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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Investigation of water droplet trajectories within the NASA icing research tunnel

Water droplet trajectories within the NASA Lewis Research Center's Icing Research Tunnel (IRT) were studied through computer analysis. Of interest was the influence of the wind tunnel contraction and wind tunnel model blockage on the water droplet trajectories. The computer analysis was carried out with a program package consisting of a three-dimensional potential panel code and a three-dimensional droplet trajectory code. The wind tunnel contraction was found to influence the droplet size distribution and liquid water content distribution across the test section from that at the inlet. The wind tunnel walls were found to have negligible influence upon the impingement of water droplets upon a wing model.

Reehorst, Andrew↗
NASA NTRS1999

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗
NASA NTRS2000

Technology Validation of Optical Fiber Cables for Space Flight Environments

Periodically, commercially available (COTS) optical fiber cable assemblies are characterized for space flight usage under the NASA Electronic Parts and Packaging Program (NEPP). The purpose of this is to provide a family of optical fiber cable options to a variety of different harsh environments typical to space flight missions. The optical fiber cables under test are evaluated to bring out known failure mechanisms that are expected to occur during a typical mission. The tests used to characterize COTS cables include: (1) vacuum exposure, (2) thermal cycling, and (3) radiation exposure. Presented here are the results of the testing conducted at NASA Goddard Space Flight Center on COTS optical fiber cables over this past year. Several optical fiber cables were characterized for their thermal stability both during and after thermal cycling. The results show how much preconditioning is necessary for a variety of available cables to remain thermally stable in a space flight environment. Several optical fibers of dimensions 100/140/172 microns were characterized for their radiation effects at -125 C using the dose rate requirements of International Space Station. One optical fiber cable in particular was tested for outgassing to verify whether an acrylate coated fiber could be used in a space flight optical cable configuration.

Ott, Melanie N.↗
NASA NTRS2005

High-Flux, High Performance H2O2 Catalyst Bed for ISTAR

On NASA's ISTAR RBCC program packaging and performance requirements exceeded traditional H2O2 catalyst bed capabilities. Aerojet refined a high performance, monolithic 90% H202 catalyst bed previously developed and demonstrated. This approach to catalyst bed design and fabrication was an enabling technology to the ISTAR tri-fluid engine. The catalyst bed demonstrated 55 starts at throughputs greater than 0.60 lbm/s/sq in for a duration of over 900 seconds in a physical envelope approximately 114 of traditional designs. The catalyst bed uses photoetched plates of metal bonded into a single piece monolithic structure. The precise control of the geometry and complete mixing results in repeatable, quick starting, high performing catalyst bed. Three different beds were designed and tested, with the best performing bed used for tri-fluid engine testing.

Ponzo, J.↗
NASA NTRS2001

Simple Analytic Expressions for the Magnetic Field of a Circular Current Loop

Analytic expressions for the magnetic induction (magnetic flux density, B) of a simple planar circular current loop have been published in Cartesian and cylindrical coordinates [1,2], and are also known implicitly in spherical coordinates [3]. In this paper, we present explicit analytic expressions for B and its spatial derivatives in Cartesian, cylindrical, and spherical coordinates for a filamentary current loop. These results were obtained with extensive use of Mathematica "TM" and are exact throughout all space outside of the conductor. The field expressions reduce to the well-known limiting cases and satisfy V · B = 0 and V x B = 0 outside the conductor. These results are general and applicable to any model using filamentary circular current loops. Solenoids of arbitrary size may be easily modeled by approximating the total magnetic induction as the sum of those for the individual loops. The inclusion of the spatial derivatives expands their utility to magnetohydrodynamics where the derivatives are required. The equations can be coded into any high-level programming language. It is necessary to numerically evaluate complete elliptic integrals of the first and second kind, but this capability is now available with most programming packages.

Simpson, James C.↗
NASA NTRS2015

Single-Event Effects in Silicon Carbide Power Devices

This report summarizes the NASA Electronic Parts and Packaging Program Silicon Carbide Power Device Subtask efforts in FY15. Benefits of SiC are described and example NASA Programs and Projects desiring this technology are given. The current status of the radiation tolerance of silicon carbide power devices is given and paths forward in the effort to develop heavy-ion single-event effect hardened devices indicated.

heavy-ion single-event effects↗
NASA NTRS2017

Silicon Power MOSFETs

Recent work for the NASA Electronic Parts and Packaging Program Power MOSFET task is presented. The Task technology focus, roadmap, and partners are given. Recent single-event effect test results on commercial, automotive, and radiation hardened trench power MOSFETs are summarized with an emphasis on risk of using commercial and automotive trench-gate power MOSFETs in space applications.

trench-gate MOSFET↗
NASA NTRS2017

Proton Irradiation of the 16GB Intel Optane SSD

The purpose of this test is to assess the single event effects (SEE) and radiation susceptibility of the Intel Optane Memory device (SSD) containing the 3D Xpoint phase change memory (PCM) technology. This test is supported by the NASA Electronics Parts and Packaging Program (NEPP).

Single-Event Effects (SEE)↗
NASA NTRS2009

Optical Fiber Assemblies for Space Flight from the NASA Goddard Space Flight Center, Photonics Group

The Photonics Group at NASA Goddard Space Flight Center in the Electrical Engineering Division of the Advanced Engineering and Technologies Directorate has been involved in the design, development, characterization, qualification, manufacturing, integration and anomaly analysis of optical fiber subsystems for over a decade. The group supports a variety of instrumentation across NASA and outside entities that build flight systems. Among the projects currently supported are: The Lunar Reconnaissance Orbiter, the Mars Science Laboratory, the James Webb Space Telescope, the Express Logistics Carrier for the International Space Station and the NASA Electronic Parts. and Packaging Program. A collection of the most pertinent information gathered during project support over the past year in regards to space flight performance of optical fiber components is presented here. The objective is to provide guidance for future space flight designs of instrumentation and communication systems.

Ott, Melanie N.↗
NASA NTRS2018

Guideline for Single-Event Effect (SEE) Testing of System on a Chip (SOC) Devices

The use of complex single and multicore processors with significant cache memory, on-chip peripherals, memory controllers, and high speed input/output (IO) that integrate many of the parts of a traditional computer system is becoming more common in space applications. Such devices are often referred to as system on a chip devices (SOCs), even though the term is used somewhat inaccurately due to the lack of analog and mixed signal subcircuits. These devices are complex combinations of single- or multi-core processors with memory controllers, high-speed input/output (IO), and other peripheral structures that formerly would have been handled by off-chip resources. In the past the processors were tested for single event effects (SEE) separately, and the peripherals were often put into custom application-specific integrated circuits (ASICs) along with other resources required by the user. Performance and cost pressures have pushed commercial devices to incorporate many of the functional blocks into a single chip, an SOC. The NASA Electronic Parts and Packaging Program (NEPP) has been examining ways to perform SEE radiation hardness assurance (RHA) testing of these processor-centric SOCs to achieve reasonable understanding of their performance in space missions.

Guertin, Steven M.↗
NASA NTRS2009

Virtex-4VQ dynamic and mitigated single event upset characterization summary

This report is the result of funding by the NASA Electronic Parts and Packaging Program (NEPP) and the combined efforts of members within the Xilinx Radiation Test Consortium (XRTC), sometimes known as the Xilinx Single Event Effects (SEE) Test Consortium. The XRTC is a voluntary association of aerospace entities, including leading aerospace companies, universitie and national laboratories, combining resources to characterize reconfigurable, field programmable gate arrays (FPGAs) for aerospace applications. Previous publications of Virtex-4 radiation results are for commercial (non-epitaxial) devices; see, for example, Refs. 1–5. A notable exception is Ref. 6, which presents XRTC upset measurements of storage elements in the PowerPC405s in the XQR4VFX60. This work represents a continuation of the efforts reported in the “Virtex-4QV Static SEU Characterization Summary” [7]. The contents of this report describe various Single Event Functional Interrupt (SEFI) and Single Event Upset (SEU) modes seen while dynamically exercising the clocked resources within Virtex-4 devices and the corresponding mitigation techniques related to the aforementioned observed SEFI modes.

Allen, Gregory↗
NASA NTRS2020

Cloud-top pressure retrieval with DSCOVR EPIC oxygen A- and B-band observations

An analytic transfer inverse model for Earth Polychromatic Imaging Camera (EPIC) observations is proposed to retrieve the cloud-top pressure (CTP) with the consideration of in-cloud photon penetration. In this model, an analytic equation was developed to represent the reflection at the top of the atmosphere from above cloud, in cloud, and below cloud. The coefficients of this analytic equation can be derived from a series of EPIC simulations under different atmospheric conditions using a nonlinear regression algorithm. With estimated cloud pressure thickness, the CTP can be retrieved from EPIC observation data by solving the analytic equation. To simulate the EPIC measurements, a program package using the double-k approach was developed. Compared to line-by-line calculation, this approach can calculate high-accuracy results with a 100-fold computation time reduction. During the retrieval processes, two kinds of retrieval results, i.e., baseline CTP and retrieved CTP, are provided. The baseline CTP is derived without considering in-cloud photon penetration, and the retrieved CTP is derived by solving the analytic equation, taking into consideration in-cloud and below-cloud interactions. The retrieved CTPs for the oxygen A and B bands are smaller than their related baseline CTP. At the same time, both baseline CTP and retrieved CTP at the oxygen B band are larger than those at the oxygen A band. Compared to the difference in baseline CTP between the B band and A band, the difference in retrieved CTP between these two bands is generally reduced. Out of around 10 000 cases, in retrieved CTP between the A and B bands we found an average bias of 93 mb with a standard deviation of 81 mb. The cloud layer top pressure from Cloud–Aerosol Lidar and Infrared Pathfinder Satellite Observations (CALIPSO) measurements is used for validation. Under single-layer cloud situations, the retrieved CTPs for the oxygen A band agree well with the CTPs from CALIPSO, the mean difference of which within 5 mb in the case study. Under multiple-layer cloud situations, the CTPs derived from EPIC measurements may be larger than the CTPs of high-level thin clouds due to the effect of photon penetration.

DSCOVR↗
NASA NTRSDate not supplied

Graphical User Interface (GUI) Implementation for Agent-Based Microbial Radiobiology Model

Sending human life past the Low Earth Orbit (LEO) to explore the Moon and Mars will be challenging. The Earth’s magnetic field naturally protects life from deep-space particle radiation such as Galactic Cosmic Rays (GCR) and Solar Particle Events (SPE); these will pose health risks to humans in deep space. Research has been done to investigate these effects, like BioSentinel, the first biological CubeSat to fly beyond the LEO, designed to culture yeast in a microfluidic device and record optical measurements of growth and metabolism. However, experiments can only report cell damage as bulk growth curves, while deep-space radiation causes damage that is heterogeneous among individual cells. AMMPER is an open-source, agent-based, computational model coded in Python to simulate the effects of deep-space radiation on individual yeast cells (Saccharomyces cerevisiae) to facilitate interpretation of biological radiation experiments. Version 1.0 of the code ran in a command line interface (CLI), limiting use to those familiar with modularization, object-oriented programming, and computational models. Here we present a graphical user interface (GUI) for AMMPER to increase its accessibility. GUI development included converting input points and UI files, designing an application and logo, and expanding program packages. Additionally, we added optical assistance that corresponded with simulation parameters, which included simulation type, cell type, ROS model, and radiation dosage, as well as customizable display and file exportation features. Following a pilot testing period, its structure was updated further to enhance abilities, adding increased runs, video visualization, data plotting, and an educational/tutorial component. Future work will include creating a bit installer and runtime environment for AMMPER. Ultimately, the creation of the GUI has two main goals: to facilitate the integration of computational models into the work of researchers in microbial radiobiology, and to act as an interactive and visual resource for space biology education.

yeast↗
NASA NTRS2015

The Affordance Template ROS Package for Robot Task Programming

This paper introduces the Affordance Template ROS package for quickly programming, adjusting, and executing robot applications in the ROS RViz environment. This package extends the capabilities of RViz interactive markers by allowing an operator to specify multiple end-effector waypoint locations and grasp poses in object-centric coordinate frames and to adjust these waypoints in order to meet the run-time demands of the task (specifically, object scale and location). The Affordance Template package stores task specifications in a robot-agnostic XML description format such that it is trivial to apply a template to a new robot. As such, the Affordance Template package provides a robot-generic ROS tool appropriate for building semi-autonomous, manipulation-based applications. Affordance Templates were developed by the NASA-JSC DARPA Robotics Challenge (DRC) team and have since successfully been deployed on multiple platforms including the NASA Valkyrie and Robonaut 2 humanoids, the University of Texas Dreamer robot and the Willow Garage PR2. In this paper, the specification and implementation of the affordance template package is introduced and demonstrated through examples for wheel (valve) turning, pick-and-place, and drill grasping, evincing its utility and flexibility for a wide variety of robot applications.

Hart, Stephen↗
NASA NTRS1982

Turbofan noise generation. Volume 2: Computer programs

The use of a package of computer programs developed to calculate the in duct acoustic mods excited by a fan/stator stage operating at subsonic tip speed is described. The following three noise source mechanisms are included: (1) sound generated by the rotor blades interacting with turbulence ingested into, or generated within, the inlet duct; (2) sound generated by the stator vanes interacting with the turbulent wakes of the rotor blades; and (3) sound generated by the stator vanes interacting with the velocity deficits in the mean wakes of the rotor blades. The computations for three different noise mechanisms are coded as three separate computer program packages. The computer codes are described by means of block diagrams, tables of data and variables, and example program executions; FORTRAN listings are included.

Ventres, C. S.↗