Resistance multiplication in integrated circuits by means of switching.
Resistance multiplication in RC integrated circuit design by switching
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Resistance multiplication in RC integrated circuit design by switching
Refractory dielectric for integrated circuits
Refractory material dielectrics for integrated circuits
Holographic microscopy technique fundamentals and electrically activated integrated circuit changes inspection
Book on integrated circuits and semiconductor devices covering MOSFET, optoelectronic devices, silicon controlled rectifiers and thyristors
Report documents life cycles of two custom CMOS integrated circuits: (1) 4-bit multiplexed register with shift left and shift right capabilities, and (2) dual 4-bit registers. Cycles described include conception as logic diagrams through design, fabrication, testing, and delivery.
Three digital simulation techniques for MOS integrated circuit faults were examined. These techniques embody a hierarchy of complexity bracketing the range of simulation levels. The digital approaches are: transistor-level, connector-switch-attenuator level, and gate level. The advantages and disadvantages are discussed. Failure characteristics are also described.
The aperture efficiency of silicon integrated-circuit horn antennas has been improved by optimizing the length of the dipole probes and by coating the entire horn walls with gold. To make these measurements, a new thin-film power-density meter was developed for measuring power density with accuracies better than 5 percent. The measured aperture efficiency improved from 44 percent to 72 percent at 93 GHz. This is sufficient for use in many applications which now use machined waveguide horns.
We have reported SiC integrated circuits (IC's) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 C [1, 2]. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 C [3]. However, this thermal ramp was not ended until a peak temperature of 880 C (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology. Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 C. In one test, the temperature was ramped and then held at 727 C, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 C before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 C (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 C.
This presentation illustratively communicates integrated circuit (IC) mask design and layout rules for NASA GRC's upcoming prototype fabrication of SiC JFET IC Version 12.
The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid- state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.
The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid-state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.
The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid-state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.
Applicability of magnetic or integrated circuits to micrometeoroid sensor scanning
Test program to determine reliability of integrated circuit amplifiers for Saturn program
Adaptation of models for minority carrier devices, and applicability in computer design evaluation studies of integrated circuits
Technique for packaging electronic modules interconnects integrated circuits and discrete components by means of beryllium-copper strips in a molded diallyphthalate tray. Simple girder-like construction provides ease of assembly, high rigidity, excellent vibration resistance, and good heat dissipation characteristics.
Fluidic integrated circuits for control of pneumatic stepping-motor actuator system