R.↗

Study program to develop and evaluate die and container materials for the growth of silicon ribbons

The development and evaluation of proprietary coatings of pure silicon carbide, silicon nitride, and aluminum nitride on less pure hot pressed substrates of the respective ceramic materials, is described. Silicon sessile drop experiments were performed on coated test specimens under controlled oxygen partial pressure. Prior to testing, X-ray diffraction and SEM characterization was performed. The reaction interfaces were characterized after testing with optical and scanning electron microscopy and Auger electron spectroscopy. Increasing the oxygen partial pressure was found to increase the molten silicon contact angle, apparently because adsorbed oxygen lowers the solid-vapor interfacial free energy. It was also found that adsorbed oxygen increased the degree of attack of molten silicon upon the chemical vapor deposited coatings. Cost projections show that reasonably priced, coated, molten silicon resistant refractory material shapes are obtainable.

Addington, L. A.↗

Selecting Flatpack Lead-Forming Dies

Optical instrument accurately records unformed lead offset for each flatpack and provides better fit of flatpack to printed wiring board.

Choate, E. L.↗

An Analysis and Classification of Dying AGB Stars Transitioning to Pre-Planetary Nebulae

The principal objective of the project is to understand part of the life and death process of a star. During the end of a star's life, it expels its mass at a very rapid rate. We want to understand how these Asymptotic Giant Branch (AGB) stars begin forming asymmetric structures as they start evolving towards the planetary nebula phase and why planetary nebulae show a very large variety of non-round geometrical shapes. To do this, we analyzed images of just-forming pre-planetary nebula from Hubble surveys. These images were run through various image correction processes like saturation correction and cosmic ray removal using in-house software to bring out the circumstellar structure. We classified the visible structure based on qualitative data such as lobe, waist, halo, and other structures. Radial and azimuthal intensity cuts were extracted from the images to quantitatively examine the circumstellar structure and measure departures from the smooth spherical outflow expected during most of the AGB mass-loss phase. By understanding the asymmetrical structure, we hope to understand the mechanisms that drive this stellar evolution.

mass loss↗

Sphene Emotional: How Titanite Was Shocked When the Dinosaurs Died

Accessory mineral geochronometers such as zircon, monazite, baddeleyite, and xenotime are increasingly being recognized for their ability to preserve diagnostic microstructural evidence of hypervelocity processes. However, little is known about the response of titanite to shock metamorphism, even though it is a widespread accessory phase and U-Pb geochronometer. Here we report two new mechanical twin modes in titanite within shocked granitoids from the Chicxulub impact structure, Mexico. Titanite grains in the newly acquired International Ocean Discovery Program Site expedition 364 M0077A core preserve multiple sets of polysynthetic twins, most commonly with composition planes (K1), = ~{1̅11}, and shear direction (η1) = <110>, and less commonly with the mode K1 = {130}, η1 = ~<522>. In some grains, {130} deformation bands have formed concurrently with shock twins, indicating dislocation glide with Burgers vector b = [341] can be active at shock conditions. Twinning of titanite in these modes, the presence of planar deformation features in shocked quartz, and lack of diagnostic shock microstructures in zircon in the same samples highlights the utility of titanite as a shock indicator for a shock pressure range between ~12 and ~17 GPa. Given the challenges of identifying ancient impact evidence on Earth and other bodies, microstructural analysis of titanite is here demonstrated to be a new avenue for recognizing impact deformation in materials where other impact evidence may be erased, altered, or did not manifest due to low shock pressure.

Timms, Nicholas E.↗

Ultra-Thin, Flexible Electronics

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.

electronics packaging↗

Method and apparatus for providing thermal wear leveling

Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

Roberts, David A.↗

Thick film silicon growth techniques

Silicon ribbon growth experiments were conducted using orifices (dies) fabricated from SiC-SiO2 mixtures, fused quartz, SiC, and fine-grained, high density graphite. The best results were obtained from graphite dies. A number of different approaches was tried in modifying the thermal gradient in the dies and in holding the dies. The best results here were obtained from a 0.25-in. thick Mo disc holding a graphite die directly and fitting the die quite closely. Ribbon growths as wide as 9 mm were obtained, while the longest ribbon was 450 x 3.5 x 0.5 mm. Resistivities of ribbons grown from graphite dies have been measured over the range of 0.03 to 1.6 ohm-cm. Some thoughts and literature findings are presented regarding refractory oxide materials as potential orifices.

Bates, H. E.↗

Process for preparing tapes from thermoplastic polymers and carbon fibers

The instant invention involves a process for use in preparing tapes or rovings, which are formed from a thermoplastic material used to impregnate longitudinally extended bundles of carbon fibers. The process involves the steps of (a) gas spreading a tow of carbon fibers; (b) feeding the spread tow into a crosshead die; (c) impregnating the tow in the die with a thermoplastic polymer; (d) withdrawing the impregnated tow from the die; and (e) gas cooling the impregnated tow with a jet of air. The crosshead die useful in the instant invention includes a horizontally extended, carbon fiber bundle inlet channel, means for providing melted polymer under pressure to the die, means for dividing the polymeric material flowing into the die into an upper flow channel and a lower flow channel disposed above and below the moving carbon fiber bundle, means for applying the thermoplastic material from both the upper and lower channels to the fiber bundle, and means for withdrawing the resulting tape from the die.

Chung, Tai-Shung↗

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Le, Binh Q.↗

Behavior of the Aurora During the 10-12 May, 1999 When the Solar Wind Nearly Disappeared

We show that die aurora was still active with occasional pseudo breakup events when die solar wind density diminished to unusually small densities during May 10-12, 1999. The aurora was observed at high magnetic latitudes indicating that the electron precipitation source moved northward as die soar wind and geomagnetic activities decreased. These features are well known and seen at other times when the geomagnetic activities are weak. Intense auroral events accompanied other periods of low solar wind density (for example, February 10, 1997 and May 5,1998) indicating that the solar wind density alone is not die primary parameter that controls die auroral activity. However, a new auroral feature was observed on May, 11, 1999 during approx. 09-20 LIT hours. The electron precipitation was energetic, uniform and covered the polar latitudes commonly identified as die polar cap region. This precipitation lasted form ore that 10 hours and was stable over time scales of tens of minutes. On May 12, as the solar wind began to recover, a prolonged period of dayside activity occurred and was subsequently followed by a "typical" aurora at approx. 05 UT. All of the auroral activities occurred accompanying weak auroral electrojet activity (approx. 150 nT maximum).

Parks, G. K.↗

Orbital tube flare for tubing connectors

Marshall engineering personnel have developed and are now refining a new and unique method of mechanically flaring tubing. The system eliminates the use of the conventional split backing die which is used with most tube-flaring equipment. The Marshall-developed tool is adapted for use on standard Leonard 3-CP-HD flaring machines. The stationary split backing die is replaced in function with a die ring, whose i.d.-surface rolls or orbits around the o.d. of the tube flare zone. An i.d.-flaring cone moves axially and forces the metal against the rolling die to form the flare. Major advantages of this system are the elimination of flash, or split die marks, on the back angle of the flare, and improved flare-surface finishes, permitting more uniform sealing characteristics and improvements of the total geometric configuration of the flare as required by the MSFC specification MC-146. The Orbital Adapter system of tooling is currently being used to manufacture flared tube hardware for the Saturn V S-IO space launch vehicle at MSFC, for the Agena space launch vehicle (used for the Gemini project) at Lockheed, Sunnyvale, for LEM checkout equipment for Grumman, and for the Saturn S-IV-B space launch vehicle by Douglas Aircraft Company. Several other aerospace firms are evaluating the system for possible incorporation on their tube flaring requirements. Marshall engineers are now concentrating their efforts on refining and reducing the total cost of the overall system.

Tubing↗