Physical properties of thin films
Studies and experiments are presented on carbon, boron, aluminum oxide, zirconium silicate, aluminum, and titanium vapor-deposited on polyimide film substrates.
Preiswerk, P. R.↗
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Web-Based Toxic Gas Dispersion Model for Shuttle Launch Operations
During the launch of the Space Shuttle vehicle, the burning of liquid hydrogen fuel with liquid oxygen at extreme high temperatures inside the three space shuttle main engines, and the burning of the solid propellant mixture of ammonium perchlorate oxidizer, aluminum fuel, iron oxide catalyst, polymer binder, and epoxy curing agent in the two solid rocket boosters result in the formation of a large cloud of hot, buoyant toxic exhaust gases near the ground level which subsequently rises and entrains into ambient air until the temperature and density of the cloud reaches an approximate equilibrium with ambient conditions. In this paper, toxic gas dispersion for various gases are simulated over the web for varying environmental conditions which is provided by rawinsonde data. The model simulates chemical concentration at ground level up to 10 miles (1 KM grids) in downrange up to an hour after launch. The ambient concentration of the gas dispersion and the deposition of toxic particles are used as inputs for a human health risk assessment model. The advantage of the present model is the accessibility and dissemination of model results to other NASA centers over the web. The model can be remotely operated and various scenarios can be analyzed.
Bardina, Jorge↗
Packaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.
Chen, Liang-Yu↗
Packaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.
Electronic packaging↗
Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology
This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.
dielectric properties↗
Optimization of Aluminum Anodization Conditions for the Fabrication of Nanowires by Electrodeposition
Anodized alumina nanotemplates have a variety of potential applications in the development of nanotechnology. Alumina nanotemplates are formed by oxidizing aluminum film in an electrolyte solution.During anodization, aluminum oxidizes, and, under the proper conditions, nanometer-sized pores develop. A series of experiments was conducted to determine the optimal conditions for anodization. Three-micrometer thick aluminum films on silicon and silicon oxide substrates were anodized using constant voltages of 13-25 V. 0.1-0.3M oxalic acid was used as the electrolyte. The anodization time was found to increase and the overshooting current decreased as both the voltage and the electrolyte concentrations were decreased. The samples were observed under a scanning electron microscope. Anodizing with 25V in 0.3M oxalic acid appears to be the best process conditions. The alumina nanotemplates are being used to fabricate nanowires by electrodeposition. The current-voltage characteristics of copper nanowires have also been studied.
Fucsko, Viola↗
SRM Internal Flow Tests and Computational Fluid Dynamic Analysis: RSRM Full Scale Motor Analyses - Volume 2
The purpose of the RSRM Nozzle Slag Ejection Precursor Test is to investigate the effect that slag ejection from the RSRM nozzle has on the chamber pressure and trust of the SRB's. In past firings of the Reusable Solid Rocket Motor (RSRM) both static test and flight motors have shown small pressure perturbations occurring primarily between 65 and 80 seconds. A joint NASA/Thiokol team investigation concluded that the cause of the pressure perturbations was the periodic ingestion and ejection of molten aluminum oxide slag from the cavity around the submerged nozzle nose which tends to trap and collect individual aluminum oxide droplets from the approach flow. The conclusions of the team were supported by numerous data and observations from special tests including high speed photographic films, real time radiography, plume calorimeters, accelerometers, strain gauges, nozzle TVC system force gauges, and motor pressure and thrust data. A simplistic slag ballistics model was formulated to relate a given pressure perturbation to a required slag quantity. Also, a cold flow model using air and water was developed to provide data on the relationship between the slag flow rate and the chamber pressure increase. Both the motor and the cold flow model exhibited low frequency oscillations in conjunction with periods of slag ejection. Motor and model frequencies were related to scaling parameters. The data indicate that there is a periodicity to the slag entrainment and ejection phenomena which is possibly related to organized oscillations from instabilities in the dividing streamline shear layer which impinges on the underneath surface of the nozzle.
Source record↗
Effects of Slag Ejection on Solid Rocket Motor Performance
In past firings of the Reusable Solid Rocket Motor (RSRM) both static test and flight motors have shown small pressure perturbations occurring primarily between 65 and 80 seconds. A joint NASA/Thiokol team investigation concluded that the cause of the pressure perturbations was the periodic ingestion and ejection of molten aluminum oxide slag from the cavity around the submerged nozzle nose which tends to trap and collect individual aluminum oxide droplets from the approach flow. The conclusions of the team were supported by numerous data and observations from special tests including high speed photographic films, real time radiography, plume calorimeters, accelerometers, strain gauges, nozzle TVC system force gauges, and motor pressure and thrust data. A simplistic slag ballistics model was formulated to relate a given pressure perturbation to a required slag quantity. Also, a cold flow model using air and water was developed to provide data on the relationship between the slag flow rate and the chamber pressure increase. Both the motor and the cold flow model exhibited low frequency oscillations in conjunction with periods of slag ejection. Motor and model frequencies were related to scaling parameters. The data indicate that there is a periodicity to the slag entrainment and ejection phenomena which is possibly related to organized oscillations from instabilities in the dividing streamline shear layer which impinges on the underneath surface of the nozzle.
Whitesides, R. Harold↗
Eutectic bonding of sapphire to sapphire
Eutectic mixture of aluminum oxide and zirconium oxide provides new bonding technique for sapphires and rubies. Technique effectively reduces possibility of contamination. Bonding material is aluminum oxide and zirconium oxide mixture that matches coefficient of thermal expansion of sapphire.
Deluca, J. J.↗
Sample Acquisition and Analytical Chemistry Challenges to Verifying Compliance to Aviators Breathing Oxygen (ABO) Purity Specification
NASA has been developing and testing two different types of oxygen separation systems. One type of oxygen separation system uses pressure swing technology, the other type uses a solid electrolyte electrochemical oxygen separation cell. Both development systems have been subjected to long term testing, and performance testing under a variety of environmental and operational conditions. Testing these two systems revealed that measuring the product purity of oxygen, and determining if an oxygen separation device meets Aviator's Breathing Oxygen (ABO) specifications is a subtle and sometimes difficult analytical chemistry job. Verifying product purity of cryogenically produced oxygen presents a different set of analytical chemistry challenges. This presentation will describe some of the sample acquisition and analytical chemistry challenges presented by verifying oxygen produced by an oxygen separator - and verifying oxygen produced by cryogenic separation processes. The primary contaminant that causes gas samples to fail to meet ABO requirements is water. The maximum amount of water vapor allowed is 7 ppmv. The principal challenge of verifying oxygen produced by an oxygen separator is that it is produced relatively slowly, and at comparatively low temperatures. A short term failure that occurs for just a few minutes in the course of a 1 week run could cause an entire tank to be rejected. Continuous monitoring of oxygen purity and water vapor could identify problems as soon as they occur. Long term oxygen separator tests were instrumented with an oxygen analyzer and with an hygrometer: a GE Moisture Monitor Series 35. This hygrometer uses an aluminum oxide sensor. The user's manual does not report this, but long term exposure to pure oxygen causes the aluminum oxide sensor head to bias dry. Oxygen product that exceeded the 7 ppm specification was improperly accepted, because the sensor had biased. The bias is permanent - exposure to air does not cause the sensor to return to its original response - but the bias can be accounted for by recalibrating the sensor. After this issue was found, continuous measurements of water vapor in the oxygen product were made using an FTIR. The FTIR cell is relatively large, so response time is slow - but moisture measurements were repeatable and accurate. Verifying ABO compliance for oxygen produced by commercial cryogenic processes has a different set of sample acquisition and analytical chemistry challenges. Customers want analytical chemists to conserve as much as possible. Hygrometers are not exposed to hours of continuous flow of oxygen, so they don't bias, but small amounts of contamination in valves can cause a "fail". K bottles are periodically cleaned and recertified - after cleaning residual moisture can cause a "fail". Operators let bottle pressure drop to room pressure, introduce outside air into the bottle, and the subsequent fill will "fail". Outside storage of K‐bottles has allowed enough in‐leakage, so contents will "fail".
Graf, John↗
Fabrication of Electrostatically Actuated Microshutters Arrays
A new fabrication process has been developed to actuate microshutter arrays (MSA) electrostatically at NASA Goddard Space Flight Center. The microshutters, made with silicon nitride membranes with a pixel size of 100 x 200 sq microns, rotate on torsion bars. The microshutters are actuated, latched, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The atomic layer deposition (ALD) of aluminum oxide was used to insulate electrodes on the back side of walls; the insulation can withstand over 100 V. The ALD aluminum oxide is dry etched, and then the microshutters are released in vapor HF.
microshutter arrays (MSA)↗
Design and Fabrication of Electrostatically Actuated Silicon Microshutters Arrays
We have developed a new fabrication process to actuate microshutter arrays (MSA) electrostatically at NASA Goddard Space Flight Center. The microshutters are fabricated on silicon with thin silicon nitride membranes. A pixel size of each microshutter is 100 x 200 micrometers 2. The microshutters rotate 90 degrees on torsion bars. The selected microshutters are actuated, held, and addressed electrostatically by applying voltages on the electrodes the front and back sides of the microshutters. The atomic layer deposition (ALD) of aluminum oxide was used to insulate electrodes on the back side of walls; the insulation can withstand over 100 V. The ALD aluminum oxide is dry etched, and then the microshutters are released in vapor HF.
microshutter arrays↗
Aluminum is More Cytotoxic than Lunar Dust in Human Skin and Lung Fibroblasts
NASA plans to build a permanent space station on the moon to explore its surface. The surface of the moon is covered in lunar dust, which consists of fine particles that contain silicon, aluminum and titanium, among others. Because this will be a manned base, the potential toxicity of this dust has to be studied. Also, toxicity standards for potential exposure have to be set. To properly address the potential toxicity of lunar dust we need to understand the toxicity of its individual components, as well as their combined effects. In order to study this we compared NASA simulant JSC-1AVF (volcanic ash particles), that simulates the dust found on the moon, to aluminum, the 3rd most abundant component in lunar dust. We tested the cytotoxicity of both compounds on human lung and skin fibroblasts (WTHBF-6 and BJhTERT cell lines, respectively). Aluminum oxide was more cytotoxic than lunar dust to both cell lines. In human lung fibroblasts 5, 10 and 50 g/sq cm of aluminum oxide induced 85%, 61% and 30% relative survival, respectively. For human skin fibroblasts the same concentrations induced 58%, 41% and 58% relative survival. Lunar dust was also cytotoxic to both cell lines, but its effects were seen at higher concentrations: 50, 100, 200 and 400 g/sq cm of lunar dust induced a 69%, 46%, 35% and 30% relative survival in the skin cells and 53%, 16%, 8% and 2% on the lung cells. Overall, for both compounds, lung cells were more sensitive than skin cells. This work was supported by a NASA EPSCoR grant through the Maine Space Grant Consortium (JPW), the Maine Center for Toxicology and Environmental Health., a Fulbright Grant (JM) and a Delta Kappa Gamma Society International World Fellowship (JM).
Hammond, D.↗
Detection of weldment lack of fusion using opaque additives
Problems in the production of aluminum weldments are caused by moisture absorbed by the aluminum oxide which forms on the surface before welding. Another problem is incomplete penetration of the weldment. The problems can be solved by coating the aluminum surfaces with an X-ray-opaque metal such as silver or copper. This will prevent the formation of moisture-absorbing aluminum oxide. Any protective coating remaining in an area of incomplete weld penetration can be seen in an inspection of the weldment conducted with the aid of an X-ray method. Details of copper deposition procedures are discussed along with a copper coating analysis and the testing of the weldments.
Cook, J. L.↗
High temperature coatings for gas bearings
Aluminum oxide and nickel-chrome bonded chrome carbide coatings enhance the performance of gas bearings at temperatures up to 1400 degrees F. A plasma-sprayed aluminum-oxide coating is applied to the bearing surface and a plasma- sprayed 25 percent nickel-chrome bonded chrome carbide coating is applied to the journal surface.
Murray, S. F.↗
Mixed composition materials suitable for vacuum web sputter coating
Ion beam sputter deposition techniques were used to investigate simultaneous sputter etching of two component targets so as to produce mixed composition films. Although sputter deposition has been largely confined to metals and metal oxides, at least one polymeric material, poly-tetra-fluorethylene, has been demonstrated to produce sputtered fragments which repolymerize upon deposition to produce a highly cross-linked fluoropolymer resembling that of the parent target Fluoropolymer-filled silicon dioxide and fluoropolymer-filled aluminum oxide coatings have been deposited by means of ion beam sputter coat deposition resulting in films having material properties suitable for aerospace and commercial applications. The addition of fluoropolymer to silicon dioxide films was found to increase the hydrophobicity of the resulting mixed films; however, adding fluoropolymer to aluminum oxide films resulted in a reduction in hydrophobicity, thought to be caused by aluminum fluoride formation.
Banks, Bruce A.↗
Velocity and drop size measurements in a swirl-stabilized, combusting spray
Velocity and drop size measurements are reported for a swirl-stabilized, combusting spray. For the gas phase, three components of mean and fluctuating velocity are reported. For the droplets, three components of mean and fluctuating velocity, diameter, and number flux are reported. The liquid fuel utilized for all the tests was heptane. The fuel was injected using an air-assist atomizer. The combustor configuration consisted of a center-mounted, air-assist atomizer surrounded by a coflowing air stream. Both the coflow and the atomizing air streams were passed through 45 degree swirlers. The swirl was imparted to both streams in the same direction. The combustion occurred unconfined in stagnant surroundings. The nonintrusive measurements were obtained using a two-component phase/Doppler particle analyzer. The laser-based instrument measured two components of velocity as well as droplet size at a particular point. Gas phase measurements were obtained by seeding the air streams with nominal 1 micron size aluminum-oxide particles and using the measured velocity from that size to represent the gas phase velocity. The atomizing air, coflow air, and ambient surroundings were all seeded with the aluminum-oxide particles to prevent biasing. Measurements are reported at an axial distance of 5 mm from the nozzle. Isothermal single-phase gas velocities are also reported for comparison with the combusting case.
Bulzan, Daniel L.↗
Fracture toughness of brittle materials determined with chevron notch specimens
The use of chevron-notch specimens for determining the plane strain fracture toughness (K sub Ic) of brittle materials is discussed. Three chevron-notch specimens were investigated: short bar, short rod, and four-point-bend. The dimensionless stress intensity coefficient used in computing K sub Ic is derived for the short bar specimen from the superposition of ligament-dependent and ligament-independent solutions for the straight through crack, and also from experimental compliance calibrations. Coefficients for the four-point-bend specimen were developed by the same superposition procedure, and with additional refinement using the slice model of Bluhm. Short rod specimen stress intensity coefficients were determined only by experimental compliance calibration. Performance of the three chevron-notch specimens and their stress intensity factor relations were evaluated by tests on hot-pressed silicon nitride and sintered aluminum oxide. Results obtained with the short bar and the four-point-bend specimens on silicon nitride are in good agreement and relatively free of specimen geometry and size effects within the range investigated. Results on aluminum oxide were affected by specimen size and chevron-notch geometry, believed due to a rising crack growth resistance curve for the material. Only the results for the short bar specimen are presented in detail.
Shannon, J. L., Jr.↗