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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Synchronized Eruptions on Io: Possible Evidence of Interconnected Subsurface Magma Reservoirs

On 27 December 2024, Juno's JIRAM (Jovian InfraRed Auroral Mapper) instrument observed an unprecedented volcanic event in Io's southern hemisphere, covering a vast region of ∼65,000 km2, near 73°S, 140°E. Within the imaged region, only one hot spot was previously known (Pfd454). This feature was earlier estimated to cover an area of 300 km2 with a total power output of 34 GW. JIRAM results show that the region produces a power output of 140–260 TW, over 1,000 times higher than earlier estimates and likely exceeding the brightest eruption ever recorded on Io, that of Surt in 2001 (∼80 TW). Three adjacent hot spots also exhibited dramatic power increases: P139, PV18, and an unnamed feature south of the main one that surged to ∼1 TW, placing all of them among the top 10 most powerful hot spots observed on Io. A temperature analysis of the features supports the simultaneous onset of these brightenings and suggests a single eruptive event propagating beneath the surface across hundreds of kilometers; this is the first time this has been observed on Io. This in turn would imply a connection among the hotspots' magma reservoirs, while other nearby hotspots that have been known to be active in the recent past, such as Kurdalagon Patera, appear unaffected. The simultaneity supports models of massive, interconnected magma reservoirs. The topology of these regional magma systems may resemble that of a large-scale sponge, in which the massive reservoirs are the pores, interconnected through a largely solid outer shell.

A Mura↗

Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

Full-tape-thickness feature; LTCC 9K7 interconnect↗

Interconnect and Packaging Technologies for Terahertz Communication Systems

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

Micromachining↗

Coplanar interconnection module

Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.

Steward, R. D.↗