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NASA NTRS1986

Thermally-Activated Metal-to-Glass Bonding

Hermetic seals formed easily by use of metallo-organic film. Metallo-organic film thermally bonded to glass and soldered or welded to form hermetic seal. Film applied as ink consisting of silver neodecanoate in xylene. Relative amounts of ingredients selected to obtain desired viscosity. Material applied by printing or even by scribing with pen. Sealing technique useful in making solar-cell modules, microelectronic packages, and other hermetic silicon devices.

Gallagher, B. D.↗

NASA NTRS2003

Removal of Biologically Active Organic Contaminants using Atomic Oxygen

Biomedical devices that are to come into contact with living tissue, such as prosthetic and other implants for the human body and the containers used to store and transport them, are together cleaned of non-living, but biologically active organic materials, including endotoxins such as lipopolysaccharides, and assembled into a hermetically sealed package without recontamination. This is achieved by cleaning both the device and package components together in an apparatus, which includes a hermetically sealed chamber, in which they are contacted with atomic oxygen which biocleans them, by oxidizing the biologically active organic materials. The apparatus also includes means for manipulating the device and container and hermetically sealing the cleaned device into the cleaned container to form the package. A calibrated witness coupon visually indicates whether or not the device and container have received enough exposure to the atomic oxygen to have removed the organic materials from their surfaces. Gamma radiation is then used to sterilize the device in the sealed container.

Bruce A Banks↗

NASA NTRS2006

Correction for Thermal EMFs in Thermocouple Feedthroughs

A straightforward measurement technique provides for correction of thermal-electromotive-force (thermal-EMF) errors introduced by temperature gradients along the pins of non-thermocouple-alloy hermetic feedthrough connectors for thermocouple extension wires that must pass through bulkheads. This technique is an alternative to the traditional technique in which the thermal-EMF errors are eliminated by use of custom-made multipin hermetic feedthrough connectors that contain pins made of the same alloys as those of the thermocouple extension wires. One disadvantage of the traditional technique is that it is expensive and time-consuming to fabricate multipin custom thermocouple connectors. In addition, the thermocouple-alloy pins in these connectors tend to corrode easily and/or tend to be less rugged compared to the non-thermocouple-alloy pins of ordinary connectors. As the number of thermocouples (and thus pins) is increased in a given setup, the magnitude of these disadvantages increases accordingly. The present technique is implemented by means of a little additional hardware and software, the cost of which is more than offset by the savings incurred through the use of ordinary instead of thermocouple connectors. The figure schematically depicts a typical measurement setup to which the technique is applied. The additional hardware includes an isothermal block (made of copper) instrumented with a reference thermocouple and a compensation thermocouple. The reference thermocouple is connected to an external data-acquisition system (DAS) through a two-pin thermocouple-alloy hermetic feedthrough connector, but this is the only such connector in the apparatus. The compensation thermocouple is connected to the DAS through two pins of the same ordinary multipin connector that connects the measurement thermocouples to the DAS.

Ziemke, Robert A.↗

NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗

NASA NTRS2019

Electron Beam Welding of Pure Tungsten Hex Cans for Nuclear Thermal Propulsion Engines

Nuclear thermal propulsion (NTP) is an in-space propulsion method currently being developed at the NASA Marshall Space Flight Center (MSFC). NTP systems are a high specific impulse (750–1,100 s), high thrust (15,000–250,000 lbf ) method of propulsion which have the potential to allow for faster transit times when optimizing for high ΔV. In the nuclear rocket engine, the heat from the nuclear fission reaction is transferred to a low molecular mass propellant (such as hydrogen). Hot propellant is expanded through a nozzle to generate thrust. Development of ceramic metal (cermet) fuel systems for NTP applications is currently ongoing at MSFC. In cermet fuel systems, ceramic fissile fuel particles such as uranium nitride or uranium dioxide are dispersed within a net-shaped, high-density structural matrix. The composite material is cladded by a protective metal structure to make up an NTP fuel element. Cladding materials must be able to withstand the demanding operating conditions required of the engine as well as retain a hermetic seal to allow for retention of fuel element structural integrity, prevent hydrogen attack or migration of the ceramic fuel, and limit release of fission products during operation. For NTP applications, tungsten is a prime material for both the metal matrix and cladding in cermet fuel systems because of its high melting point, high temperature strength, and compatibility with hot hydrogen. If a weld in tungsten with the capability of holding a hermetic seal is achievable, tungsten becomes a strong candidate for NTP applications. This Technical Memorandum focuses on determining the weldability of pure tungsten using electron beam welding (EBW). Tungsten appears well suited for NTP applications, but it has a high ductile to brittle transition temperature (DBTT) dependent upon chemical composition, structure/stress distribution, and mechanical conditions. Therefore, it is highly subject to brittle fracture. Because of its high susceptibility to brittle fracture, it is very difficult to weld. EBW was chosen for joining pure tungsten because of its low heat input compared to gas tungsten arc welding. Reduced heat input can be directly correlated with an increase in ductility of a tungsten weld. EBW is a high energy density welding process in which a stream of electrons penetrates a weld joint in a deep, narrow spike in contrast to a broad gas tungsten arc weld pool. The investigation initially focused on EBW of tungsten plates of both 0.01 in and 0.03 in thickness to determine if EBW could weld pure tungsten without the presence of visual defects—particularly cracking—in the welds. Variation in the weld procedure and post-weld heat treatment (PWHT) was used to improve the surface appearance of flat EBWs on a pure tungsten sheet. The investigation moved on to weld 0.05-in-thick hexagonal tungsten cans with a weld joint thickness of 0.025 in. The goal for welding the pure tungsten hex cans was to avoid any visual surface defects and generate a weld capable of a hermetic seal. This proved difficult. Cold welds commonly exhibited porosity that leaked air. Hot welds exhibited cracks, typically observed immediately after welding. Later welds were preheated to increase ductility and decrease the likelihood of through-thickness cracking. PWHT was used to arrest microcrack growth both in the flat weld samples and hexagonal weld samples.

Courtright, Z. S.↗

NASA NTRS1974

Airlock

An airlock for use in transferring waste objects from a positively pressurized enclosure aboard an operative space vehicle, to a waste receiver attached to the vehicle and maintained at the negative pressure of a celestial space environment. The airlock is characterized by a shell having an internal chamber and hermetically sealed within an opening formed in a bulkhead of the enclosure. The shell is provided with an insertion hatch adjacent to the enclosure, and an ejection hatch adjacent the waste receiver, each of the hatches being hermetically sealed by a hatch cover supported for deployment to a hatch-opening disposition through a manipulation of a hatch-deploying mechanism. A three-way selector valve is coupled with the deploying mechanism and ported to an internal chamber of the shell, the enclosure, and the environment and is provided for alternately coupling the chamber with the enclosure and the receiver, in direct communication, in response to a manipulation of the mechanism whereby a sequence is imposed on the operation of the airlock.

Linderfelt, H. R.↗

NASA NTRS1974

Solid state switch panel

An intensive study of various forms of transducers was conducted with application towards hermetically sealing the transducer pick off and all electronics. The results indicated that the Hall effect devices and a LED/phototransistor combination were the most practical for this type of application. Therefore, hardware was developed utilizing a magnet/Hall effect transducer for single action switches and LED/phototransistor transducers for rotary multiposition or potentiometer applications. A number of switches were built and models were hermetically sealed to prove the feasibility of this type of fabrication. One of each type of switch was subjected to temperature cycling, vibration, and EMI tests.

Beenfeldt, E.↗

NASA NTRS1975

Contamination control in hybrid microelectronic modules. Part 3: Specifications for coating material and process controls

Resin systems for coating hybrids prior to hermetic sealing are described. The resin systems are a flexible silicone junction resin system and a flexible cycloaliphatic epoxy resin system. The coatings are intended for application to the hybrid after all the chips have been assembled and wire bonded, but prior to hermetic sealing of the package. The purpose of the coating is to control particulate contamination by immobilizing particles and by passivating the hybrid. Recommended process controls for the purpose of minimizing contamination in hybrid microcircuit packages are given. Emphasis is placed on those critical hybrid processing steps in which contamination is most likely to occur.

Himmel, R. P.↗

NASA NTRS1981

Total Hip Joint Replacement Biotelemetry System

The development of a biotelemetry system that is hermetically sealed within a total hip replacement implant is reported. The telemetry system transmits six channels of stress data to reconstruct the major forces acting on the neck of the prosthesis and uses an induction power coupling technique to eliminate the need for internal batteries. The activities associated with the telemetry microminiaturization, data recovery console, hardware fabrications, power induction systems, electrical and mechanical testing and hermetic sealing test results are discussed.

Boreham, J. F.↗

NASA NTRS1981

Mobile sampler for use in acquiring samples of terrestrial atmospheric gases

Samples of terrestrial atmospheric gasses from a free body of such gasses using a device characterized by a plurality of tubular bodies adapted to be mounted in side by side relation on a motorized highway vehicle in mutual parallelism with the axis of the normal path of travel for the vehicles. Each of the bodies is of a cylindrical configuration and has an axial opening at each of its opposite ends through which a linear flow path is defined. A pair of pivotally supported, spring-biased sealing caps is mounted adjacent to the ends of the body and continuously urged into a hermetic sealing relationship. A restraint for securing the caps against spring-urged pivotal displacement, includes a separable, normally tensioned line interconnecting the caps and an operable release mechanism for simultaneously releasing the caps for spring-urged displacement. A hot wire cutter is included for separating the line, whereby samples of air are trapped in the body as the caps are spring-driven to assume an hermetically sealed relation with the openings defined in each of the opposite ends of the body.

Tucker, C. E.↗

NASA NTRS1998

Fiber Optic Cable Feedthrough and Sealing

A novel fiberoptic hermetic bulkhead feedthrough has been developed which will offer cryogenic sealing at leak rates of 10(exp -11) cc/sec helium. This feedthrough was developed for NASA in response to needs for a hermetically sealed feedthrough which could withstand a range of temperatures from low cryogenic (-196 C), due to liquid fuels and oxidizers, to high temperatures (+200 C) encountered in the proximity of combustion gasses. The development effort will be reported from conceptual design of single and multi-channel feedthrough units with single interconnection interfaces to units with double-ended interconnection interfaces. Various combinations of fiber/buffers are reported with recommendations based on test results. A comprehensive series of environmental and mechanical tests were performed to evaluate the feedthroughs in adverse conditions. Test results are reported including insertion loss, salt spray, sinusoidal vibration, random vibration, mechanical shock, thermal shock and humidity. A second set of feedthrough units was exposed to 3 different types of radiation. Optical transmittance changes during the tests were monitored and leak rate testing was done after each test. State-of-the-art technology in optical fiber feedthroughs constructed with polycrystalline ceramic is presented.

Fan, Robert J.↗

NASA NTRS1995

Novel Techniques for Millimeter-Wave Packages

A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wide-band RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.

Herman, Martin I.↗

NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗

NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

NASA NTRS2003

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Jah, Muzar↗

NASA NTRS2004

Solid oxidized fuel cells seals leakage setup and testing

As the world s reserves of fossil fuels are depleted, the U.S. Government, as well as other countries and private industries, is researching solutions for obtaining power, answers that would be more efficient and environmentally friendly. For a long time engineers have been trying to obtain the benefits of clean electric power without heavy batteries or pollution-producing engines. While some of the inventions proved to be effective (i.e. solar panels or windmills) their applications are limited due to dependency on the energy source (i.e. sun or wind). Currently, as energy concerns increase, research is being carried out on the development of a Solid Oxide Fuel Cell (SOFC). The United States government is taking a proactive role in expanding the technology through the Solid State Energy Conversion Alliance (SECA) Program, which is coordinated by the Department of Energy. into an electrical energy. This occurs by the means of natural tendency of oxygen and hydrogen to chemically react. While controlling the process, it is possible to harvest the energy given off by the reaction. SOFCs use currently available fossil fuels and convert a variety of those fuels with very high efficiency (about 40% more efficient than modem thermal power plants). At the same time they are almost entirely nonpolluting and due to their size they can be placed in remote areas. The main fields where the application of the fuel cells appears to be the most useful for are stationary energy sources, transportation, and military applications. structure and materials must be resolved. All the components must be operational in harsh environments including temperatures reaching 800 C and cyclic thermal- mechanical loading. Under these conditions, the main concern is the requirement for hermetic seals to: (1) prevent mixing of the fuel and oxidant within the stack, (2) prevent parasitic leakage of the fuel from the stack, (3) prevent contamination of the anode by air leaking into the stack, (4) electrically isolate the individual cells within the stack, and (5) mechanically bond the cell components. The sealing challenges are aggravated by the need to maintain hermetic boundaries between the different flow paths within the fuel cell throughout cycled operation. Within the timeframe of my tenure, the main objective is to assist in building a state-of-art test facility.

Bastrzyk, Marta B.↗

NASA NTRS2007

Multiple internal seal right micro-electro-mechanical system vacuum package

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Hayworth, Ken J.↗

NASA NTRS2008

Failures in Hybrid Microcircuits During Environmental Testing. History Cases

This purpose of this viewgraph presentation is to discuss failures in hermetic hybrids observed at the GSFC PA Lab during environmental stress testing. The cases discussed are: Case I. Substrate metallization failures during Thermal cycling (TC). Case II. Flex lid-induced failure. Case Ill. Hermeticity failures during TC. Case IV. Die metallization cracking during TC. and how many test cycles and parts is necessary? Case V. Wire Bond failures after life test. Case VI. Failures caused by Au/In IMC growth.

Teverovsky, Alexander↗