Performance of soldered and cemented cover glass silicon solar cells
Performance of soldered and cemented cover glass silicon solar cells
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Performance of soldered and cemented cover glass silicon solar cells
Hydrazine monoperfluoro alkanoate solder flux leaving corrosion resistant coating, for metals such as copper
Solder coating process for printed copper circuit protection
Investigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate
Thermocouple implanted in metal mass simulates heat transfer characteristics of connection which is to be soldered. Light signals indicate whether temperature is right, too high, or too low.
Ohmmeter is used to indicate positive contact between electrodes and workpiece. This permits good soldering and prevents damage to electronic devices.
Fully-automatic tube-joint soldering machine can be used to make leakproof joints in aluminum tubes of 3/16 to 2 in. in diameter. Machine consists of temperature-control unit, heater transformer and heater head, vibrator, and associated circuitry controls, and indicators.
Nickel-plated device, with machined recesses matching the multipin pattern of particular circuit module, facilitates repairs to electronic systems and reduces chance of damage to adjacent components. Nickel-plating reduces oxidation and scaling. Recesses retain sufficient amount of molten solder to uniformly wet pins for simultaneous heating and extraction.
Nickel wire segment allows Nichrome wire to be soldered without changing its electrical characteristics.
Using vacuum-soldering method, attachments that are 85 to 95 percent void free can be made. Method is useful for various large scale substrate attachment processes in microelectronic industry.
Multiple-board rack allows technician to insert components into several boards, flip them all in single motion, and then systematically solder leads on reverse side. Two adjustable crossbars allow boards of any size up to 10 by 24 inches. Operator can rotate racks and adjust angle of boards from standing or sitting position.
Soldering techniques for high-reliability electronic equipment are taught in 5 day course at NASA's Jet Propulsion Laboratory. Topic covered include new circuit assembly, printed-wiring board reworking, circuit changes, wire routing, and component installation.
Tabs suitable for electrical or mechanical connections in solar cells and integrated circuits are made by spraying technique. Solder wets copper, copper bonds to aluminum, and aluminum adheres to glass. Arc spraying is automated and integrated with encapsulation, eliminating hand tabbing, improving reliability, and reducing cost.
Special lead-forming tool puts step in leads of microwave power transistors without damaging braze joints that fasten leads to package. Stepped leads are soldered to circuit boards more reliably than straight leads, and stress on brazes is relieved. Lead-forming hand-tool has two parts: a forming die and an actuator. Spring-loaded saddle is adjusted so that when transistor package is placed on it, leads rest on forming rails.
Encapsulated in robot end effector is RF induction-heating coil for heating solar cell while in transit. Holes in encapsulant permit end of unit to act as vacuum pickup to grip solar cell. Use of RF induction heating allows cell to be heated without requiring direct mechanical and thermal contact of bonding tool such as soldering iron.
Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.
Mechanism consisting of stylus and hand-operated lever incorporated into screening machine to precisely register front and back solder pads during solar-cell assembly. Technique may interest those assembling solar cells manually for research or prototype work.
Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.