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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

Use of Grid-Forming Medium-Voltage Power Electronics Hub in a Microgrid Setting: Preprint

This paper presents the application of a new design of a multiport, modular, medium-voltage power electronics hub (M3PE-HUB) in a microgrid setting. The M3PE-HUB system was modeled in a digital real-time simulator (DRTS) and integrated into the Banshee microgrid test system. This paper presents the preliminary DRTS simulation-based results of the M3PE- HUB system connected in a test microgrid system. Verification and validation of the M3PE-HUB architecture and controls in the test microgrid setting are the primary contributions of this work. The results of the operation during the islanding and resynchronization process indicate the feasibility of the proposed architecture in a microgrid setting. This paper also presents results for a system reconfiguration use case where the M3PE- HUB was used to reconfigure the system under a fault condition.

grid forming↗
DOE OSTI2025

Cybersecurity Challenges in Low-Inertia Power-Electronics-Dominated Grids

Here, the low inertia characteristics of the power electronics dominated grid (PEDG) introduces challenges while restoring voltage and frequency to their nominal values. These stability challenges create new cybersecurity vulnerabilities that are not thoroughly discussed in the literature. Cyber events such as false data injection (FDI), denial of service (DoS), man-in-the-middle attacks, stealthy attacks, and advanced persistent threats target PEDG to disrupt grid stability or gain financial benefits. The low inertia of PEDG (< 2s) compared to traditional grids (~10s) exacerbates these vulnerabilities. In response to stealthy attacks on state variables that supervisory layers cannot detect until significant harm occurs, the low inertia characteristics of PEDG offer substantial stealthy attack surfaces. To counteract such threats, PEDG must be equipped with ultra-fast real-time anomaly detection system and trajectory prediction mechanism to achieve effective cyberattack resiliency.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package: Preprint

Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that placing the devices closer to the direct-bond-copper substrate as opposed to a centered approach in the proposed double-sided-cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

27 ARPA - Advanced Research Projects Agency-Energy↗
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package

This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

electronic packaging↗
DOE OSTI2020

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2023

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

ADVANCED PROPULSION SYSTEMS,ENGINEERING↗
DOE OSTI2021

Intrusion Detection for Cybersecurity of Power Electronics Dominated Grids: Inverters PQ Set-Points Manipulation

This work provides cybersecurity analytics for a high photovoltaic (PV) penetrated distribution network, representing future power electronics dominated grid (PEDG). Firstly, the impact of active and reactive power (PQ) set-points manipulation on the network is studied. Then, an intrusion detection system (IDS) is developed for identifying the potentially compromised PV inverters in the network. The proposed IDS is based on defining the normal, safe, and abnormal operation regions of the PV inverters from point of view of the steady state voltage stability of the network. These three-operation regions are identified by utilizing active power, reactive power, and voltage (PQV) limits of each specific grid-following inverter in the network. Each grid-following inverter's PQV contour includes the information of network topology, inverter ratings, and inverter controller. The developed PQ limits are integrated into the centralized secondary control layer for realization of the proposed IDS. Furthermore, the proposed secondary control layer is capable of providing remedial actions during an anomaly event to enhance the grid resiliency. The theoretical analyses are verified by several attack scenarios for a network of grid-following inverters.

41 EE - Solar Energy Technologies Office (EE-4S)↗
DOE OSTI2024

Thermomechanical Reliability Aspects of Automotive Power Electronics: Current Status and Future Trends

Common failure locations (e.g., wire bonds, solder interface) and mechanisms within traditional automotive power electronics package designs and reliability concerns associated with packaging at higher temperatures and higher heat fluxes will be discussed. Examples of packaging solutions that increase mechanical reliability will be presented and state-of-health (SOH) estimation using offline and online (in situ) techniques will be described.

ADVANCED PROPULSION SYSTEMS,DIRECT ENERGY CONVERSI↗
DOE OSTI2024

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2023

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

High temperature operation of wide bandgap devices continue to be a challenge for the power electronics packages. Thermal performance and reliability are important factors that determine the viability of a bonded interface for operation at high temperatures. In this presentation, we present the technical approach and key results from the research on sintered silver, transient liquid phase alloy, and polymeric materials. A lifetime prediction model that incorporates the thermomechanical behavior of sintered silver at 200C was developed. The copper-aluminum transient alloy completed 350 thermal cycles from -40C to 200C and little increase in the defect level was observed. In addition to material research, we initiated a time-series analysis on the scanning acoustic microscope images of eutectic solder to explore statistical forecasting methods and machine learning techniques. Initial results that report the accuracy of a few different statistical models are presented.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2024

Framework for Supporting Adaptive Droop Based Power Electronic Systems

The electric grid is evolving into an electrical network composed of power electronic converters interconnected with renewable and energy storage technologies. This requires the adoption of more advanced control such as volt/var regulation, fast frequency control, and active power frequency response. This work presents a communication and control framework to support dynamically changing droop control segments that can be used for different optimization schemes. Results are presented to work in a controller hardware in the loop testbed.

Starke, Michael↗
DOE OSTI2021

Oscillating heat pipe integrated thermal management system for power electronics

Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

Wang, Jim↗
DOE OSTI2024

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [11] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project evaluates, designs, and develops thermal management strategies that use dielectric fluid (single-phase heat transfer) as coolants.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Load-Packaged AC/DC and DC/DC Power Electronics Converter Performance Data

This data set contains experimentally characterized performance data from load-packaged alternating current to direct current (AC/DC) and direct current to direct current (DC/DC) power electronics converters associated with lighting devices and miscellaneous electrical loads typically found in commercial buildings in the United States. The data set contains input power, output power, efficiency, and harmonic spectrum data for 58 AC/DC converters and 35 DC/DC converters.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2022

An Intelligent Power Electronic System for Secondary Use Batteries

This paper presents a plug-and-play power electronic system for integration of multiple energy storage system technologies. The system uses a communication and control architecture with individual developed modules to support scaling to larger systems for the electric grid. An optimization framework is also presented to demonstrate the functionality of the system. This system is shown to work in hardware with a constructed testbed to demonstrate different use cases and systems. Results are presented for a full efficiency cycle test.

Starke, Michael↗
DOE OSTI2025

Megawatt-Class, High-Voltage SiC Power Electronics Converters for Advanced Manufacturing with Grid Support Services

DE-EE0009135 aimed to push the 10kV SiC MOSFET based power electronics to 3-phase 13.8kV 10MW to be used as a Megawatt Class Medium-Voltage Power Conditioning Systems – PCS – to enable “Resilient Distribution through Grid-dispatching and Uninterrupted Quality Power to Manufacturing Facilities” during transitory grid disturbances. As a stretch to those goals, Eaton added the load power peak shaving opportunity.

24 POWER TRANSMISSION AND DISTRIBUTION↗