Flat conductor technology exemplified
Flat conductor harness for lightweight multilayer printed circuit board
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Flat conductor harness for lightweight multilayer printed circuit board
Axial transverse laminography and mutual coupling nondestructive techniques for inspection of multilayer printed circuit boards
Multilayer insulation systems evaluation for 300 to 700 degrees K temperatures
Multilayer insulation system materials and design data for use on spacecraft in temperature range from 300 to 800 degrees K
Nondestructive testing techniques for multilayer printed wiring boards stressing axial transverse laminography and mutual coupling
Vacuum multilayer insulation for cryogenic space propulsion vehicles noting self-evacuation system and calorimetric test
Magnetization ripple in multilayer films, noting dependence on copper layer
Minimum weight combinations of shields and spacers for lowest heat flux, noting mounting technique and leakage effect
Thickness, material type, environmental and surface emittance of radiation shield effects on thermal performance of multilayer insulation system
Multilayer board compared to two-sided board circuits, discussing circuit reliability, flexibility, cost, packaging density, etc
Cryogenic flexibility of single and multiple ply thin polymeric film tested for porosity, cycle life and film thickness relation
Long term cryogenic propellant storage in space, considering rigid open cell polyurethane foam as spacer in multilayer insulation system
Stress analysis of multilayered composite structures with flaws, emphasizing application to fracture studies
Multilayered interference structure has about 6 percent reflectivity. Normal-incidence X-Ray Mirror, bent into spherical surface of radius 1.1mm used to image electroformed-nickel grid onto photographic film sensitive to soft X-rays. Grid set at distance of 1,067 mm from mirror, illuminated by simple Coolidge-type X-ray tube with carbon anode operated from 1.5KV supply. Film set at distance of 1,186 mm from mirror with resultant magnification of 1.11.
Nickel-base superalloys are the most complex and the most widely used for high temperature applications such as aircraft engine components. The desirable properties of nickel-base superalloys at high temperatures are tensile strength, thermomechanical fatigue resistance, low thermal expansion, as well as oxidation resistance. At elevated temperature, fatigue cracks are often initiated by grain boundary oxidation, and fatigue cracks often propagate along grain boundaries, where the oxidation rate is higher. Oxidation takes place at the interface between metal and gas. Properties of the metal substrate, the gaseous environment, as well as the oxides formed all interact to make the oxidation behavior of nickel-base superalloys extremely complicated. The important topics include general oxidation, selective oxidation, internal oxidation, grain boundary oxidation, multilayer oxide structure, accelerated oxidation under stress, stress-generation during oxidation, composition and substrate microstructural changes due to prolonged oxidation, fatigue crack initiation at oxidized grain boundaries and the oxidation accelerated fatigue crack propagation along grain boundaries.
A variety of techniques have been proposed for fabricating integrated optical devices using semiconductors, lithium niobate, and glasses as waveguides and substrates. The use of glass waveguides and their interaction with thin semiconductor cladding layers was studied. Though the interactions of these multilayer waveguide structures have been analyzed here using glass, they may be applicable to other types of materials as well. The primary reason for using glass is that it provides a simple, inexpensive way to construct waveguides and devices.
An extensive experimental study was conducted using various electrolytes in an effort to find an appropriate electrolyte for anodic dissolution of InP. From the analysis of electrochemical characteristics in the dark and under different illumination levels, x ray photoelectron spectroscopy and SEM/Nomarski inspection of the surfaces, it was determined that the anodic dissolution of InP front surface layers by FAP electrolyte is a very good choice for rendering smooth surfaces, free of oxides and contaminants and with good electrical characteristics. The FAP electrolyte, based on HF, CH3COOH, and H2O2 appears to be inherently superior to previously reported electrolytes for performing accurate EC-V profiling of InP at current densities of up to 0.3 mA/sq cm. It can also be used for accurate electrochemical revealing of either precipitates or dislocation density with application to EPD mapping as a function of depth, and for defect revealing of multilayer InP structures at any depth and/or at the interfaces.
A microporous structure with layered interstitial surface treatments, and the method and apparatus for its preparation are disclosed. The structure is prepared by sequentially subjecting a uniformly surface treated structure to atomic oxygen treatment to remove an outer layer of surface treatment to a generally uniform depth, and then surface treating the so exposed layer with another surface treating agent. The atomic oxygen/surface treatment steps may optionally be repeated, each successive time to a lesser depth, to produce a microporous structure having multilayered surface treatments. The apparatus employs at least one side arm from a main oxygen-containing chamber. The side arm has characteristic relaxation times such that a uniform atomic oxygen dose rate is delivered to a specimen positioned transversely in the side arm spaced from the main gas chamber.