Technology Developments for FIR Bolometric Detector Focal Plane Assemblies
A discussion of recent technology developments for far-infrared bolometric detector focal plane assemblies is provided. Some of the developments include strategies for fabricating high filling fraction background limited-transition edge sensor bolometric detectors, impedance-matched absorber coatings, a micromachined blackbody source, and the capability to fabricate indium bumps on non-planar substrates.