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Surface failure of titanium carbide cermet and silicon carbide ball in rolling contact at temperatures to 2,000-deg f
High energy density capacitors made from metallized polyvinylidene fluoride film were built and tested. Terminations of aluminum-babbitt, tin-babbitt, and all-babbitt were evaluated. All-babbit terminations appeared to be better. The 0.1 microfarad and 2 microfarad capacitors were made of 6 micrometer material. Capacitance, dissipation factor, and insulation resistance measurements were made over the ranges -55 C to 125 C and 10 Hz to 100 kHz. Twelve of forty-one 0.1 microfarad capacitors survived a 5000 hour dc plus ac life test. Under the same conditions, the 2 microfarad capacitors exhibited overheating because of excessive power loss. Some failures occurred after low temperature exposures for 48 hours. No failures were caused by vibration or temperature cycling.
The research consisted of two major parts, first modeling and simulation of the combined effects of aging and damage on polymer composites and secondly an experimental phase examining composite response at elevated temperatures, again activating both aging and damage. For the simulation, a damage model for polymeric composite laminates operating at elevated temperatures was developed. Viscoelastic behavior of the material is accounted for via the correspondence principle and a variational approach is adopted to compute the temporal stresses within the laminate. Also, the effect of physical aging on ply level stress and on overall laminate behavior is included. An important feature of the model is that damage evolution predictions for viscoelastic laminates can be made. This allows us to track the mechanical response of the laminate up to large load levels though within the confines of linear viscoelastic constitutive behavior. An experimental investigation of microcracking and physical aging effects in polymer matrix composites was also pursued. The goal of the study was to assess the impact of aging on damage accumulation, in ten-ns of microcracking, and the impact of damage on aging and viscoelastic behavior. The testing was performed both at room and elevated temperatures on [+/- 45/903](sub s) and [02/903](sub s) laminates, both containing a set of 90 deg plies centrally located to facilitate investigation of microcracking. Edge replication and X-ray-radiography were utilized to quantify damage. Sequenced creep tests were performed to characterize viscoelastic and aging parameters. Results indicate that while the aging times studied have limited ]Influence on damage evolution, elevated temperature and viscoelastic effects have a profound effect on the damage mode seen. Some results are counterintuitive, including the lower strain to failure for elevated temperature tests and the catastrophic failure mode observed for the [+/- 45/9O3](sub s), specimens. The fracture toughness for transverse cracks increases with increasing temperature for both systems: transverse cracking was completely absent prior to failure in [+/- 45/903](sub s), and was suppressed for [02/903](sub s). No significant effect of damage on aging or viscoelastic parameters was observed.
The reliability of one lot of high K multilayer ceramic capacitors was evaluated using accelerated life testing. The degradation in insulation resistance was characterized as a function of voltage and temperature. The times to failure at a voltage-temperature stress conformed to a lognormal distribution with a standard deviation approximately 0.5.
We have reported SiC integrated circuits (IC's) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 C [1, 2]. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 C [3]. However, this thermal ramp was not ended until a peak temperature of 880 C (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology. Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 C. In one test, the temperature was ramped and then held at 727 C, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 C before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 C (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 C.
This paper presents the initial development of a high temperature life prediction method that accounts for the variability in the material properties of Grade 91 steel. The method accounts for material variability by fitting a variable 3-parameter Weibull distribution to experimental rupture data and accounts for the variability of creep deformation on the steady-state stresses via a Monte Carlo approach. To ensure reasonable computational times, the model represents the material as an extremely viscous Stokes fluid with a non-Newtonian viscosity, therefore solving the stress relaxation problem with a steady, static, instead of transient, analysis. Furthermore, the complete statistical analysis combines this model for creep deformation with a probabilistic model for creep rupture to evaluate the probability of premature failure for a set of sample problems, comparing the predicted failure statistics to the design life predicted by the ASME Boiler and Pressure Vessel Code rules.
A curved beam type of test specimen is evaluated for use in determining the through-the-thickness strength of laminated composites. Two variations of a curved beam specimen configuration (semicircular and elliptical) were tested to failure using static and fatigue loads. The static failure load for the semicircular specimens was found to be highly sensitive to flaw content, with the specimens falling into two distinct groups. This result supports the use of proof testing for structural validation. Static design allowables are derived based on the Weibull distribution. Fatigue data indicates no measured increase in specimen compliance prior to final fracture. All static and fatigue failures at room temperature dry conditions occurred catastrophically. The elliptical specimens demonstrated unusually high failure strengths indicating the presence of phenomena requiring further study. Results are also included for specimens exposed to a wet environment showing a matrix strength degradation due to moisture content. Further testing is underway to evaluate a fatigue methodology for matrix dominated failures based on residual static strength (wearout).
A curved beam type of test specimen is evaluated for use in determining the through-the-thickness strength of laminated composites. Two variations of a curved beam specimen configuration (semi-circular and elliptical) were tested to failure using static and fatigue loads. The static failure load for the semi-circular specimens was found to be highly sensitive to flaw content, with the specimens falling into two distinct groups. This result supports the use of proof testing for structural validation. Static design allowables are derived based on the Weibull distribution. Fatigue data indicates no measured increase in specimen compliance prior to final fracture. All static and fatigue failures at room temperature dry conditions occurred catastrophically. The elliptical specimens demonstrated unusually high failure strengths indicating the presence of phenomena requiring further study. Results are also included for specimens exposed to a wet environment showing a matrix strength degradation due to moisture content. Further testing is under way to evaluate a fatigue methodology for matrix dominated failures based on residual static strength (wearout).
In conventional wellbore-integrity analysis, the cement sheath’s initial state of stress and transient thermoporoelastic effects are often neglected. However, the initial state of stress is prerequisite information for accurately predicting the safe operating conditions that prevent a cemented well from being damaged. In addition, transient thermoporoelastic effects can have a profound effect on when damage will occur. Here in this paper, we propose a model that includes these effects to predict the safe operating pressures and temperatures that will prevent cement-sheath failure. For the initial state of stress, we proposed an empirical model using measurements. Subsequent stress changes are evaluated by a fully coupled transient thermoporoelastic model to analyze the mechanical behavior of the cement sheath. We predict the safe operating envelope (SOE) for shear, tensile, and debonding cement-sheath failures caused by pressure and temperature perturbations after the cement sets. Our model predicts that pore pressure is a key factor for cement failure, especially for rapid temperature changes. If the formation is low permeability, the transient pore pressures are amplified, causing the risk of damage to increase. Compared with conventional thermoelastic models, the thermoporoelastic model predicts a smaller SOE when heating the internal casing fluid and a larger envelope when cooling the internal casing fluid. Finally, the heating rate was considered with respect to field applications. The heating rate was also considered, and slower heating/cooling rates can prevent damage to the cement sheath. Finally, the thermoporoelastic model was applied to explain several laboratory and field experiments and achieved good matches.
Specimens of HK31XA-H24 magnesium-alloy sheet from an experimental batch were heated to failure at nominal temperature rates from 0.2 F to 100 F per second under constant-load conditions. Rapid-heating yield and rupture stresses are presented and compared with the yield and ultimate stresses from elevated-temperature tensile stress-strain tests for 1/2-hour exposure. Linear temperature-rate parameters were used to correlate rapid-heating results by constructing master curves which can be used for predicting yield stresses and temperatures and for estimating rupture stresses and temperatures.
Failure rate for given semiconductor device is simply determined by reading value of normalized junction temperature from printout for any given combination of ambient temperature, stress ratio, and maximum rated junction temperature, and obtaining corresponding failure rate from graph.
We have reported SiC integrated circuits (ICs) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 degrees Centigrade. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 degrees Centigrade. However, this thermal ramp was not ended until a peak temperature of 880 degrees Centigrade (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology.Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 degrees Centigrade. In one test, the temperature was ramped and then held at 727 degrees Centigrade, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 degrees Centigrade before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 degrees Centigrade (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 degrees Centigrade.
The Space Shuttle's Reusable Solid Rocket Motor (RSRM) nozzle program has recently conducted testing to characterize the effects of multi-axial loading, temperature and time on the failure characteristics of TIGA321, EA913NA, EA946 (three filled epoxy adhesives). From the test data a "Multi-Axial, Temperature, and Time Dependent" or MATT failure criterion was developed. It is shown that this criterion simplifies, for constant load and constant load rate conditions, into a form that can be easily used for stress analysis. Failure for TIGA321 and EA913NA are characterized below their glass transition temperature. Failure for EA946 is characterized for conditions that pass through its glass transition. The MATT failure criterion is shown to be accurate for a wide range of conditions for these adhesives.
Solid-state, high-temperature sensing devices are required for accurate temperature, strain/stress, and failure monitoring for a range of advanced manufacturing, transportation, and military applications. High temperature conditions limit sensing strategies, where typically traditional metal and semiconductor materials are unstable, and the sensing options are limited to optical spectroscopy methods. In addition, strategies to embed the sensors directly within active components and protective thermal refractory are of interest that permit near-environment sensing which is not possible with the traditional electronic materials and components. Rare-earth chromite semiconductors exhibit some properties of interest for high temperature sensing technologies, such as: high microstructure and chemical stability, relatively high electronic conductivity at high temperatures, and relative thermal expansion coefficient matching to refractory thermal protective insulation (such as high-zirconia and -alumina ceramics). In this work, n-type and p-type doped lanthanum chromites compositions were computationally modelled and prepared, and the electrical, thermoelectric, and thermomechanical properties were measured for the obtained material systems. A few compositions were then processed into thick film health and temperature sensors and tested at high temperatures. To establish relative stability under harsh environment conditions, post- mortem microstructure and chemical composition was characterized after extended and cycle testing at high temperatures.
Transportation monitoring unit (TMU) qualification testing was performed between 3 Mar. and 14 Dec. 1989. The purpose of the testing was to qualify the TMUs to monitor and store temperature and acceleration data on redesigned solid rocket motor segments and exit cones while they are being shipped from Utah's Thiokol Corporation, Space Operations, to Kennedy Space Center. TMUs were subjected to transportation tests that concerned the structural integrity of the TMUs only, and did not involve TMU measuring capability. This testing was terminated prior to completion due to mounting plate failures, high and low temperature shutdown failures, and data collection errors. Corrective actions taken by the vendor to eliminate high temperature shutdowns were ineffective. An evaluation was performed on the TMUs to determine the TMU vibration and temperature measuring accuracy at a variety of temperatures. This test demonstrated that TMU measured shock levels are high, and that TMUs are temperature sensitive because of decreased accuracy at high and low temperatures. It was determined that modifications to the current TMU system, such that it could be qualified for use, would require a complete redesign and remanufacture. Because the cost of redesigning and remanufacturing the present TMU system exceeds the cost of procuring a new system that could be qualified without modification, it is recommended that an alternate transportation monitoring system be qualified.
Transistor second breakdown location, size and temperature detected and analyzed before failure by high resolution IR microscope
Plasma sprayed coatings have a complex structure which is produced by the overlaying of many molten or semi-molten particles in the diameter range of 20 to 120 microns. The failure behavior of coatings has been characterized by using acoustic emission (AE) methodology. Coatings of NiCrAlY bond coat with a zirconia-12 wt pct yttria overlay were applied to disk-shaped specimens of U-700 alloy. A waveguide of 1-mm diameter platinum was TlG welded to the specimen and allowed it to be suspended in a tubular furnace. The specimen was thermally cycled to 1150 C and the AE monitored. Analyses have been carried out with the aim of establishing parameters which are related to the crack size population. These studies have been used to postulate types of cracking mechanisms which may occur in plasma sprayed coatings during thermal cycling. It is shown that microcracking gave rise to a large amount of AE. However, this coating still survived more thermal cycles than a coating which exhibited macrocracking events.
Additive manufacturing opens new paths for introducing oxide particles into superalloys, to potentially provide oxide dispersion strengthening (ODS) at high temperatures. This provides opportunities to study how such dispersions can influence failure modes for a given superalloy, after nearly identical material processing paths. The objective of this study was to compare monotonic failure modes for additively manufactured superalloys with versus without an introduced oxide dispersion. The superalloy for each case was produced by laser powder bed fusion additive manufacturing. Specimens were subsequently given consistent thermal treatment paths and then tested in tensile and creep tests at varied temperatures. Failure modes were then compared. Additively manufactured NiCrAl without ODS had randomly oriented equiaxed grains while this alloy with 0.25 wt% Y 2 O 3 ODS additions had elongated [001] oriented grains in the build direction. Material made without ODS (“No-ODS”) was nearly completely single phase gamma, while ODS additions resulted in gamma, chromium carbide, and Y-Al-Cr oxide phases, with carbide and oxide phases contents estimated at no more than 13 and 1 vol%, respectively. Compared to No-ODS, material made with ODS had higher tensile strengths at room, 760 and 1093 °C. The elongation of ODS material was lower than No-ODS at room temperature, but higher at 760 °C. At 1093 °C ODS material had higher elongation than No-ODS when tested in the build direction, however elongation was lower for ODS material in the transverse direction at 1093 °C. Creep rupture strain, life, and area reduction at 760 and 1093 °C were all much higher for ODS material compared to No-ODS; 760 °C rupture life was nearly 100 times longer for ODS material. The presence of Y in the ODS material significantly improved oxidation resistance.