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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

A Low-Power 1 Gb/s Line Driver with Configurable Pre-Emphasis for Lossy Transmission Lines

A line driver with configurable pre-emphasis is implemented in a 65 nm CMOS process. The driver utilizes a three-tap feed-forward equalization (FFE) architecture. The relative delays between the taps are selectable in increments of 1/16th of the unit interval (UI) via an 8-stage delay-locked loop (DLL) and digital interpolator. It is also possible to control the output amplitude and source impedance for each tap via a programmable array of eight source-series terminated (SST) drivers. The entire design consumes 9 mW from a 1.2 V supply at 1 Gb/s.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

The LED calibration systems for the mDOM and D-Egg sensor modules of the IceCube Upgrade: Design, production, testing and use in module calibration

The IceCube Neutrino Observatory, instrumenting about 1 km 3 of deep, glacial ice at the geographic South Pole, is due to be enhanced with the IceCube Upgrade. The IceCube Upgrade, to be deployed during the 2025/26 Antarctic summer season, will consist of seven new strings of photosensors, densely embedded near the bottom center of the existing array. Aside from a world-leading sensitivity to neutrino oscillations, a primary goal is the improvement of the calibration of the optical properties of the instrumented ice. This calibration will be applied to the entire archive of IceCube data, improving the angular and energy resolution of the detected neutrino events. For this purpose, the Upgrade strings include a host of new calibration devices. Aside from dedicated calibration modules, several thousand LED flashers have been incorporated into the photosensor modules. We describe the design, production, and testing of these LED flashers before their integration into the sensor modules as well as the use of the LED flashers during lab testing of assembled sensor modules.

Analogue electronic circuits↗
DOE OSTI2025

Ferroelectric materials toward next-generation electromechanical technologies

Ferroelectric materials have been widely used in various electromechanical devices, from ultrasonic transducers and actuators to mechanical energy harvesters. The key performance metrics of these devices, such as sensitivity, efficiency, and bandwidth of ultrasonic transducers, are largely determined by the piezoelectric properties. This Review highlights recent research progress in improving the piezoelectricity of ferroelectric materials and offers potential strategies for further enhancement to meet the ever-increasing demands for high-performance piezoelectric devices and systems. Here, it provides insights into the future development of ferroelectrics to address the increasing demands of emerging applications, including photoacoustic imaging and piezoelectric fans and motors in integrated circuit–enabled electronic devices. Additionally, it emphasizes the need to consider environmental impacts across the entire life cycle of ferroelectrics, from sourcing and manufacturing to usage and disposal.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Characterization of suspended membrane waveguides towards a photonic atom trap integrated platform

We demonstrate an optical waveguide device, capable of supporting the high, in-vacuum, optical power necessary for trapping a single atom or a cold atom ensemble with evanescent fields. Our photonic integrated platform, with suspended membrane waveguides, successfully manages optical powers of 6 mW (500 μ m span) to nearly 30 mW (125 μ m span) over an un-tethered waveguide span. This platform is compatible with laser cooling and magneto-optical traps (MOTs) in the vicinity of the suspended waveguide, called the membrane MOT and the needle MOT, a key ingredient for efficient trap loading. We evaluate two novel designs that explore critical thermal management features that enable this large power handling. This work represents a significant step toward an integrated platform for coupling neutral atom quantum systems to photonic and electronic integrated circuits on silicon.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Wafer-level handle replacement

A wafer includes a number of die, with each die including electronic integrated circuits and optical devices. The wafer has a top surface and a bottom surface and a base layer. The bottom surface of the wafer corresponds to a bottom surface of the base layer. A wafer support system is attached to the top surface of the wafer. A thickness of the base layer is removed to expose a target layer within the wafer and to give the wafer a new bottom surface. A replacement handle structure is attached to the new bottom surface of the wafer. The replacement handle structure includes a first thickness region and a second thickness region. The first thickness region is positioned closest to the new bottom surface. The first thickness region is formed of an optical cladding material that mitigates optical coupling between optical devices within the die and the replacement handle structure.

Meade, Roy Edward↗
DOE OSTI2023

Superconducting bilayers of two-dimensional materials with integrated Josephson junctions

Josephson junctions (JJ) based on bilayers of azimuthally misaligned two-dimensional materials having superconducting states are provided. Also provided are electronic devices and circuits incorporating the JJs as active components and methods of using the electronic devices and circuits. The JJs are formed from bilayers composed of azimuthally misaligned two-dimensional materials having a first superconducting segment and a second superconducting segment separated by a weak-link region that is integrated into the bilayer.

Lagally, Max G.↗
DOE OSTI2024

LINAC Electrical Cabinet - Structural Analysis

Along LINAC s downstream path is a floor containing various cabinets above the LINAC. Of the dozens of cabinets are 4 specific cabinet types: PFN (pulse-forming network) Module, PFN Power Supply, Water Skid, and Marx. Each of these cabinets may contain some of the various contents that include electronics, wiring, circuits, and conduits. In addition, high voltage and low conductivity water (LCW) piping are also present within the cabinets. Occasionally, Lab Technicians perform maintenance and inspections of the cabinets and need to access every part, including the top section that is subject to the weight of the technician standing on top. To ensure the cabinet is structurally safe, a CAD model was developed for each cabinet and a Finite Element Analysis (FEA) was performed on each cabinet to confirm it is safe to stand on.

Blas, Efren↗
DOE OSTI2021

Mediated electrochemistry for redox-based biological targeting: entangling sensing and actuation for maximizing information transfer

Biology and electronics are both expert at receiving, analyzing, and responding to information, yet they use entirely different information processing paradigms. Biology processes information using networks that are intrinsically molecular while electronics process information through circuits that control the flow of electrons. There is great interest in coupling the molecular logic of biology with the electronic logic of technology, and we suggest that redox (reduction-oxidation) is a uniquely-suited modality for interfacing biology with electronics. Specifically, redox is a native biological modality and is accessible to electronics through electrodes. Here, we summarize recent advances in mediated electrochemistry to direct information transfer into biological systems intentionally altering function, exposing it for more advanced interpretation, which can dramatically expand the biotechnological toolbox.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2023

Spectroscopy of Degenerate One-Dimensional Electrons in Carbon Nanotubes (Final Report)

The goal of this research program was to understand the fundamental properties of degenerate one-dimensional (1-D) electrons in single-wall carbon nanotubes (SWCNTs). SWCNTs provide an ideal 1-D environment in which to study many-body physics. Semiconducting SWCNTs exhibit rich optical spectra dominated by extremely stable 1-D excitons, whereas metallic SWCNTs contain massless 1-D carriers with ultralong mean-free paths. Despite the large number of electrical, optical, and magnetic studies of SWCNTs during the last two decades, most of the predicted exotic properties of interacting 1-D electrons have yet to be observed, and some reported experimental results remain highly controversial. Here, we report on our research projects for the last 16 years summarizing spectroscopy on SWCNTs using an arsenal of spectroscopic methods from the terahertz to the visible spectral range, including ultrafast optical spectroscopy and ultrahigh magnetic fields. These studies provided a wealth of new insights into the nature of strongly correlated carriers in the ultimate 1-D limit that will lead to novel nanodevice concepts and implementations. Particular emphasis was placed on dynamical 1-D phenomena in the terahertz, infrared, and optical frequency ranges. Because SWCNTs are direct-band-gap materials, they are one of the leading candidates to unify electronic and optical functions in nanoscale circuits and elucidate how electron correlations can affect and control finite-frequency phenomena in 1-D systems. As a result, we have published 78 research articles (Web of Science), including ten reviews and book volumes/chapters. Below, we highlight and summarize several accomplishments that provided new insights into the fundamental properties of1-D carriers, excitons, and phonons of SWCNTs.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2023

On-the-fly computation of analog mixed-signal (AMS) measurements

The present disclosure generally relates to an analog mixed-signal (AMS) design verification system. In particular, the present disclosure relates to a system and method for system verification. One example method includes: obtaining an electronic representation of the circuit design; generating at least a portion of a waveform using the electronic representation of the circuit to obtain a first segment of the waveform associated with the circuit; converting, via the one or more processors, one or more measurement functions to code for performing the one or more computations on the first segment of the waveform; performing one or more computations on the first segment of the waveform using the code; and identifying when a behavior of the circuit violates a design specification based on whether a result of the one or more computations meets a threshold.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2020

Xyce Case Study

With the elimination of underground nuclear testing and declining defense budgets, science-based stockpile stewardship requires increased reliance on high performance modeling and simulation of weapon systems. Today's weapon systems are comprised of various electrical components and systems. As a result, there is a need for tools that will allow the use of massively parallel modeling and simulation techniques on high performance computers in existing and future weapons' electrical systems models. The Xyce Parallel Electronic Simulator is a SPICE (Simulation Program with Integrated Circuit Emphasis)- compatible circuit simulator designed to run on large-scale parallel computing platforms, though it can also execute efficiently on a variety of architectures including single processor workstations. As a mature platform for large-scale parallel circuit simulation, Xyce supports standard capabilities available in commercial simulators, in addition to various devices and models specific to Sandia's needs. Specifically, Xyce aids in the design and verification of electrical and electronic circuits and systems prior to weapons' manufacturing and deployment.

45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEF↗
DOE OSTI2020

Xyce Case Study

With the elimination of underground nuclear testing and declining defense budgets, science-based stockpile stewardship requires increased reliance on high performance modeling and simulation of weapon systems. Today's weapon systems are comprised of various electrical components and systems. As a result, there is a need for tools that will allow the use of massively parallel modeling and simulation techniques on high performance computers in existing and future weapons' electrical systems models. The Xyce Parallel Electronic Simulator is a SPICE (Simulation Program with Integrated Circuit Emphasis)- compatible circuit simulator designed to run on large-scale parallel computing platforms, though it can also execute efficiently on a variety of architectures including single processor workstations. As a mature platform for large-scale parallel circuit simulation, Xyce supports standard capabilities available in commercial simulators, in addition to various devices and models specific to Sandia's needs. Specifically, Xyce aids in the design and verification of electrical and electronic circuits and systems prior to weapons' manufacturing and deployment.

45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEF↗
DOE OSTI2025

Time-tagging data acquisition system for testing superconducting electronics based on an RFSoC and custom analog frontend

Novel electronic devices can often be operated in a plethoraof ways, which makes testing circuits comprised of them difficult.Often, no single tool can simultaneously analyze the operatingmargins, maximum speed, and failure modes of a circuit, particularlywhen the intended behavior of subcomponents of the circuit is notstandardized. This work demonstrates a cost-effective time-domaindata acquisition system for electronic circuits that enables moreintricate verification techniques than are practical withconventional experimental setups. We use high-speeddigital-to-analog converters and real-timemulti-gigasample-per-second waveform processing to push experimentalcircuits beyond their maximum operating speed. Our customtime-tagging data capture firmware reduces memory requirements andcan be used to determine when errors occur. The firmware iscombined with a thermal-noise-limited analog frontend with50 dB of dynamic range. Compared to currentlyavailable commercial test equipment that is seven times moreexpensive, this data acquisition system was able to operate asuperconducting shift register at a nearly three-times-higher clockfrequency (200 MHz vs. 80 MHz).

Foster, Reed A. [MIT] (ORCID:0000000231002127)↗
DOE OSTI2022

The CMS Barrel Calorimeter Processor demonstrator (BCPv1) board evaluation

For the CERN LHC phase 2, the barrel region of the CMS electromagnetic (ECAL EB) and hadronic calorimeters (HCAL HB) require new back-end electronics for their readout. To this purpose, a first version of the ATCA-based blade, the Barrel Calorimeter Processor (BCPv1), has been developed. The performance of the optical links as well as clock distribution are also presented here. Here, the BCPv1 has been tested together with front-end and trigger boards, as well as with the new DAQ and TCDS Hub (DTH) [1], to demonstrate that the BCPv1 meets the required specifications.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils

Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential to measure the thermal interfacial resistance (TIR) across ~1 µm to 100 µm junctions. Previously reported TIR of metal–polymer junctions utilize ASTM E1530-based two-block systems that measure the TIR by applying pressure across the interface through external heating and cooling blocks. Here, we report a novel modification of the ASTM-E1530 technique that employs integrated heaters and sensors to provide an intrinsic TIR measurement of an adhesively bonded metal–polymer junction. We design the measurement technique using finite element simulations to either passively suppress or actively compensate the lateral heat diffusion through the polymer, which can minimize the systematic error to ≲5%. Through proof-of-concept experiments, we report the TIR of metal–polymer interfaces made from DuPont’s Pyralux double-side copper-clad laminates, commonly used in flexible printed circuit boards. Our TIR measurement errors are <10%. We highlight additional sources of errors due to non-idealities in the experiment and discuss possible ways to overcome them. Our measurement technique is also applicable to interfaces that are electrically insulating such as adhesively joined metal–metal junctions and sputter-coated or welded metal–polymer junctions. Altogether, the technique is capable of measuring TIR ≳10 –5 m 2 KW –1 in bonded metal–polymer foils and can be tailored for in situ measurements in flexible electronics, circuit packaging, and other hybrid metal–polymer systems.

47 OTHER INSTRUMENTATION↗
DOE OSTI2024

Theoretical Coupling of Free-Flowing Ions and Magnetically Insulated Electrons

Magnetic insulation of electrons prevents losses and can be applied to generating radiation or electron sources for high current and high power applications. Ion emission from the anode may degrade magnetic insulation. We develop equilibrium theory, self-consistently coupling magnetically insulated electron flow with free-flowing injected ions. Generally, ion injection is self-limiting from space charge; however, once insulation strength drops below about 1.2x the magnetic insulation threshold, ion space-charge limits vanish. Further, the gap effectively short-circuits and the electron flow layer asymptotically approaches the anode. In this regime a quasineutral, nonthermal plasma manifests, effectively reducing gap distance and suggesting quasiequilibrium gap closure evolution.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2021

SIR Glass Test Vehicle Designed to Characterize Process Materials

The exposure to harsh environments can result in reliability issues on highly dense electronic packages and circuit assemblies. One area of concern is electrochemical failure mechanisms caused by electrolytic corrosion, electrochemical migration (dendrites), and leakage currents under humid conditions. These no-fault and no-trouble found failure points are challenging to detect and to perform process control during the assembly process. The focus of this research centers on metallizing glass surface insulation resistance test vehicles to characterize materials on electronic packages and components that exhibit the highest risk of failure due to material interactions and process residues. Glass test vehicles provide a visual representation of materials when they are exposed to moisture content in the air. Harsh environments can cause material interactions resulting in morphology changes, opening, and release of active components. A transparent test vehicle is highly functional for environmental stress testing under temperature, humidity, and bias. The designed experiment will evaluate the effects of material and process residues that can undergo changes in behavior during application, which leads to local failures.

Capen, Bill↗
DOE OSTI2021

A Study of Integrated Signal and Power Transfer for Compact Isolated SiC MOSFET Gate-Drivers

This work discusses a novel set of alternate implementations of isolated gate driver circuits for power electronic transistors. The proposed topologies for the driver have been designed specifically for SiC power MOSFET. Three different solutions are discussed, all of them providing the required gate turn-on and turn-off command signal with galvanic isolation, but also supplying power to the secondary side of the driver by means of magnetic transformers. The resulting solutions, all of them implemented with simple circuitry, enable the integration of the driver into the power cell, allowing for theoretical higher power density values in the final system. The principle of operation of the different solutions is discussed, and then the main relevant implementation details are presented. After that, the operation of the circuits is demonstrated experimentally, by testing a set of prototypes of these drivers. This provides a comprehensive design example that assesses the feasibility of the proposed solutions. Finally, the main results of the performance of the three gate drivers, on an SiC MOSFET-based prototype are presented and compared.

42 ENGINEERING↗