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Results for “thermal stress”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

The evolution of impact basins - Cooling, subsidence, and thermal stress

The present study is concerned with an assessment of the contribution of thermal contraction and thermal stress to the topography and tectonics of large lunar impact basins. Exploratory models are developed, giving attention to the temperature structure following basin formation, the subsequent cooling of the basin region, and the resulting thermal displacements and stresses as functions of time. The subsidence and stress at the surface are compared with topography and tectonic features in the comparatively well-preserved Orientale basin. The results of the comparison are used as a basis to derive approximate constraints on the quantity and distribution of heat implanted during the basin-formation process.

Bratt, S. R.↗
NASA NTRS1979

An analysis of thermal stress and gas bending effects on vibrations of compressor rotor stages

A preliminary study conducted by Kerrebrock et al. (1976) has shown that the torsional rigidity of untwisted thin blades of a transonic compressor can be reduced significantly by transient thermal stresses. The aerodynamic loads have various effects on blade vibration. One effect is that gas bending loads may result in a bending-torsion coupling which may change the characteristics of the torsion and bending vibration of the blade. For a general study of transient-temperature distribution within a rotor stage, a finite-element heat-conduction analysis was developed. The blade and shroud are divided into annular elements. With a temperature distribution obtained from the heat-conduction analysis and a prescribed gas bending load distribution along the blade span, the static deformation and moment distributions of the blade can be solved iteratively using the finite-element method. The reduction of the torsional rigidity of pretwisted blades caused by the thermal stress effect is then computed. The dynamic behavior of the blade is studied by a modified Galerkin's method.

Chen, L.-T.↗
DOE OSTI2022

Thermal Stress Modeling and Analysis of Packed-bed Thermocline Energy Storage Tank for INL Thermal Energy Distribution System (TEDS)

The Thermal Energy Distribution System (TEDS) at Idaho National Laboratory (INL) is a thermal-hydraulic flow loop to support the integration of co-located multiple experimental systems, where a packed-bed thermal energy storage (TES) is installed as a thermal buffer and storage unit for TEDS. The packed-bed TES is adopted in TEDS because of its benefit as a low-cost single-tank storage option compared to the traditional two-tank storage. However, thermal ratcheting is one potential design concern which is caused by the rearrangement of granular filler inside a packed-bed tank during continuous thermal cycling operation of the packed-bed TES tank. If the thermally induced stress exceeds yield strength of the tank wall, it may cause catastrophic consequences like rupture of the thermal storage tank. Thus, it is crucial to understand the phenomenon to ensure the robust operation. Based on the temperature boundary conditions given by transient thermal analyses with computational fluid dynamics (CFD) simulations, the thermal ratcheting analysis is then conducted to evaluate the hoop stress and resultant thermal ratcheting potential of the TES tanks with two different modeling approaches: (1) infinite rigidity model and (2) Drucker-Prager (DP) model. The validity of each modeling method was examined by comparing the numerical simulation with the experimental data obtained from the packed-bed TES tank for Solar One Plant and evaluate the thermal ratcheting potential of the TEDS TES tank.

25 ENERGY STORAGE↗
NASA NTRS1968

Encapsulation technique eliminates thermal stresses in welded electronic modules

Encapsulation technique minimizes embedment and thermal stresses in welded electronic modules. A coating of thinned room-temperature- vulcanizing silicone rubber having a high coefficient of expansion and flexibility at low temperature, is applied first and then an encapsulating epoxy resin having a relatively low coefficient of expansion is added.

Kimmel, M.↗
DOE OSTI2022

Thermal Stress Reduction in Power Switching Devices Using Distributed Loss PWM Concept for Current Source Inverters

A new modulation scheme is proposed for current source inverters (CSIs) that reduces the variation and peak junction temperature in the CSIs' power devices. The distributed loss pulse-width modulation (DLM) concept is introduced and applied to traditional space vector modulation methods to develop modified modulation schemes that reduce the thermal stress on power devices. The device junction temperatures resulting from conventional and DLM schemes are compared. Simulation and experimental results confirm that the proposed DLM concept reduces thermal stress on the devices while maintaining the same high output current waveform quality compared to traditional CSI modulation schemes. The CSI power device lifetime (i.e., the number of cycles to failure) are estimated using the simulation and experimental results. The proposed DLM significantly increases the device lifetime (by 5 to 6 times) by reducing the junction temperature variation compared to the conventional modulations.

42 ENGINEERING↗
NASA NTRS2006

Chemical Characterization and Thermal Stressing Studies of Perfluorohexane Fluids for Space-Based Applications

Perfluorohexane (PFH), C6F14, is a perfluorocarbon fluid. Several PFH fluids with different isomer concentrations were evaluated for use in an upcoming NASA space experiment. Samples tested included two commercially obtained high-purity n-perfluorohexane (n-PFH) fluids and a technical grade mixture of C6F14 branched and linear isomers (FC-72(TradeMark)). These fluids were evaluated for exact chemical composition, impurity purity and high temperature degradation behavior (pyrolysis). Our investigation involved simulated thermal stressing studies of PFH fluids under conditions likely to occur in the event of an atmospheric breach within the International Space Station (ISS) and subsequent exposure of the vapors to the high temperature and catalyst present in its Trace Contaminant Control Subsystem (TCCS). Exposure to temperatures in the temperature range of 200-450 C in an inert or oxidizing atmosphere, with and without the presence of catalyst was investigated. The most aggressive conditions studied were exposure of PFH vapors to 450 C in air and in the presence of TCCS (palladium) catalyst. Gas chromatography-mass spectrometry (GC-MS) and gas chromatography (GC) analyses were conducted on the perfluorohexane samples before and after pyrolysis. The FC-72 and n-PFH samples showed no significant degradation following pyrolysis even under the most aggressive study conditions. Some trace level impurities associated with the PFH samples such as linear perfluorocarbon monohydrides or monoiodides were destroyed by pyrolysis at the upper limit. Other trace level impurities such as olefinic or cycloolefinic perfluorocarbons were converted into oxidation products by pyrolysis. The purity of PFH following pyrolysis actually increased slightly as a consequence since these trace contaminants were effectively scrubbed from the samples. However, since the initial concentrations of the thermally-impacted impurities were so low, the net effect was trivial. A potential byproduct of exposure of perfluorohexane fluids to high temperatures is the production of perfluoroisobutene (PFiB), which is extremely toxic. An ultra-high sensitivity PFiB-specific analysis based on GC-MS with negative ion chemical ionization (NICI) detection was used to evaluate the samples following thermal stressing. The perfluorohexanes examined here under conditions reflective of the ISS TCCS environment showed no signs of PFiB production with an analytical detection limit of 10 part per billion (ppb v/v).

Arnold, William A.↗