High-temperature cobalt-tungsten alloys for aerospace applications
High temperature cobalt-tungsten alloys for aerospace applications
AEROSPACE TECHNOLOGY↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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High Temperature Polymeric Materials for Space Transportation Propulsion Applications
High temperature polymer matrix composites are attractive materials for space transporation propulsion systems because of their low density and high specific strength. However, the relatively poor stability and processability of these materials can render them unsuitable for many of these applications. New polymeric materials have been developed under the Propulsion Research and Technology Program through the use of novel resin chemistry and nanotechnology. These new materials can significantly enhance the durability and weight and improve the processability and affordability of propulsion components for advanced space transportation systems.
Meador, Michael A.↗
Preparation and Analysis of Platinum Thin Films for High Temperature Sensor Applications
A study has been made of platinum thin films for application as high temperature resistive sensors. To support NASA Glenn Research Center s high temperature thin film sensor effort, a magnetron sputtering system was installed recently in the GRC Microsystems Fabrication Clean Room Facility. Several samples of platinum films were prepared using various system parameters to establish run conditions. These films were characterized with the intended application of being used as resistive sensing elements, either for temperature or strain measurement. The resistances of several patterned sensors were monitored to document the effect of changes in parameters of deposition and annealing. The parameters were optimized for uniformity and intrinsic strain. The evaporation of platinum via oxidation during annealing over 900 C was documented, and a model for the process developed. The film adhesion was explored on films annealed to 1000 C with various bondcoats on fused quartz and alumina. From this compiled data, a list of optimal parameters and characteristics determined for patterned platinum thin films is given.
Wrbanek, John D.↗
Additive Manufacture of Refractory Metals for Aerospace Applications
High temperature refractory metals are required for a number of high temperature propulsion applications. Refractory metals are expensive, difficult to manufacture with high buy-to-fly ratios, and few vendors. Additive manufacture (AM) is used to produce C103, Molybdenum (Mo), and Tungsten (W) reaction chamber and thrust stand-off as well as Iridium ultra-fine lattice catalysts for integration into 1 N green propulsion thrusters. Refractory AM is in development and like traditional AM alloys requires substantial post-processing to include powder heat treatment, surface finish enhancement, inspection, and machining before placed in service. The combination of limited feedstock sources, high temperature processing, oxygen sensitivity, fracture prone nature, and need for elevated temperature mechanical testing limit the number of qualified facilities capable of post-processing AM refractory materials, which add to cost and schedule constraints. However, properly implemented refractory metal AM can overcome existing manufacture limitations by greatly increasing design flexibility, new material options, reduced price, decreased lead-time, and leverage the ever growing AM commercial supply base.
Refractory metal additive manufacture↗
Additive Manufacture of Refractory Metals for Aerospace Applications
High temperature refractory metals are required for a number of high temperature propulsion applications. Refractory metals are expensive, difficult to manufacture with high buy-to-fly ratios, and few vendors. Additive manufacture (AM) is used to produce C103, Molybdenum (Mo), and Tungsten (W) reaction chamber and thrust stand-off as well as Iridium ultra-fine lattice catalysts for integration into 1 N green propulsion thrusters. Refractory AM is in development and like traditional AM alloys requires substantial post-processing to include powder heat treatment, surface finish enhancement, inspection, and machining before placed in service. The combination of limited feedstock sources, high temperature processing, oxygen sensitivity, fracture prone nature, and need for elevated temperature mechanical testing limit the number of qualified facilities capable of post-processing AM refractory materials, which add to cost and schedule constraints. However, properly implemented refractory metal AM can overcome existing manufacture limitations by greatly increasing design flexibility, new material options, reduced price, decreased lead-time, and leverage the ever growing AM commercial supply base.
Refractory metal additive manufacture↗
Applications of high-temperature powder metal aluminum alloys to small gas turbines
A program aimed at the development of advanced powder-metallurgy (PM) aluminum alloys for high-temperature applications up to 650 F using the concepts of rapid solidification and mechanical alloying is discussed. In particular, application of rapidly solidified PM aluminum alloys to centrifugal compressor impellers, currently used in auxiliary power units for both military and commercial aircraft and potentially for advanced automotive gas turbine engines, is examined. It is shown that substitution of high-temperature aluminum for titanium alloy impellers operating in the 360-650 F range provides significant savings in material and machining costs and results in reduced component weight, and consequently, reduced rotating group inertia requirements.
Millan, P. P., Jr.↗
Cold-air investigation of a turbine for high-temperature-engine application
Overall performance of stator component of cold air turbine determined for application to high temperature engine design
ENGINE DESIGN↗
High-temperature electronics applications in space exploration
One of the most exciting applications of high-temperature electronics is related to the exploration of the planet Venus. On this planet the atmospheric temperatures range from about 170 K at elevations of 100 km to a searing 730 K near the surface. Mechanisms for exploring the atmosphere might include balloons, airplanes, surface landers, and surface-launched probes. Balloons, for example, could fly in the region from 20 (320 C at 22 bars) to 60 km (-20 C at 0.2 bar). Suitable balloon fabrics presently exclude excursions to lower altitudes; however, adequate electronic systems could survive to 325 C. Small airplanes would require more sophisticated electronics for guidance and control. Long life surface landers would most likely be developed first, as these could be used to measure long-term variations in weather. Ranging transponders would be important for ephemeris development, measurement of spin state, and studies of general relativity. Surface temperatures of 460 C and pressures of 90 bars present a challenge to the developers of such instruments. Other space applications for high-temperature electronics include transponders for the surface of Mercury, near solar drag-free orbiters, and deep atmospheric penetrators for Jupiter and Saturn. Each of these has its own particular problems with respect to instrumentation adequate to meet the desired scientific goals. This paper is primarily concerned with defining possible mission applications, the required electronic systems, and the approaches that are currently being studied for their development.
Jurgens, R. F.↗
Installation and testing of strain gages for high-temperature aircraft applications
Aircraft flight load measurements in high temperature environment, determining optimal strain gage installation and calibration
Wilson, E. J.↗
Investigation of the Environmental Durability of a Powder Metallurgy Material
PM304 is a NASA-developed composite powder metallurgy material that is being developed for high temperature applications such as bushings in high temperature industrial furnace conveyor systems. My goal this summer was to analyze and evaluate the effects that heat exposure had on the PM304 material at 500 C and 650 C. The material is composed of Ni-Cr, Ag, Cr2O3, and eutectic BaF2-CaF2. PM304 is designed to eliminate the need for oil based lubricants in high temperature applications, while reducing friction and wear. However, further investigation was needed to thoroughly examine the properties of PM304. The effects of heat exposure on PM304 bushings were investigated. This investigation was necessary due to the high temperatures that the material would be exposed to in a typical application. Each bushing was cut into eight sections. The specimens were heated to 500 C or 650 C for time intervals from 1 hr to 5,000 hrs. Control specimens were kept at room temperature. Weight and thickness measurements were taken before and after the bushing sections were exposed to heat. Then the heat treated specimens were mounted and polished side by side with the control specimens. This enabled optical examination of the material's microstructure using a metallograph. The specimens were also examined with a scanning electron microscope (SEM). The microstructures were compared to observe the effects of the heat exposure. Chemical analysis was done to investigate the interactions between Ni-Cr and BaF2-CaF2 and between Cr2O3 and BaF2-CaF2 at high temperature. To observe this, the two compounds that were being analyzed were mixed in a crucible in varied weight percentages and heated to 1100 C in a furnace for approximately two hours. Then the product was allowed to cool and was then analyzed by X-ray diffraction. Interpretation of the results is in progress.
Ward, LaNita D.↗
Life Studies of Metal Films on Beta-Alumina at High Temperature
Applications of metallic films on sodium beta-alumina solid electrolyte (BASE) ceramic in technology for the alkali metal thermal to electric converter (AMTEC) include both electrode and metallization functions.
AMTEC beta-alumina Thermal-to-Electric Energy Conv↗
Improved high-temperature cobalt-iron alloy for square-loop and power transformer applications.
High temperature cobalt iron alloy for square loop and power transformer applications
COBALT ALLOY↗
Ohmic contacts to GaAs for high-temperature device applications
Ohmic contacts to n-type GaAs were developed for high temperature device applications up to 300 C. Refractory metallizations were used with epitaxial Ge layers to form the contacts: TiW/Ge/GaAs, Ta/Ge/GaAs, Mo/Ge/GaAs, and Ni/Ge/GaAs. Contacts with high dose Si or Se ion implantation of the Ge/GaAs interface were also investigated. The contacts were fabricated on epitaxial GaAs layer grown on N+ or semi-insulating GaAs substrates. Ohmic contact was formed by both thermal annealing (at temperatures up to 700 C) and laser annealing (pulsed Ruby). Examination of the Ge/GaAs interface revealed Ge migration into GaAs to form an N+ doping layer. The specific contact resistances of specimens annealed by both methods are given.
Anderson, W. T., Jr.↗
SiC device development for high temperature sensor applications
Progress made in the processing and characterization of 3C-SiC for high temperature sensor applications is reviewed. Piezoresistance properties of silicon carbide and the temperature coefficient of resistivity of n-type beta-SiC are presented. In addition, photoelectrical etching and dopant selective etch-stops in SiC and high temperature Ohmic contacts for n-type beta-SiC sensors are discussed.
Shor, J. S.↗
Progress in advanced high temperature materials technology
Materials for intermediate temperature applications are considered, taking into account possibilities regarding the use of prealloyed powder processing to obtain superalloys with increased strength for turbine disk applications. Materials for high temperature application are also discussed. Attention is given to oxide dispersion strengthened alloys (ODS), ceramics, directionally solidified eutectics, ODS + gamma prime alloys, and composites. A description is presented of various approaches for providing environmental protection.
Freche, J. C.↗
NASA PS400: A New Temperature Solid Lubricant Coating for High Temperature Wear Applications
A new solid lubricant coating, NASA PS400, has been developed for high temperature tribological applications. This plasma sprayed coating is a variant of the patented PS304 coating and has been formulated to provide higher density, smoother surface finish and better dimensional stability than PS304. PS400 is comprised of a nickel-molybdenum binder that provides strength, creep resistance and extreme oxidative and dimensional stability. Chromium oxide, silver and barium-calcium fluoride eutectic are added to the binder to form PS400.Tribological properties were evaluated with a pin-on-disk test rig in sliding contact to 650 C. Coating material samples were exposed to air, argon and vacuum at 760 C followed by cross section microscopic analysis to assess microstructure stability. Oil-Free microturbine engine hot section foil bearing tests were undertaken to assess PS400 s suitability for hot foil gas bearing applications. The preliminary results indicate that PS400 exhibits tribological characteristics comparable to the PS304 coating but with enhanced creep resistance and dimensional stability suitable for demanding, dynamic applications.
DellaCorte, C.↗
Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications
A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.
High temperature↗
Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications
A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.
High temperature↗