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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Electronics packaging↗
NASA NTRS2003

Advanced Sensor Systems for Biotelemetry

The present invention relates to telemetry-based sensing systems that continuously measures physical, chemical and biological parameters. More specifically, these sensing systems comprise a small, modular, low-power implantable biotelemetry system capable of continuously sensing physiological characteristics using implantable transmitters, a receiver, and a data acquisition system to analyze and record the transmitted signal over several months. The preferred embodiment is a preterm labor and fetal monitoring system. Key features of the invention include Pulse Interval Modulation (PIM) that is used to send temperature and pressure information out of the biological environment. The RF carrier frequency is 174-216 MHz and a pair of RF bursts (pulses) is transmitted at a frequency of about 1-2 Hz. The transmission range is 3 to 10 feet, depending on the position of the transmitter in the body and its biological environment. The entire transmitter is encapsulated in biocompatible silicone rubber. Power is supplied by on-board silver-oxide batteries. The average power consumption of the current design is less than 30 microW, which yields a lifetime of approximately 6 - 9 months. Chip-on-Board technology (COB) drastically reduces the size of the printed circuit board from 38 x 28 mm to 22 x 8 mm. Unpackaged dies are flip-chip bonded directly onto the printed circuit board, along with surface mount resistors and capacitors. The invention can monitor additional physiological parameters including, but not limited to, ECG, blood gases, glucose, and ions such as calcium, potassium, and sodium.

Hines, John W.↗
NASA NTRS1999

Development Unit Configuration and Current Status of the MIP/MTERC Experiment

The Mars In-Situ Propellant Production (ISPP) Precursor (MIP) experiment package is planned for inclusion on the Mars 2001 Lander. This experiment package consists of five experiments whose purpose is to demonstrate the performance of various ISPP processes in-situ on Mars. The demonstrated ability to produce propellant for Mars Return Vehicles (MRV) is considered to be a necessary precursor to any future manned mission to Mars. The Mars Thermal Environment/Radiator Characterization (MTERC) experiment is part of the MIP package and is intended to determine the Mars night sky temperature as well as to characterize the performance degradation of radiators caused by environmental exposure on Mars over time. Radiators are needed as part of the ISPP process to remove heat from the Mars Atmosphere Acquisition and Compression (MAAC) CO2 sorption compressor. MTERC will provide the data needed to optimize the design of radiators for ISPP and other processes. A MTERC Development Unit (DU) has been fabricated and tested at JPL. The MTERC DU consists of 1) a radiator subassembly, 2) a motor/cover subassembly, 3) a differential temperature control circuit and motor control electronics circuit board, and 4) a command and data handling electronics circuit board. This paper will describe the operational theory and the configuration of the MTERC DU and will discuss the current status of the MTERC experiment development including some selected results of performance testing that has been completed prior to the ISRU III meeting.

Juanero, K. J.↗
NASA NTRS1999

Development Unit Configuration and Current Status of the MIP/MTERC Experiment

The Mars In-Situ Propellant Production (ISPP) Precursor (MIP) experiment package is planned for inclusion on the Mars 2001 Lander. This experiment package consists of five experiments whose purpose is to demonstrate the performance of various ISPP processes in-situ on Mars. The demonstrated ability to produce propellant for Mars Return Vehicles (MRV) is considered to be a necessary precursor to any future manned mission to Mars. The Mars Thermal Environment/Radiator Characterization (MTERC) experiment is part of the MIP package and is intended to determine the Mars night sky temperature as well as to characterize the performance degradation of radiators caused by environmental exposure on Mars over time. Radiators are needed as part of the ISPP process to remove heat from the Mars Atmosphere Acquisition and Compression (MAAC) C02 sorption compressor. MTERC will provide the data needed to optimize the design of radiators for ISPP and other processes. A MTERC Development Unit (DU) has been fabricated and tested at JPL. The MTERC DU consists of: (1) a radiator subassembly, (2) a motor/cover subassembly, (3) a differential temperature control circuit and motor control electronics circuit board, and (4) a command and data handling electronics circuit board. This paper will describe the operational theory and the configuration of the MTERC DU and will discuss the current status of the MTERC experiment development including some selected results of performance testing that has been completed prior to the ISRU III meeting.

Juanero, K. J.↗
NASA NTRS2008

Failure Analysis of Electrical Pin Connectors

A study was initiated to determine the root cause of failure for circuit board electrical connection pins that failed during vibRatory testing. The circuit board is part of an unmanned space probe, and the vibratory testing was performed to ensure component survival of launch loading conditions. The results of this study show that the pins failed as a result of fatigue loading.

Newman, John A.↗
NASA NTRS1970

Integrated circuit flat-pack lead bender

Tool bends leads quickly and accurately for mounting on printed circuit boards. It has grooves and bend-angles aligned for particular circuit board applications.

Koster, C. H.↗
NASA NTRS1986

Ultrasonic Bonding to Metalized Plastic

New technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.

Conroy, B. L.↗
NASA NTRS1991

Industrial Applications of Graphite Fluoride Fibers

Based on fluorination technology developed during 1934 to 1959, and the fiber technology developed during the 1970s, a new process was developed to produce graphite fluoride fibers. In the process, pitch based graphitized carbon fibers are at first intercalated and deintercalated several times by bromine and iodine, followed by several cycles of nitrogen heating and fluorination at 350 to 370 C. Electrical, mechanical, and thermal properties of this fiber depend on the fluorination process and the fluorine content of the graphite fluoride product. However, these properties are between those of graphite and those of PTFE (Teflon). Therefore, it is considered to be a semiplastic. The physical properties suggest that this new material may have many new and unexplored applications. For example, it can be a thermally conductive electrical insulator. Its coefficient of thermal expansion (CTE) can be adjusted to match that of silicon, and therefore, it can be a heat sinking printed circuit board which is CTE compatible with silicon. Using these fibers in printed circuit boards may provide improved electrical performance and reliability of the electronics on the board over existing designs. Also, since it releases fluorine at 300 C or higher, it can be used as a material to store fluorine and to conduct fluorination. This application may simplify the fluorination process and reduce the risk of handling fluorine.

Hung, Ching-Cheh↗
NASA NTRS2011

Development of the ISS EMU SPEEDR

The Self Powered EVA EMU Data Recorder (SPEEDR) is an FPGA (Field-programmable gate array) based device designed to collect high-rate EMU (Extravehicular Mobility Unit) PLSS (Primary Life Support Subsystem) data for download at a later time. The existing EMU PLSS data down-link capability during EVA is one data packet every 2 minutes and is subject to bad packets or loss of signal. High-rate PLSS data is generated by the ECWS (Enhanced Caution and Warning System) but is not normally captured or distributed. Access to high-rate data will increase the capability of EMU anomaly resolution team to pinpoint issues remotely, saving crew time by reducing required call-down Q&A and on-orbit diagnostic activities. With no Shuttle flights post FY11, and potentially limited down-mass capability, the ISS crew and ground support personnel will have to be capable of on-orbit operations to maintain, diagnose, repair, and return to service EMU hardware, possibly through 2028. Collecting high-rate EMU PLSS data during both IVA (Intravehicular Activity) and EVA (Extravehicular Activity) operations will provide trending analysis for life extension and/or predictive performance. The SPEEDR concept has generated interest as a tool/technology that could be used for other ISS subsystems or future exploration-class space suits where hardware reliability/availability is critical and low/variable bandwidth may require "store then forward" methodology. Preliminary work in FY11 produced a functional prototype consisting of an FPGA evaluation board, custom memory/interface circuit board, and custom software. The SPEEDR concept includes a stand-alone battery that is recharged by a computer USB (Universal Serial Bus) port while data is being downloaded.

Bernard. Craig↗
NASA NTRS2012

Development of the Self-Powered Extravehicular Mobility Unit Extravehicular Activity Data Recorder

The Self-Powered Extravehicular Mobility Unit (EMU) Extravehicular Activity (EVA) Data Recorder (SPEEDR) is a field-programmable gate array (FPGA)-based device designed to collect high-rate EMU Primary Life Support Subsystem (PLSS) data for download at a later time. During EVA, the existing EMU PLSS data downlink capability is one data packet every 2 minutes and is subject to bad packets or loss of signal. Higher-rate PLSS data is generated by the Enhanced Caution and Warning System but is not normally captured or distributed. Access to higher-rate data will increase the capability of EMU anomaly resolution team to pinpoint issues remotely, saving crew time by reducing required call-down Q&A and on-orbit diagnostic activities. With no Space Shuttle flights post Fiscal Year 2011 (FY11), and potentially limited down-mass capability, the ISS crew and ground support personnel will have to be capable of on-orbit operations to maintain, diagnose, repair, and return to service EMU hardware, possibly through 2028. Collecting high-rate EMU PLSS data during both intravehicular activity (IVA) and EVA operations will provide trending analysis for life extension and/or predictive performance. The SPEEDR concept has generated interest as a tool/technology that could be used for other International Space Station subsystems or future exploration-class space suits where hardware reliability/availability is critical and low/variable bandwidth may require store then forward methodology. Preliminary work in FY11 produced a functional prototype consisting of an FPGA evaluation board, custom memory/interface circuit board, and custom software. The SPEEDR concept includes a stand-alone battery that is recharged by a computer Universal Serial Bus (USB) port while data are being downloaded.

Bernard, Craig↗
NASA NTRS1987

Ensuring Fully Soldered Through Holes

Simple differential-pressure soldering method provides visual evidence that hidden joints are fully soldered. Intended for soldering connector pins in plated through holes in circuit boards. Molten solder flows into plated through holes, drawn by vacuum in manifold over circuit board. Differential-pressure process ensures solder wets entire through hole around connector pin.

Blow, Raymond K.↗
NASA NTRS2016

Command and Data Handling Branch Internship

Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.

Billings, Rachel Mae↗
NASA NTRS1987

Multipurpose microcontroller design for PUGAS 2

This paper will report on the past year's work on the development of the microcontroller design for the second Purdue University small self-contained payload. A first report on this effort was given at last year's conference by Ritter (1985). At that time, the project was still at the conceptual stage. Now a specific design has been set, prototyping has begun, and layout of the two-sided circuit board using CAD-techniques is nearing completion. A redesign of the overall concept of the circuit board was done to take advantage of the facilities available to students. An additional controller has been added to take large quantities of data concerning the shuttle environment during takeoff. The importance of setting a design time-line is discussed along with the electrical design considerations given to the controllers.

Weber, David M.↗
NASA NTRS2013

Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces

High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction. An impedance discontinuity arises at the interface of a high-speed quadrax and twinax connectors and the attached printed circuit board (PCB). This discontinuity usually is lower impedance since the relative dielectric constant of the board is higher (i.e., polyimide approx. = 4) than the connector (Teflon approx. = 2.25). The discontinuity can be observed in transmit or receive eye diagrams, and can reduce the effective link margin of serial data networks. High-speed serial data network transmission improvements can be made at the connector-to-board interfaces as well as improving differential via hole impedances. The impedance discontinuity was improved by 10 percent by drilling a 20-mil (approx. = 0.5-mm) hole in between the pin of a differential connector spaced 55 mils (approx. = 1.4 mm) apart as it is attached to the PCB. The effective dielectric constant of the board can be lowered by drilling holes into the board material between the differential lines in a quadrax or twinax connector attachment points. The differential impedance is inversely proportional to the square root of the relative dielectric constant. This increases the differential impedance and thus reduces the above described impedance discontinuity. The differential via hole impedance can also be increased in the same manner. This technique can be extended to multiple smaller drilled holes as well as tapered holes (i.e., big in the middle followed by smaller ones diagonally).

Navidi, Sal↗
NASA NTRS1969

Investigation of the development of cracks in solder joints

Study consisted of an analytical approach, in which a mathematical model of existing printed circuit board component mounting techniques was analyzed, and an empirical investigation was performed to determine the extent of damage caused by temperature cycling of the printed circuit boards.

Moore, R. L.↗
NASA NTRS2006

Experimental Investigation of Solder Joint Defect Formation and Mitigation in Reduced-Gravity Environments

This paper documents a research effort on reduced gravity soldering of plated through hole joints which was conducted jointly by the National Center for Space Exploration Research, NASA Glenn Research Center, and NASA Johnson Space Center. Significant increases in joint porosity and changes in external geometry were observed in joints produced in reduced gravity as compared to normal gravity. Multiple techniques for mitigating the observed increase in porosity were tried, including several combinations of flux and solder application techniques, and demoisturizing the circuit board prior to soldering. Results were consistent with the hypothesis that the source of the porosity is a combination of both trapped moisture in the circuit board itself, as well as vaporized flux that is trapped in the molten solder. Other topics investigated include correlation of visual inspection results with joint porosity, pore size measurements, limited pressure effects (0.08 MPa - 0.1 MPa) on the size and number of pores, and joint cooling rate.

Watson, J. Kevin↗
NASA NTRS2022

Finite Element Modeling of Rigid-Flex PCB Robotic Structures for Dynamic Environments

Rigid-flex circuit boards are becoming moreprevalent as the limits are pushed on the size, mass, and geometryof electronic systems. A key aspect of designing a rigid-flexprinted circuit boards (PCB) system is an assessment of thedynamic properties of the PCB and predicting system perfor-mance under dynamic loading. Among current modeling method-ologies for rigid-flex PCB, a simplified modeling methodology thatadequately captures the system dynamics does not exist. This arti-cle presents a novel, computationally efficient approach formodeling rigid-flex PCB systems and the calibration of the mate-rial models via modal testing. The resulting simplified model isable to capture system frequencies, mode shapes, and representa-tive force-displacement behavior. The proposed methodology isused to model NASA Jet Propulsion Laboratory’s Pop-Up FlatFolding Explorer Robot (PUFFER) and assess the sensitivity of asystem model to input parameters.

John Bell↗