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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7

A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter

This article presents the design and analysis of a double-side-cooled printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge package with low loop inductances and an integrated gate driver. The 1.2 kV SiC MOSFET dies used in the half-bridge package are embedded in the PCB using AT&S's patented technique. The dies are cooled and electrically connected to traces in the PCB through copper-filled microvias. The design methodology accounts for both electrical and thermal performance, limiting the power-loop inductance to 2.3 nH and the maximum package temperature to less than the 175 °C limit. The integration of the gate drive circuitry allows for a high power density and 2.2 nH gate-loop inductances. At 0.12 K/W, the measured junction-to-case thermal resistance with double-sided cooling is 57% lower than that of a TO-247 package. Under similar operating conditions, the PCB-embedded half-bridge package also achieves a 5.6 times lower voltage overshoot and a 0.5% higher peak efficiency than a TO-247-based half-bridge. This article reports the first demonstration of PCB-embedded 1.2 kV SiC MOSFET packages in buck, boost, and ac–dc converters. Furthermore, the prototype three-phase ac–dc converter for an electric vehicle on-board charger is composed of six PCB-embedded half-bridge packages and achieves an efficiency of 98.2% and a power density of 182 W/in 3 .

42 ENGINEERING↗

PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling

Lateral gallium nitride (GaN) high-electron-mobility transistors (HEMTs) present better electrical characteristics compared to silicon or silicon carbide devices such as high switching speed and low gate charge, but also present additional challenges on the module design. Here, this paper discusses a high-density GaN power module with double-sided cooling, low inductance, on-package decoupling capacitors, and integrated gate drivers. The GaN dies as well as the gate drive are sandwiched between the printed circuit board (PCB) and direct bonded copper (DBC) substrate to achieve compact loop and double-sided cooling effect. Design considerations and thermal performance are analyzed. A module assembly procedure is presented utilizing the layer-by-layer attachment process. Finally, a 2.7 cm x 1.8 cm half-bridge GaN power module is fabricated and tested, achieving a low power-loop inductance of 1.03 nH, and the overshoot voltage of the switching waveform is less than 5% under a 400-V/25-A double-pulse test. The thermal resistance is 0.32 K/W, verified by simulation and experimental results. The design and assembly process can be generalized and applied to high power applications to achieve high power density and high performance.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Proposed Material Properties, Allowable Stresses, and Design Curves of Diffusion Bonded Alloy 800H for the ASME Code Section III Division 5

Abstract Increased interest in compact heat exchangers (CHXs) to serve as intermediate heat exchangers of very high temperature reactors resulted in significant research and development on their design, analysis, and construction. Printed circuit heat exchangers are a type of CHXs with high thermal efficiency and compactness achieved through diffusion bonding a stack of etched plates with millimeter scaled channels. The diffusion bonding process changes the microstructural and mechanical properties of the wrought metal plates. The current nonnuclear design code ASME section VIII, division 1 captures the material property change through a “joint efficiency factor.” However, the current nuclear design code ASME section III, division 5 does not address or support the diffusion bonded material properties. Hence, there is a need to develop allowable stresses, isochronous curves, and fatigue life curves for various diffusion bonded alloys. In this study, Alloy 800H material was selected to establish the diffusion bonded material properties under tension, creep, fatigue, and creep-fatigue loads at elevated temperatures in the range 550–760 °C. A set of tests on diffusion bonded Alloy 800H (DB 800H) were performed and the acquired data are used in developing allowable stresses Sy, Su, Sr, Sm, St, Smt, So, isochronous curves and fatigue life curves according to the ASME section III, division 5 requirements. This paper also presents detailed procedures used in developing the ASME code section III division 5 design provisions for diffusion bonded Alloy 800H.

Engineering↗

Multi-Objective Optimization of a Bi-Metal High-Temperature Recuperator for Application in Concentrating Solar Power

Supercritical CO 2 closed Brayton cycles are a major candidate for future power cycle designs in concentrating solar power applications, with high-temperature recuperators playing an essential role in realizing their high thermal efficiency. Here, printed circuit heat exchangers (PCHEs) are often chosen for this role due to their thermal-hydraulic and mechanical performance at high temperatures and pressures, all while remaining compact. However, PCHEs can be costly because of the high-performance materials demanded in these applications, and the heat exchanger internal geometry is restricted by their manufacturing process. Additively manufactured heat exchangers can address both of these shortcomings. This work proposes a modular bi-metal high-temperature recuperator with integrated headers to be produced with additive manufacturing. Beginning with existing PCHE channel geometries, a 1D heat exchanger model is developed. Then, multi-objective optimization is used to maximize the heat transfer effectiveness of a lab-scale device while limiting its size. Two distinct channel geometries emerge from the optimization. Optimal designs achieve up to 88% effectiveness with negligible pressure drop. Deterioration of effectiveness due to axial conduction of heat in the heat exchanger walls is found to be a notable problem for lab-scale PCHEs, and the optimal designs obtained here minimize its detrimental effects. A sensitivity analysis reveals that the effectiveness of the recuperator is much less sensitive to variation in mass flowrate in off-design operation when axial conduction is significant, while increasing the length of the device easily increases effectiveness.

14 SOLAR ENERGY↗

TRIZ-Based Design Improvement for Facilitating Transmission Control Unit Remanufacturing

Design for Remanufacturing (DfRem) centers on enhancing product design and operations to facilitate remanufacturing while increasing both economic and environmental sustainability. DfRem requires a comprehensive understanding of product characteristics, production conditions, and operational constraints. Thus, DfRem requires a systematic methodology to identify and implement alternative designs. Among many critical steps in remanufacturing, disassembly is essential because it directly supports remanufacturing by separation of product components for cleaning, inspection, and other subsequent process steps. This study proposes a TRIZ-based framework to improve product design for disassembly in support of remanufacturing. The framework is applied to a transmission control unit (TCU) case study. The current TCU design prevents remanufacturing due to the sealant-based component joinery, which complicates disassembly and risks damaging the printed circuit board (PCB). After defining technical contradictions for the TCU product design and reviewing the suggested TRIZ principles to solve the conflicts, a cantilever snap-fit design alternative is developed. The economic feasibility of the snap-fit design is assessed by comparing the current and snap-fit design costs for three life cycles. The cost analysis demonstrates that the cost of the snap-fit design remains the same as the current design. Additionally, the snap-fit design offers substantial cost savings for three life cycles compared to the current design. We demonstrate how snap-fit design supports both environmental and economic sustainability.

42 ENGINEERING↗

Computational Modeling of a 3D Printed Recuperator and Subsequent Experimental Loop for Supercritical Carbon Dioxide Cycles

Oak Ridge National Laboratory (ORNL), in collaboration with mechanical-thermal energy storage (mTES) provider EarthEn, a US Department of Energy (DOE) Lab-Embedded Entrepreneurship Program (LEEP) recipient at ORNL’s Innovation Crossroads 2023, is utilizing a state-of-the-art patented 3D printing technique to design an additively manufactured (AM) supercritical CO2 (sCO2) recuperator (REC) for EarthEn’s charge/discharge cycle. The AM REC will be printed at ORNL’s Manufacturing Demonstration Facility using Inconel Alloy 718 and tested on a closed-loop, ∼100 kW scale experimental facility that is under construction. The testing will compare the printed design against a commercial-off-the-shelf Printed Circuit Heat Exchanger (PCHE) REC. The design of the sCO2 facility is guided by a Modelica-based system model which is primarily dependent on the open-source TRANSFORM library developed at ORNL and uses the open-source CoolProp library for thermophysical properties of sCO2 via the External Media library. It is envisioned that an iterative process will be followed between the physical loop and the system model wherein the initial experimental data will be used to tune the model, which in turn will be used to guide future loop operation. Simultaneously, the AM REC is being designed using computer-aided design models, and it is also being analyzed for hydraulic and thermomechanical response using commercial computational fluid dynamics software, Simcenter STAR-CCM+, on highperformance computing resources.1

See, Nate [ORNL] (ORCID:0000000178581202)↗

Production, quality assurance and quality control of the SiPM Tiles for the DarkSide-20k Time Projection Chamber

The DarkSide-20k dark matter direct detection experiment will employ a 21 m 2 silicon photomultiplier (SiPM) array, instrumenting a dual-phase 50 tonnes liquid argon Time Projection Chamber (TPC). SiPMs are arranged into modular photosensors called Tiles, each integrating 24 SiPMs onto a printed circuit board (PCB) that provides signal amplification, power distribution, and a single-ended output for simplified readout. Tiles are further grouped into Photo-Detector Units (PDUs). This paper details the production of the Tiles and the Quality Assurance and Quality Control (QA-QC) protocol established to ensure their performance and uniformity. The production and QA-QC of the Tiles are carried out at Nuova Officina Assergi (NOA), an ISO-6 clean room facility at LNGS. This process includes wafer-level cryogenic characterisation, precision die attaching, wire bonding, and extensive electrical and optical validation of each Tile. The overall production yield exceeds 83.5%, matching the requirements of the DarkSide-20k production plan. These results validate the robustness of the Tile design and its suitability for operation in a cryogenic environment.

Acerbi, F. [Fondazione Bruno Kessler]↗

RF mixing modules for superconducting qubit room temperature control systems v1.0

We have developed a series of compact RF mixing boards by integrating I/Q quadrature mixing, IF(intermediate frequency)/LO(local oscillator)/RF power level adjustments, and DC (direct current) bias fine tuning on a 40 mm × 80 mm 4-layer PCB (printed circuit board) board with EMI (electromagnetic interference) shielding.

Huang, Gang↗

TTW (Transition to Wire Device) [SWR-25-02]

The Transition to Wire (TTW) hardware project is a method for connecting solar research samples with fragile interconnects to robust, weatherproof and consistent commercial connectors. The Transition to Wire device is a printed circuit board designed to facilitate the transition from tab ribbon or other unsecured electrical contacts on research samples to either wires or a connector. The four pin connector provides a kelvin (4 wire) connection at the solder pad where the sample connects.

McDanold, Byron↗

A New PCB Rotating Coil at NSLS-II

Several R&D projects are underway at NSLS-II towards an upgrade of its storage ring with a new lattice that will use high field magnets with small bores of 16-22 mm. A large fraction of the high field magnets are expected to be of permanent magnet technology that will require precise magnetic measurements and field harmonics corrections. A new magnetic measurement bench has been built based on a printed circuit board (PCB) coil of 12 mm diameter and 270 mm active length. This PCB coil has the capabil-ity of measuring field quality to a level of 10 ppm of the main field up to the 15th harmonic with a sensitivity between 0.01 m2 and 0.02 m2 at the reference radius of 5 mm. This paper will describe the main features of the rotating coil bench and discuss the measurement results of a permanent-magnet Halbach quadrupole of 12.7 mm bore diameter.

43 PARTICLE ACCELERATORS↗

Brain-computer interfaces enabled by novel magnetometers (CRADA FP00007655 Final Report))

The work primarily focused on improving performance of magnetometers based on Acoustically Driven Ferromagnetic Resonance (ADFMR) as well as exploring and evaluating the market opportunities for such devices. Over the two year program, we were able to improve magnetometer performance by a factor of over 1000X, and were able to demonstrate the feasibility of scaling down a bench-scale implementation by developing a 4” x 4” printed circuit board (PCB) prototype. These advancements were achieved by making substantial improvements both in the core sensor technology as well as the detection circuitry that allows for readout of the sensor module.

42 ENGINEERING↗

Diffusion Bonded Hydrogen Pre-Cooler Pressure Testing

Diffusion bonded heat exchangers, also known as printed circuit heat exchangers (PCHEs), have numerous benefits over traditional shell and tube heat exchangers including high pressure containment, a compact size with 1000 to 5000 m 2 of surface area per unit volume, and lower costs. One emerging application is in hydrogen vehicle fueling stations as a hydrogen pre-cooler (H2PC™) where the hydrogen is cooled at pressures up to 900 bar. These pre-coolers must be able to withstand pressure cycling over 10 5 cycles during the fueling station lifetime without degradation of their pressure vessel integrity that could result in hydrogen leakage.

08 HYDROGEN↗

Sandia National Laboratories FY21 Progress Report

The Energetic Neutrons campaign led by Sandia National Laboratories (SNL) had a successful year testing electronic devices and printed circuit boards (PCBs) under 14 MeV neutron irradiation at OMEGA. During FY21 Sandia’s Neutron Effects Diagnostics (NEDs) and data acquisition systems were upgraded to test novel commercial off-the-shelf and Sandia-fabricated electronic components that support SNL’s National Security mission. The upgrades to the Sandia platform consisted of new cable chains, sample mount fixtures and a new fiber optics platform for testing optoelectronic devices.

42 ENGINEERING↗

Shielded and Low-Damping SPM Probes for Quantitative Electrical and Electrochemical Characterization (Phase IIA)

The purpose of this DOE SBIR award was to develop new scanning probe microscopy tools for the elucidation of electrical and electrochemical properties at the nanoscale. High performance probes are important for energy materials research. In both solar cells and batteries, the essential physics and chemistry occur at the nanoscale and nanoscale characterization tools are required for their elucidation. Two products were developed: an electrically shielded probe and an electrically conductive probe with low leakage currents. Our processes were based on post processing of existing probes and fabrication methods were tested, leading to a laser micromachining based approach that led to the first minimal viable product. We invented a method to make a reliable electrical contact that attaches a flexible printed circuit board to the chip. enable leak-free operation crucial when used in conductive liquids and electrolytes. This proprietary solution improves chip handling, reduces contamination, and maintains effective electrical contact. The probes fabricated in this Phase IIa are a minimal viable product which attracted attention from various tip manufacturers and instrument manufacturers alike.

36 MATERIALS SCIENCE↗

NDE Technology Engineering Program for Hanford DST Non-Visual Volumetric Inspection Technology: Phase II RAVIS Radiation Tolerance Test Report

This test report provides the results of radiation tolerance robustness testing that was performed on samples of robotic components and an ultrasonic guided wave air-slot sensor that represent components/sub-systems of the Robotic Air-slot Volumetric Inspection System (RAVIS) that has been engineered for volumetric inspection of Hanford tank bottom plates via under-tank refractory pad air-slots. The specific components tested for 1) functionality during active irradiation and 2) tolerance to cumulative radiation dose (until failure or upon reaching a cumulative dose test limit) were: • four samples each of a printed circuit board (PCB) and direct current (DC) motor, which are robotic components, and • 26 ultrasonic piezoelectric elements (samples) inside an air-slot sensor. The robotic components are part of the RAVIS air-slot inspection crawler drive control system that is responsible for remote communication with and actuation of the air-slot inspection crawler. The failure of either of these components during under-tank deployment would require manual retrieval via the crawler’s tether, which risks damage to the robot/refractory/tank. Preemptive replacement of the components at appropriately conservative dose/time intervals informed by failure dose would reduce the likelihood of under-tank failure. The components were included in radiation tolerance testing to quantify their failure doses to inform replacement intervals. The air-slot sensor is responsible for collecting ultrasonic inspection data (scan images) for the tank bottom plates during under-tank deployment. Compromised signal quality due to elevated noise levels caused by gamma radiation would compromise inspection performance. The air-slot sensor was included in radiation tolerance testing to quantify the impact of active irradiation on sensor signal quality. The irradiation and in-situ functional tests of the PCBs, DC motors and air-slot sensor took place in June and July 2020 at the Pacific Northwest National Laboratory. Testing was performed at a gamma dose rate near 300 rad/hr., which, in the absence of under-tank dose rate data, has been conservatively estimated to be the upper-bound dose rate beneath the primary tanks at Hanford. Irradiation took place at elevated temperatures of 150-200°F to determine failure doses that reflect the compounding effects of gamma radiation and heat. The test results revealed: • The DC motors can tolerate being actively irradiated at the high dose rate at 200°F and can tolerate a cumulative dose of 300,000 rad, that which would be incurred after 5 years of service at the 300 rad/hr dose rate. The component therefore meets minimum and preferred radiation tolerance and lifecycle requirements for robotic components. • The air-slot sensor can tolerate being actively irradiated at the high dose rate at 150°F and can tolerate a cumulative dose of 60,000 rad, that which would be incurred after 1 year of service at the 300 rad/hr dose rate. The sensor therefore meets minimum radiation tolerance and lifecycle requirements. • The PCB can tolerate being actively irradiated at the high dose rate, but can only tolerate a cumulative dose of 19,000 rad at 150-200°F. The PCB does not meet minimum radiation tolerance and lifecycle requirements; however, because the component is considered replaceable, it can be replaced before a cumulative dose of 19,000 rad is reached, determined through either monitoring with a dosimeter or scheduled time intervals that are calculated based on conservative estimates of under-tank dose rates.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗

Chemical Recycling of Mixed Plastics and Valuable Metals in the Electronic Waste Using Solvent-Based Processing

Annually, 20-55 million tons of electronic waste (e-waste) is produced worldwide (5% of all municipal solid waste). Although e-waste embodies only 2% of America’s municipal waste, it accounts for a significantly larger proportion of the heavy metals and flame retardants present in the waste stream. Currently, less than 20% of all e-waste is recycled in the United States because the heterogeneity of the feedstock limits the opportunity for reuse in high value products and processing of the waste itself is often too costly to justify handling. To address this concern, the aims of this study are: 1) to identify the major plastic and metal compositions within electronic shredder residue (ESR), 2) to formulate solvents and processing conditions to separate 90% of the plastics targeted from consumer shred ESR, and 3) to develop a process design model to estimate the cost and energy efficiency of the proposed solvent-based processing. In this study, a pre-sorted heterogeneous ESR feedstock (one where aluminum, magnetic components, and hazardous battery materials removed by an e-waste recycling facility) was used, with the major compositions of the ESR characterized. It was found that 25 wt.% of the feedstock was composed of plastics, 6 wt.% rubber, 27 wt.% printed circuit boards, 23% wire, and the remainder metals and capacitors. Within the plastic portion, polystyrene (PS, 40 wt.%), acrylonitrile butadiene styrene (ABS, 25 wt.%), and styrene-acrylonitrile (SAN, 9wt.%) were identified to compose the majority of the screened plastics using Fourier transform infrared spectroscopy (FTIR). Next, selective solvents were screened using Hansen Solubility Parameter Theory (HSP) for dissolving PS and ABS. The pre-screening results show that methylene chloride (dichloromethane, DCM) and tetrahydrofuran (THF) are capable of dissolving the most PS and ABS, while methanol (MeOH) and ethylene glycol (EG) are capable of precipitating the most PS and ABS. These solvents were subsequently used to recover polymers and remove. flame retardants within the ESR feedstock. By optimizing the dissolution time and the solvents used, the highest polymer dissolution yield (99 wt.%%) was achieved using DCM for 48 hr. Both pre-screened anti-solvents (MeOH and EG) showed the highest polymer precipitation yield (71 wt.%). In terms of flame retardant removal rate, EG was found to have a high phosphorus-containing flame retardant removal rate (up to 98%). Characterization shows that the proposed solvent-based processing can preserve a high molecular weight fraction of the polymers and effectively remove flame retardants. Cost analysis indicates that the amount of the solvent/anti-solvent recovered after the reaction would play a critical role in reducing the operating costs. The energy analysis shows that the proposed solvent-based processes can save up to 60% of the embodied energy used to manufacture plastics used in electronics (PS and ABS were used for calculations). The results from this project prove the potential of solvent-based processing to produce secondary materials (plastics and metals) from e-waste for cross-industry reuse.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Mechanically-, Thermally, and Chemically-Robust High-Temperature Ceramic Composites

In an effort to lower the levelized cost of electricity generated by Concentrated Solar Power (CSP) plants, the heat-to-electricity conversion efficiency may be increased by operating such plants with higher turbine inlet temperatures using closed Brayton cycles with high-pressure, supercritical carbon dioxide (sCO 2 ) as the working fluid. For example, if the turbine inlet temperature is raised to ≥750°C, in combination with sCO2 closed Brayton cycles, the relative heat-to-electricity efficiency may be raised by more than 20% (compared to subcritical steam Rankine cycles operating with turbine inlet temperatures ≤550°C). The associated reduction in the cost of dispatchable electricity from such CSP plants (utilizing high-temperature thermal energy storage) would be an important breakthrough on the path towards direct competition with fossil-fuel-based plants. A key barrier to achieve such high-temperature efficient operation has been the limited thermomechanical performance of metal alloys used in compact, primary printed circuit- type heat exchangers (PCHEXs) for heat transfer to high-pressure sCO 2 . The maximum allowed stresses for the use of conventional stainless steels and nickel-based superalloys at high sCO 2 pressures (≥20 MPa) decline rapidly at temperatures ≥550°C. This project has been focused on demonstrating the desired high-temperature properties and attractive manufacturing characteristics of mechanically-, thermally-, and chemically-robust ceramic/metal composites (cermets), in order to allow for the use of such composites in primary PCHEXs for heat transfer to sCO 2 at ≥750°C and ≥20 MPa in CSP plants. Prior work with high-temperature, co-continuous carbide/refractory metal cermets, such as ZrC/W composites, has already demonstrated: i) the attractive combination of high-temperature properties exhibited by such materials (e.g., high values of stiffness, failure strength, and thermal conductivity at 800°C), and ii) cost-effective processes for manufacturing PCHEX plates comprised of such cermets with tailorable channel patterns. However, ZrC/W cermets were not found to be inherently corrosion resistant in sCO 2 at 750°C and 20 MPa. While the application of a Cu coating to ZrC/W surfaces, along with a modest addition (50 ppm) of CO to CO 2 , rendered such composites resistant to corrosion for 1000 h in such sCO 2 -based fluids at 750°C, such additional steps would increase the design complexity of such cermet-based components. An alternative approach (the focus of this project) is to develop mechanically-robust, cost- effective cermets that are inherently resistant to high-temperature oxidation in air and CO 2 . The overall goals of this project have been to demonstrate: i) the oxidation resistance of at least one cermet at 750°C in air and in CO 2 (i.e., with a projected annual corrosion ≤30 μm), ii) the mechanically robust nature of at least one cermet at 750°C (i.e., with an average failure strength ≥200 MPa), and iii) that the selected cermet can be manufactured via low-cost forming techniques.

14 SOLAR ENERGY↗

A Comparative Evaluation and Selection of High-Temperature Heat Exchangers for Application to Integrated Energy Systems

The following report aims to create a refined and well-structured method for comparatively evaluating heat exchanger technologies for integrated energy systems that caters customers’ specific needs while meeting engineering requirements. For the evaluation, this study elevates previous evaluation metrics, enhances the knowledge base via literature and market surveys, and identifies the figures of merit with robust rationales to enhance the quality of decisions made throughout the proposed heat exchanger evaluation process. The heat exchanger designs evaluated as part of the case study are shell and tube heat exchangers, printed circuit heat exchangers, plate heat exchangers, spiral heat exchangers, and heat pipe heat exchangers. The information presented in this report is meant for industries interested in making a preliminary screening process to identify the most suitable heat exchanger design for their application of interest.

42 ENGINEERING↗