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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS2002

SIP qualification and PRA approaches

System in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package level and even more at the second and system levels.

probability risk assessment weibull lognormal ball↗
NASA NTRS2001

Effect of thermal cycling ramp rate on CSP assembly reliability

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

accelerated thermal cycle chip scale package solde↗
NASA NTRS2000

Thermal cycling test results of CSP and RF assemblies

A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chip scale package CSP thermal cycle solder joint ↗
NASA NTRS2000

Accelerated thermal and mechanical testing of CSP assemblies

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.

Chip Scale Package CSP thermal cycle fatigue solde↗
NASA NTRS1999

Accelerated Thermal Cycling and Failure Mechanisms

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

BGA CSP CBGA thermal cycle solder joint reliabilit↗
NASA NTRS1999

CSP Assembly Reliability

Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.

chip scale package CSP solder joint reliability th↗