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The application of increased pressure during the curing process of B-stage epoxy has been hypothesized to enhance the adhesive properties and bond strength in printed wiring board (PWB) assembly. This study aimed to investigate the correlation between pressure application and the performance of B-stage epoxy.
Determining kinetic parameters such as activation energy (Ea), pre-exponential factor (A), rate constants, and reaction order (n) via thermal analysis techniques is important to material synthesis and fabrication, industrial production, biomedicals, energy storage, catalysis, etc. Various kinetic methods based on the non-isothermal techniques have been developed to obtain the kinetic parameters. In this review, we focus on introducing various kinetic methods in non-isothermal analysis and their applications in different reactions, including thermal decomposition, solid-state phase transformation, crystallization, thermal ignition, curing process, etc.
Recently, the manufacturing of porous polydimethylsiloxane (PDMS) with engineered porosity has gained considerable interest due to its tunable material properties and diverse applications. An innovative approach to control the porosity of PDMS is to use transient liquid phase water to improve its mechanical properties, which has been explored in this work. Adjusting the ratios of deionized water to the PDMS precursor during blending and subsequent curing processes allows for controlled porosity, yielding water emulsion foam with tailored properties. The PDMS-to-water weight ratios were engineered ranging from 100:0 to 10:90, with the 65:35 specimen exhibiting the best mechanical properties with a Young’s Modulus of 1.17 MPa, energy absorption of 0.33 MPa, and compressive strength of 3.50 MPa. This led to a porous sample exhibiting a 31.46% increase in the modulus of elasticity over a bulk PDMS sample. Dowsil SE 1700 was then added, improving the storage capabilities of the precursor. The optimal storage temperature was probed, with -60 °C resulting in great pore stability throughout a three-week duration. The possibility of using these water emulsion foams for paste extrusion additive manufacturing (AM) was also analyzed by implementing a rheological modifier, fumed silica. Fumed silica’s impact on viscosity was examined, revealing that 9 wt% of silica demonstrates optimal rheological behaviors for AM, bearing a viscosity of 10,290 Pa·s while demonstrating shear-thinning and thixotropic behavior. This study suggests that water can be used as pore-formers for PDMS in conjunction with AM to produce engineered materials and structures for aerospace, medical, and defense industries as sensors, microfluidic devices, and lightweight structures.
Residual stresses in composites are induced during fabrication and by environmental exposure. The theory formulated can describe the shrinkage commonly observed after a thermal expansion test. Comparison between the analysis and experimental data for laminates of various material systems indicates that the residual stress-free temperature can be lower than the curing temperature, depending on the curing process. Effects of residual stresses on ply failure including the acoustic emission characteristics are discussed.
Adhesive-bond thickness in honeycomb-sandwich radiators is verified by visual inspection. Markoff on flow tubes created during curing process is directly related to adhesive thickness.
An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.
Report discusses tests of commercial phenol/formaldehyde resins to establish relationships among composition before use, behavior during curing, and strength after curing. Resin used in carbon/carbon laminates. In curing process, two molecules of phenol joined together in sequence of reactions involving molecule of formaldehyde. Last step of sequence, molecule of water released. Sequence repeats until one of ingredients used up, leaving solidified thermoset plastic. Issues to be resolved: number and relative abundances of ingredients, presence of certain chemical groups, heat-producing ability of resin, and range of molecular weights present.
A characterization methodology has been developed on which to base quality assurance procedures for U.S. Polymeric V378A bismaleimide matrix resin. Chemical composition is established by partition reverse phase and size exclusion liquid chromatography. Cure rheology behavior is quantitatively characterized by dynamic viscoelastic analysis using the parallel plate technique. The overall cure process is characterized by differential scanning calorimetry. The sensitivity of the procedures is evaluated by studying the effects of ambient out time on the chemical end behaviorial properties of the resin.
Report describes preliminary attempts at dielectric monitoring of curing of graphite/epoxy and carbon/phenolic composites. Objective is to develop dielectric monitoring for optimizing curing process and reduce incidence of failures of produced composite structures.
The aim of this study is to find a reliable numerical algorithm to calculate thermal design sensitivities of a transient problem with discontinuous derivatives. The thermal system of interest is a transient heat conduction problem related to the curing process of a composite laminate. A logical function which can smoothly approximate the discontinuity is introduced to modify the system equation. Two commonly used methods, the adjoint variable method and the direct differentiation method, are then applied to find the design derivatives of the modified system. The comparisons of numerical results obtained by these two methods demonstrate that the direct differentiation method is a better choice to be used in calculating thermal design sensitivity.
Results are presented from the continued investigations into the use of ultrasonic measurement techniques for the detection and characterization of porosity. The effects that bleeder cloth impressions (left after the cure process) have on the capability of polar backscatter to interrogate volume effects such as porosity are described. Some preliminary data regarding a comparison of phase sensitive and phase insensitivie detection for materials characterization is presented.
Frequency-dependent dielectric measurements in a curing resin sample were performed using an impedance analyzer and a permittivity sensor, to separate and measure the ionic (sigma) and dipolar (tau) mobilities, used as molecular probes of the cure reaction in the resin. The resin samples were tetraglycidyl 4,4-prime-diaminodiphenylmethane epoxy resins which included catalyzed (Hercules 3501-6) and uncatalyzed l3502 resin samples. The values of sigma and tau were used to quantitatively determine the viscosity, the degree of cure, and the T(g) of the resin. It is shown that the values of the Arrhenius and WLF constants during the cure process reflect the buildup of the crosslink network.
Real-time in situ monitoring of the chemical states of epoxy resins was investigated during cure in an autoclave using infrared evanescent spectroscopy. Fiber evanescent sensors were developed which may be sandwiched between the plies of the prepreg sample. A short length of sapphire fiber was used as the sensor cell portion of the fiber probe. Heavy metal fluoride glass optical fiber cables were designed for connecting the FTIR spectrometer to the sensor fiber within the autoclave. The sapphire fibers have outstanding mechanical thermal properties which should permit their use as an embedded link in all thermoset composites. The system is capable of operation at a temperature of 250 C for periods up to 8 hours without major changes to the fiber transmission. A discussion of the selection of suitable sensor fibers, the construction of a fiber-optic interface, and the interpretation of in situ infrared spectra of the curing process is presented.
The N-CYCAP polyimides utilize a (2,2) paracyclophane endcap that polymerizes and does not generate volatile gases during the cure process. These polyimides have both high glass temperatures (390 C) and an onset of decomposition in air of 560 C. Thermal oxidative stability (TOS) weight loss studies show that replacing 25 percent by weight of the paraphenylene diamine in the polymer backbone with metaphenylene diamine improves the weight loss characteristics. N-CYCAP neat resin samples performed better than PMR-II-50 when exposed at 343 and 371 C in air for up to 1000 hours. Preliminary composite studies show that both PMR-II-50 and N-CYCAP have better thermal stability when fabricated on T-40R. Higher isothermal aging temperatures of longer aging times are needed to determine the differences in TOS between composite samples of PMR-II-50 and N-CYCAP polyimides.
Newly formulated paste for application to positive plates of lead/acid batteries imparts higher discharge currents and higher specific energy. Other disadvantages of paste, designated F2: contains no acid or free lead, no extra curing process required, and paste has high porosity, high surface area, and good strength.
Several models simulating plain weave, graphite/epoxy woven composites are presented, along with the effects that the simultaneous application of pressure and thermal loads have on their surfaces. The surface effects created by moisture absorption are also examined. The computational simulation consisted of using a two-dimensional finite element model for the composite. The properties of the finite element (FE) model are calculated by using the in-house composite mechanics computer code ICAN (Integrated Composite ANalyzer). MSC/NASTRAN is used for the FE analysis which yields the composite's top surface normalized displacements. These results demonstrate the importance of parameters such as the cure temperature (T sub o) and the resin content in the curing process of polymer-matrix composites. The modification of these parameters will help tailor the composite system to the desired requirements and applications.
Several models simulating plain weave, graphite/epoxy woven composites are presented, along with the effects that the simultaneous application of pressure and thermal loads have on their surfaces. The surface effects created by moisture absorption are also examined. The computational simulation consisted of using a two-dimensional finite element model for the composite. The properties of the finite element (FE) model are calculated by using the in-house composite mechanics computer code ICAN (Integrated Composite ANalyzer). MSC/NASTRAN is used for the FE analysis which yields the composite's top surface normalized displacements. These results demonstrate the importance of parameters such as the cure temperature (T sub o) and the resin content in the curing process of polymer-matrix composites. The modification of these parameters will help tailor the composite system to the desired requirements and applications.
A shear deformation theory including residual thermal and moisture effects is developed for the analysis of either symmetric or unsymmetric laminates with mid-plane edge delamination under torsion loading. The theory is based on an assumed displacement field which includes shear deformation. The governing equations and boundary conditions are obtained from the principle of virtual work. The analysis of the (90/(+/- 45)(n)/(-/+ 45)(n)/90)(s) ECT mode 3 test lay-up indicates that there are no hygrothermal effects on the mode 3 strain energy release rate because the laminate, and both sublaminates above and below the delamination, are symmetric lay-ups. A further parametric study reveals that some other lay-ups can have negligible hygrothermal effects even when the sublaminates above and below the delamination are not symmetric about their own mid-planes. However, these lay-ups may suffer from distortion after the curing process. Another Interesting set of lay-ups investigated is a class of antisymmetric laminates with (+/-(theta/(theta -90)(2)/theta))(n) lay-ups. It is observed that when n takes on even numbers (2 and 4), both hygrothermal and mode 1 effects can be neglected. From this point of view, these lay-ups provide a way to determine the mode 3 toughness between two dissimilar layers. However, when n takes on odd numbers (1 and 3), both hygrothermal and mode 1 effects may be strong in these lay-ups. In particular, when theta equals 45 deg, the lay-ups are free from both hygrothermal and mode 1 effects irrespective of n.