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DOE OSTI2024

A Cryogenic readout integrated circuit with analog pile-up and in-Pixel ADC for high frame rate Skipper CCD-in-CMOS Sensors

The Skipper CCD-in-CMOS Parallel Read-Out Circuit V2 (SPROCKET2) is designed to enable high frame rate readout of Skipper CCD-in-CMOS image sensors. The SPROCKET2 pixel is fabricated in a 65 nm CMOS process and occupies a 60$\mu$m $\times$ 60$\mu$m footprint. SPROCKET2 is intended to be heterogeneously integrated with a pixelated Skipper CCD-in-CMOS sensor, such that one readout pixel is connected to a multiplexed array of 16 active image sensor pixels, to match their spatial geometry. Our design benefits from the Skipper CCD-in-CMOS sensor's non-destructive readout capability to achieve exceptionally low noise through multi-sampling and averaging while optimizing for total power consumption. The pixel readout utilizes correlated double sampling to minimize 1/f noise and includes "pile-up" of ten successive samples in the analog domain before digitizing at a rate of 66.7 ksps. Measurement results of in-pixel serial SAR ADC show DNL and INL of ~0. 44 LSB and 0.58 LBS respectively. A large area array of 20,000 SPROCKET2 ADC pixels (multiplexed 1:16 to 320,000 sensor pixels) is currently under test. By reading out data over a 10 Gbps optical link, this pixel design enables a frame rate of $\sim$ 4 kfps for large sensing areas with minimal sensing deadtime. In the highest gain mode, the pixelated ADC has an input-referred resolution of 10$\mu$V with a simulated power consumption of 50$\mu$W. The pixel operates with constant current draw to minimize power-rail crosstalk.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2020

Two-Step Patterning of Scalable All-Inorganic Halide Perovskite Arrays

Halide perovskites have many important optoelectronic properties, including high emission efficiency, high absorption coefficients, color purity, and tunable emission wavelength, which makes these materials promising for optoelectronic applications. However, the inability to precisely control large-scale patterned growth of halide perovskites limits their potential toward various device applications. Here, we report a patterning method for the growth of a cesium lead halide perovskite single crystal array. Our approach consists of two steps: (1) cesium halide salt arrays patterning and (2) chemical vapor transport process to convert salt arrays into single crystal perovskite arrays. Characterizations including energy-dispersive X-ray spectroscopy and photoluminescence have been employed to confirm the chemical compositions and the optical properties of the as-synthesized perovskite arrays. This patterning method enables the patterning of single crystal cesium lead halide perovskite arrays with tunable spacing (from 2 to 20 μm) and crystal size (from 200 nm to 1.2 μm) in high production yield (almost every pixel in the array is successfully grown with converted perovskite crystals). Furthermore, our large-scale patterning method renders a platform for the study of fundamental properties and opportunities for perovskite-based optoelectronic applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2024

Smart pixel sensors Towards on-sensor filtering of pixel clusters with deep learning

High granularity silicon pixel sensors are at the heart of energy frontier particle physics collider experiments. At an collision rate of 40\,MHz, these detectors create massive amounts of data. Signal processing that handles data incoming at those rate and intelligently reduces the data within the pixelated region of the detector \textit{at rate} will enhance physics performance and enable physics analyses that are not currently possible. Using the shape of charge clusters deposited in an array of small pixels, the physical properties of the traversing particle can be extracted with locally customized neural networks. In this first work, we present a neural network that can be embedded into the on-sensor readout and filter out hits from low momentum tracks, reducing the detector's data volume by 54.4-75.4\%. The network is designed and simulated as a custom readout integrated circuit with 28\,nm CMOS technology and is expected to operate at less than 300\,$\mu W$ with an area of less than 0.2\,mm$^2$.

43 PARTICLE ACCELERATORS↗

DOE OSTI2024

Smart pixel sensors: towards on-sensor filtering of pixel clusters with deep learning

Highly granular pixel detectors allow for increasingly precise measurements of charged particle tracks. Next-generation detectors require that pixel sizes will be further reduced, leading to unprecedented data rates exceeding those foreseen at the High- Luminosity Large Hadron Collider. Signal processing that handles data incoming at a rate of $\mathcal{O}$(40 MHz) and intelligently reduces the data within the pixelated region of the detector at rate will enhance physics performance at high luminosity and enable physics analyses that are not currently possible. Using the shape of charge clusters deposited in an array of small pixels, the physical properties of the traversing particle can be extracted with locally customized neural networks. In this first demonstration, we present a neural network that can be embedded into the on-sensor readout and filter out hits from low momentum tracks, reducing the detector's data volume by 57.1%–75.7%. The network is designed and simulated as a custom readout integrated circuit with 28 nm CMOS technology and is expected to operate at less than 300 μW with an area of less than 0.2 mm 2 . The temporal development of charge clusters is investigated to demonstrate possible future performance gains, and there is also a discussion of future algorithmic and technological improvements that could enhance efficiency, data reduction, and power per area.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2020

Evaporated Se x Te 1-x Thin Films with Tunable Bandgaps for Short-Wave Infrared Photodetectors

Semiconducting absorbers in high-performance short-wave infrared (SWIR) photodetectors and imaging sensor arrays are dominated by single-crystalline germanium and III-V semiconductors. However, these materials require complex growth and device fabrication procedures. In this work, thermally evaporated Se x Te 1- x alloy thin films with tunable bandgaps for the fabrication of high-performance SWIR photodetectors are reported. From absorption measurements, it is shown that the bandgaps of Se x Te 1- x films can be tuned continuously from 0.31 eV (Te) to 1.87 eV (Se). Owing to their tunable bandgaps, the peak responsivity position and photoresponse edge of Se x Te 1- x film-based photoconductors can be tuned in the SWIR regime. By using an optical cavity substrate consisting of Au/Al 2 O 3 to enhance its absorption near the bandgap edge, the Se 0.32 Te 0.68 film (an optical bandgap of ≈0.8 eV)-based photoconductor exhibits a cut-off wavelength at ≈1.7 μm and gives a responsivity of 1.5 AW -1 and implied detectivity of 6.5 × 10 10 cm Hz 1/2 W -1 at 1.55 μm at room temperature. Importantly, the nature of the thermal evaporation process enables the fabrication of Se 0.32 Te 0.68 -based 42 × 42 focal plane arrays with good pixel uniformity, demonstrating the potential of this unique material system used for infrared imaging sensor systems.

36 MATERIALS SCIENCE↗

DOE OSTI2019

MagMicro with Ultra-High Energy Resolution (FY19 Q3 Progress Report)

The fabrication of the MMC detector arrays involves two photolithographic procedures. The first is to fabricate the Nb magnetization coil and pick-up coils, the SQUID preamplifiers and the associated wiring. This is done on a full 4” Si wafer, which is subsequently diced into ~0.5 cm2 SQUID chips and ~1 cm2 detector chips. The detector chips are then processed separately by depositing and patterning the paramagnetic Ag:Er sensor and support structures and then electroplating the Au absorber. In Q3, we have successfully completed the full wafer processing for the 32-pixel MMC detector arrays, diced the 4” wafer into the smaller chips and tested the individual components. The coils have the required critical current, the heat switches have a critical temperature in the desired range, and the SQUIDs have the required low noise. Unfortunately, the sputter deposition of the paramagnetic Ag:Er sensor failed several times. We spent considerable time to trace the problem to contaminations of the purifier for the Ar sputtering gas that had been exposed to atmosphere for an extended time during an earlier clean room upgrade. We then determined that the purifier is not essential for high-quality Ag:Er sensor films (Fig. 1), and successfully deposited the Ag:Er sensor film on the ~1 cm 2 detector chip.

42 ENGINEERING↗

DOE OSTI2025

Ultra‐Flexible Pixelated Perovskite Photodetectors Enabled by Honeycomb Polymer Grids for High‐Resolution Imaging

Abstract A nature‐inspired fabrication method based on a photolithography‐free flexible polymer grid is reported for high‐resolution pixelation of perovskite photodiode arrays with exceptional mechanical ductility and a morphology resembling that of natural compound eyes. The resulting pixelated perovskite photosensitive layer has a ≈1 µm pixel size with 2000 Pixels per inch (PPI) resolution when fully assembled as a photodetector array, delivering a detectivity of >10 13 Jones while providing cross‐talk free imaging. Using a polymer grid effectively releases stress on the perovskite platform, greatly increasing the mechanical agility of the otherwise brittle perovskite film. This novel fabrication methodology and device design offer new possibilities for applications in robotics, biomedical imaging, and virtual and augmented reality.

Zheng, Ding [Department of Chemistry and the Mater↗

DOE OSTI2018

BRAHMS-Sensitive Bolometer Arrays for the SPICA Imaging Polarimetry

A high-sensitivity cryogenic sub-millimetre camera is planned for the SPICA space observatory. At the heart of this instrument, new all-silicon bolometer arrays integrate in pixel instrumental polarimetry capabilities.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2018

Development of Superconducting Tunnel Junction Far-Infrared Photon Detector for Cosmic Background Neutrino Decay Search - COBAND experiment

We present the status of development of the Superconducting Tunnel Junction (STJ) detector for the COsmic BAckground Neutrino Decay search (COBAND) experiment. The signal of the cosmic background neutrino decay is identified as a sharp cutoff at high energy end in a far-infrared region ranging from 15meV to 30meV in the energy spectrum of the photons from the space. The COBAND experiment will be done as rocket and satellite experiments in order to detect the far-infrared photons from the space. For the photon detector of the COBAND experiment, we are developing the STJ detectors. We will use a combination of the diffraction grating and the array of Nb/Al-STJ pixels with cryogenic amplifier for the rocket experiment, and use Hf-STJ without a grating for the future satellite experiment. The present status of the detector R&D and the experimental design for the COBAND experiment is reported.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2020

Retinal-inspired method and system for improved detection

The present disclosure provides a method and device for filtering sensor data. Signals from an array of sensor pixels are received and checked for changes in pixel values. Motion is detected based on the changes in pixel values, and motion output signals are transmitted to a processing station. If the sum of correlated changes in pixel values across a predetermined field of view exceeds a predetermined value, indicating sensor jitter, the motion output signals are suppressed. If a sum of motion values within a defined subsection of the field of view exceeds a predetermined threshold, indicating the presence of a large object of no interest, the motion output signals are suppressed for that subsection.

42 ENGINEERING↗

DOE OSTI2022

System, apparatus, and method for determining elemental composition using 4D STEM

The present disclosure relates to transmission electron microscopy for evaluation of biological matter. According to an embodiment, the present disclosure further relates to an apparatus for determining the structure and/or elemental composition of a sample using 4D STEM, comprising a direct bombardment detector operating with global shutter readout, processing circuitry configured to acquire images of bright-field disks using either a contiguous array or non-contiguous array of detector pixel elements, correct distortions in the images, align each image of the images based on a centroid of the bright-field disk, calculate a radial profile of the images, normalize the radial profiles by a scaling factor, calculate the rotationally-averaged edge profile of the bright-field disk, and determine elemental composition within the specimen based on the characteristics of the edge profile of the bright-field disk corresponding to each specimen location.

Bammes, Benjamin↗

DOE OSTI2024

Signatures of Thermal and Electrical Crosstalk in a Microwave Multiplexed Hard X-ray Transition Edge Sensor Array

We investigate the crosstalk between Transition-Edge Sensor (TES) pixels in a 24-pixel hard X-ray spectrometer array fabricated at the Advanced Photon Source, Argonne National Laboratory. Analysis shows thermal cross talk, possibly associated with insufficient thermalization, and rare but larger in magnitude electrical crosstalk between specific perpetrator-victim pixel combinations, potentially due to defects in the bias wiring or microwave multiplexing circuit. We use a method based on group-triggering and averaging to isolate the crosstalk response despite only having access to X-ray photon illumination uniform across the entire array. This allows us to identify thermal and electrical crosstalk between pixel pairs in repeated measurements to the level of 1 part in 1000 or better. In the array under study, the magnitude of observed crosstalk is small but comparable to the resolving power of this pixel design (E/Delta E similar to\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$E/\Delta {}E \sim$$\end{document} 1000 at 20 keV) and so potentially responsible for a degradation in energy resolution of the array at high incident photon rates. Having proven the methods to identify and quantify crosstalk in our setup, we can now consider mitigations.

Triamkitsawat, Panthita↗

DOE OSTI2022

System Response Characterization for a d–t Neutron Radiography System

We report the system response of a pixelated associated particle imaging (API) neutron radiography system. The detector readout currently consists of a 2x2 array of organic glass scintillator detectors, each with an 8x8 array of optically isolated pixels that match the size and pitch of the ARRAYJ-60035-64P-PCB Silicon Photomultiplier (SiPM) array from SensL/onsemi with 6x6 mm 2 SiPMs. The alpha screen of the API deuterium-tritium neutron generator is read out with the S13361-3050AE-08 from Hamamatsu, which is an 8x8 array of 3x3 mm 2 SiPMs. Data from the 320 channel system is acquired with the TOFPET2-based readout system. We present the predicted imaging capability of an eventual 5x5 detector array, the waveform-based energy and pulse shape characterization of the individual detectors, and the timing and energy response from the TOFPET2 system.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2023

A Cryogenic Readout IC with 100 KSPS in-Pixel ADC for Skipper CCD-in-CMOS Sensors

The Skipper CCD-in-CMOS Parallel Read-Out Circuit (SPROCKET) is a mixed-signal front-end design for the readout of Skipper CCD-in-CMOS image sensors. SPROCKET is fabricated in a 65 nm CMOS process and each pixel occupies a 50$\mu$m $\times$ 50$\mu$m footprint. SPROCKET is intended to be heterogeneously integrated with a Skipper-in-CMOS sensor array, such that one readout pixel is connected to a multiplexed array of nine Skipper-in-CMOS pixels to enable massively parallel readout. The front-end includes a variable gain preamplifier, a correlated double sampling circuit, and a 10-bit serial successive approximation register (SAR) ADC. The circuit achieves a sample rate of 100 ksps with 0.48 $\mathrm{e^-_{rms}}$ equivalent noise at the input to the ADC. SPROCKET achieves a maximum dynamic range of 9,000 $e^-$ at the lowest gain setting (or 900 $e^-$ at the lowest noise setting). The circuit operates at 100 Kelvin with a power consumption of 40 $\mu W$ per pixel. A SPROCKET test chip was submitted in September 2022, and test results will be presented at the conference.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2019

Numerical estimation of photon reabsorption process and optical crosstalk in arrays of HgCdTe photodiodes

The effect of photon reabsorption (recycling) on photoelectric parameters of non-equilibrium P{sup +}nN{sup +} photodiodes, for example the pixels of the detector array, was analyzed. We solved the system of transport equations additionally extended by two balances equations for photons. It was shown that the density of photons in photodiodes is strongly dependent on the concentration of charge carriers. This phenomenon results in a drastic reduction in the rate of radiative recombination and generation in analyzed photodiodes. Additionally, the phenomenon of optical crosstalk between the nearest pixels in the matrix was examined. The increase in the dark current caused by this phenomenon was estimated. It depends on the size of the pixel, the distance between pixels, and the value of bias voltage. The increase in the current is around 0.5% for a pixel with surface 10 × 10 µm{sup 2}, and around 1% for one with 5 × 5 µm{sup 2}, both reverse biased with 0.2 V.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

DOE OSTI2026

Next Generation Ta-STJ Sensor Arrays for BSM Physics Searches

The Beryllium Electron capture in Superconducting Tunnel junctions (BeEST) experiment uses superconducting tunnel junction (STJ) sensors to search for physics beyond the standard model (BSM) with recoil spectroscopy of the 7 Be EC decay into 7 Li. A pulsed UV laser is used to calibrate the STJs throughout the experiment with ∼20 meV precision. Phase-III of the BeEST experiment revealed a systematic calibration discrepancy between STJs. We found these artifacts to be caused by resistive crosstalk and by intensity variations of the calibration laser. For phase-IV of the BeEST experiment, we have removed the crosstalk by designing the STJ array so that each pixel has its own ground wire. We now also use a more stable UV laser for calibration. The new STJ arrays were fabricated at STAR Cryoelectronics and tested at LLNL and FRIB. They have the same high energy resolution of ∼1-2~eV in the energy range of interest below 100~eV as before, and they no longer exhibit the earlier calibration artifacts. We discuss the design changes and the STJ array performance for the next phase of the BeEST experiment.

Laser Calibration↗

DOE OSTI2019

Magnetic Microcalorimeter (MMC) Gamma Detectors with Ultra-High Energy Resolution

The goal of this LCP is to develop ultra-high resolution gamma-ray detectors based on magnetic microcalorimeters (MMCs) for accurate measurements of nuclear decay data and NDA of nuclear materials. For highest energy resolution, we are introducing erbium-doped silver (Ag:Er) as a novel sensor material and implement several geometry and design changes to improve the signal-to-noise ratio. The detector sensitivity will be increased by developing arrays of 32 Ag:Er pixels read out by 16 SQUID preamplifiers, and by developing a cryogenic Compton veto to reduce the spectral background. For highest energy resolution we will operate the MMC detector arrays in a dilution refrigerator with a base temperature <10 mK. The detector performance and utility will be demonstrated with radioactive sources of interest to the safeguards community. In FY16 and FY17, we had purchased a liquid-cryogen-free dilution refrigerator and installed 16 SQUID preamplifiers and writing for MMC detector operation at ~10 mK. We have also developed the process to fabricate the first Ag:Er-based MMCs, built prototype detector arrays and tested them with different radioactive sources. We have also shown that our MMC detectors can achieve the LCP goal of an energy resolution below 50 eV as needed to resolve most closelyspaced lines of interest for NDA. The goals for FY18 were then 1) to optimize the MMC design based on the measured detector characteristics and to increase the array size to 32-pixels for increased sensitivity, and 2) to demonstrate the utility of MMC gamma-ray detectors in applications relevant in nuclear safeguards.

42 ENGINEERING↗

DOE OSTI2023

Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Micro-LEDs (µLEDs) have been explored for augmented and virtual reality display applications that require extremely high pixels per inch and luminance. However, conventional manufacturing processes based on the lateral assembly of red, green and blue (RGB) µLEDs have limitations in enhancing pixel density. Recent demonstrations of vertical µLED displays have attempted to address this issue by stacking freestanding RGB LED membranes and fabricating top-down, but minimization of the lateral dimensions of stacked µLEDs has been difficult. Here we report full-colour, vertically stacked µLEDs that achieve, to our knowledge, the highest array density (5,100 pixels per inch) and the smallest size (4 µm) reported to date. This is enabled by a two-dimensional materials-based layer transfer technique that allows the growth of RGB LEDs of near-submicron thickness on two-dimensional material-coated substrates via remote or van der Waals epitaxy, mechanical release and stacking of LEDs, followed by top-down fabrication. The smallest-ever stack height of around 9 µm is the key enabler for record high µLED array density. We also demonstrate vertical integration of blue µLEDs with silicon membrane transistors for active matrix operation. Furthermore, these results establish routes to creating full-colour µLED displays for augmented and virtual reality, while also offering a generalizable platform for broader classes of three-dimensional integrated devices.

42 ENGINEERING↗