Search NASA⌕ Search

SEARCH · Search NASA

Results for “power electronic packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

NASA Electronic Parts and Packaging (NEPP) Program - Resources for SmallSats on EEE Parts

From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.

Parts assurance↗
NASA NTRS2018

NASA Electronic Parts and Packaging (NEPP) Program: Resources for SmallSats on EEE Parts

From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.

Electrical↗
NASA NTRS1975

Hybrid measurement chains for the SAS-C spacecraft

Spacecraft electronic systems usually demand tight packaging. It was this consideration which initially forced us to consider hybrid circuits for the analog signal processing circuits in the Small Astronomy Satellite-C (SAS-C) scientific payload. We gradually discovered that increased reliability, low power consumption, and reduced program costs all followed. This paper will attempt to share our laboratory's first experience with hybrid circuits and indicate those areas which we found to be important.

Goeke, R. F.↗
NASA NTRS1994

Portable Cooler/Warmers

Early in the space program, NASA recognized the need to replace bulky coils, compressers, and motors for refrigeration purposes by looking at existing thermoelectric technology. This effort resulted in the development of miniaturized thermoelectric components and packaging to accommodate tight confines of spacecraft. Koolatron's portable electronic refrigerators incorporate this NASA technology. Each of the cooler/warmers employs one or two miniaturized thermoelectric modules. Although each module is only the size of a book of matches, it delivers the cooling power of a 10-pound block of ice. In some models, the cooler can be converted to a warmer. There are no moving parts. The Koolatrons can be plugged into auto cigarette lighters, recreational vehicles, boats or motel outlets.

Source record↗
NASA NTRS2002

High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

Neudeck, Philip G.↗
NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗
NASA NTRSDate not supplied

Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits

A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.

DC Powered Oven↗
NASA NTRS2004

The Wind and Temperature Spectrometer (WTS) in the Atmospheric Neutral Density Experiment (ANDE) Satellite

Miniaturization efforts in new spectrometers for ionosphere/thermosphere investigations of the ion-drifts and neutral winds and corresponding temperatures make possible very light (about 250 g) packages consuming less than 0.4 W. Previously described, our approach measures the angular and energy distributions of neutral atoms and molecules (or ions) in two perpendicular planes; using those distributions to determine the full wind vector, the temperature and the relative densities of O and N2, as required for the ANDE mission. The measurements require two separate electron impact ion sources each with its own electron beam cathode. We have developed a low-temperature thermionic emission cathode that delivers 1 mA electron current at 80 mW power, making it possible to operate neutral wind-temperature experiments for the first time with powers less than 0.5 W. Advances in the ion optics of the energy-angle spectrometer enhance the energy resolution-aperture product more than a factor of 3 to enable energy resolutions of a few percent with large apertures. With these technology improvements it is now possible to obtain the full neutral wind vector, temperature and O/N2, density ratio once per second in a 250g/0.4W package with sensitivity up to about 500 km altitude in the thermosphere. We will describe the WTS as deployed in ANDE and show simulated data with the non-linear least squares analysis to illustrate expected performance of the WTS in the estimated errors in the three components of the wind, the temperature, and the relative densities.

Herrero, F. A.↗
NASA NTRS1991

Long Duration Exposure Facility (LDEF) low-temperature Heat Pipe Experiment Package (HEPP) power system results

An overview of a self contained Direct Energy Transfer (DET) Power System which was developed to provide power to the Long Duration Exposure Facility (LDEF) Heat Pipe Experiment Package (HEPP) Experiment. A brief synopsis of the flight characteristics of the power system are presented to illustrate the system's capability to function successfully in a low Earth orbit (LEO) space environment. The successful space flight operations of the battery, solar arrays, and power system electronics during the flight period of almost six years (approximately 32,000 LEO cycles) are discussed.

Tiller, Smith E.↗
NASA NTRS2019

Flexible Modem Interface (FMI) in Space - Extending Standardized Commercial Satellite Communications Services to Space Users

Recent innovations are producing a multitude of advanced commercial satellite communications (COMSATCOM) systems that could deliver massive amounts of SATCOM capacity at a fraction of current cost while also offering reliability and availability that is critical to achieving mission success for orbiting assets. Recognizing the alignment of commercial capabilities with the National Aeronautics and Space Administration's (NASA) diverse mission requirements, the agency is proactively engaging industry to formulate strategies leading towards a NASA communications architecture that includes advanced commercial capabilities. To fully leverage the expanded space resources, NASA must also address the integration of commercial waveforms into its space terminals. In pursuit of similar goals, the United States Department of Defense (DoD) is leading the standardization of the flexible modem interface (FMI) to address service integration for their tactical terminals in pursuit of a DoD Wideband SATCOM Enterprise.This paper describes how NASA is adapting this FMI standard to work with the Space Telecommunications Radio System (STRS) software-defined radio (SDR) framework to address the challenging size, weight, and power resource requirements for terminals in space. A full adaptation would include waveform compatibility with modular baseband processing, frequency compatibility with a wideband front end, and radiated beam control with an electronically steerable antenna to enable multi-provider commercial service capability in a feasible package for space terminals. Security is also a key aspect to be addressed for this integration since data will flow through commercial networks, commercial service providers have their own security mechanisms, and space terminals must be able to securely load proprietary software and firmware needed to access the commercial networks on demand. Success of this effort means commercial partners will be able to allow network-compliant implementations to be hosted on STRS-compliant SDRs in space for reliable and capable network access.

COMSATCOM↗
NASA NTRS1981

Proceedings of the Conference on High-temperature Electronics

The development of electronic devices for use in high temperature environments is addressed. The instrumentational needs of planetary exploration, fossil and nuclear power reactors, turbine engine monitoring, and well logging are defined. Emphasis is place on the fabrication and performance of materials and semiconductor devices, circuits and systems and packaging.

Source record↗
NASA NTRS1984

Thermoelectric Integrated Membrane Evaporation Subsystem operational improvements

A three-man preprototype Thermoelectric Integrated Membrane Evaporation Subsystem (TIMES) has been developed to provide high quality water recovery from waste fluids on extended duration space flights. In the most recent effort, a number of improvements have been made to simplify subsystem operation and increase performance. These modifications include changes to the hollow fiber membrane evaporator, the condensing section of the thermoelectric heat pump, and the electronic controller logic and display. This paper describes the results of the test program that was conducted to evaluate the implemented improvements. In addition, an advanced design concept is discussed that will provide lower electrical power consumption, greater water production capacity, lower weight, and a smaller package than the present subsystem configuration.

Dehner, G. F.↗
NASA NTRS2002

Bolometric detectors for the high frequency instrument on the Planck surveyor

The High Frequency Instrument (HFI) on Planck will obtain all-sky images of the Cosmic Microwave Background (CMB) and other astrophysical sources of emission with resolution of 9 arcniin at 100 GHz, 7 arcmin at 143 GHz and 5 arcniin at 217, 353, 545 and 857 GHz. The HFI focal plane will contain 48 silicon nitride micromesh bolometric detectors operating from a 100 mK heat sink. Four detectors in each of the 6 bands will detect the sum of the power in both linear polarizations. An additional 4 pair of detectors will provide sensitivity to linear polarization of emission at 143, 217 and 353 GHz. We report on the development of these detectors, which are being produced at the JPL Micro Devices Laboratory, packaged at JPL Electronics Packaging, characterized at 100 mK before delivery to our HFI consortium partners at the UWCC, UK.

Planck CMB bolometer↗
NASA NTRS2006

Waveguide Power-Amplifier Module for 80 to 150 GHz

A waveguide power-amplifier module capable of operating over the frequency range from 80 to 150 GHz has been constructed. The module comprises a previously reported power amplifier packaged in a waveguide housing that is compatible with WR-8 waveguides. (WR- 8 is a standard waveguide size for the nominal frequency range from 90 to 140 GHz.) The waveguide power-amplifier module is robust and can be bolted to test equipment and to other electronic circuits with which the amplifier must be connected for normal operation.

Samoska, Lorene↗
NASA NTRS1982

A lightweight electronically commutated dc motor for electric passenger vehicles

A functional model breadboard converter and a rare-earth-cobalt, permanent magnet motor; as well as an engineering model converter and PM motor suitable for vehicle installations were developed and tested. The converter and motor achieved an 88% peak efficiency, a maximum output of 26 kW at 26,000 rpm, and a continuous rating of 15 kW. The system also generated power to the source during braking, with a demonstrated peak power available at the converter terminals of approximately 26 kW at 88% efficiency. Major conclusions include: (1) the SAE J227a(D) driving cycle efficiency for the converter/motor is 86% to 88% when energy available for recovery at the converter terminals is included; (2) the converter initial cost is approximately five times that of the permanent magnet motor, but can be reduced by means of LSI logic and integrated liquid cooled semiconductor packages; and (3) an electronically commutated motor with a liquid cooled converter will operate reliably without service or maintenance for the life of a passenger vehicle.

Echolds, E. F.↗
NASA NTRS1974

Standardized strapdown inertial component modularity study, volume 2

To obtain cost effective strapdown navigation, guidance and stabilization systems to meet anticipated future needs a standardized modularized strapdown system concept is proposed. Three performance classes, high, medium and low, are suggested to meet the range of applications. Candidate inertial instruments are selected and analyzed for interface compatibility. Electronic packaging and processing, materials and thermal considerations applying to the three classes are discussed and recommendations advanced. Opportunities for automatic fault detection and redundancy are presented. The smallest gyro and accelerometer modules are projected as requiring a volume of 26 cubic inches and 23.6 cubic inches, respectively. Corresponding power dissipation is projected as 5 watts, and 2.6 watts respectively.

Feldman, J.↗
NASA NTRS2000

Hydrogen Sensors Demonstrated on the Shuttle

Microelectromechanical-systems- (MEMS-) based hydrogen sensor technology developed by the NASA Glenn Research Center at Lewis Field and Case Western Reserve University was demonstrated on shuttle missions STS-95 (Senator Glenn s mission) and STS-96. These smart sensors, commercialized by Makel Engineering Inc., were part of an "Integrated Vehicle Health Monitoring HEDS Technology Demonstration" series conducted at the NASA Kennedy Space Center. The experiments were designed to demonstrate the effect of technological upgrades on shuttle performance. The hydrogen sensors were micro-fabricated for minimal size, weight, and power consumption. A temperature detector and heater were included on the sensor for temperature control. Two palladium chrome (PdCr) hydrogen detection devices were included in each sensor package: a Schottky diode for low concentrations and a resistor for high concentrations. These sensor designs allow operation in inert environments. "Smart" electronics developed by Makel Engineering were integrated with the sensors to control the sensor temperature and process the output of the various sensors. This complete hydrogen detection system (two sensors on a chip with smart electronics) flew on STS-95 (launched October 1998) and STS-96 (launched May 1999). It was installed in the aft compartment of the shuttle and used to monitor the hydrogen concentration in that region. Up to this time, a mass spectrometer had monitored the hydrogen concentration in the aft compartment before launch, and "grab" bottles had been used after launch. The inside of these bottles is at vacuum. During flight, the grab bottles are pyrotechnically opened for a brief period, and the gas in the aft compartment is captured in the bottle. Several of these bottles are opened at different times during takeoff, and their contents are used to determine the time profile of the gases in the aft chamber. However, this information is not available until after the flight. On the launch pad, results from the new sensor technology paralleled the responses of the mass spectrometer with, in some cases, a quicker response time. In flight, data from the new sensors agreed with those derived from analyzing the contents of the grab bottles. Moreover, this microsensor can monitor the aft compartment continuously and, in principle, could monitor the health of the vehicle in real time during flight.

Hunter, Gary W.↗
NASA NTRS2003

Packaging Considerations for Integrated RF Microphotonic Receiver at Ka-Band

The NASA Computing, Information and Communications Technology (CICT) Program is supporting the development of an RF microphotonic Ka-band receiver. The receiver consists of a lithium niobate micro-disk that enables the incoming RF signal (up to Ka-band) to be coupled to the optical signal (approx. 200 THz). The modulated optical signal is detected by the high-speed photonic signal processing electronics. When compared with an all-electronic approach, the microphotonic receiver technology offers 1 Ox smaller volume, smaller weight, and smaller power consumption, greater sensitivity, and optical isolation for applications in extreme environments. It could potentially be implemented to support planetary surface-to-surface and surface-to-relay communications, as well as high-data-rate inter-satellite links. We are currently studying a number of fabrication and integration issues that could result as this technology is advanced for potential insertion into a NASA mission. The results of our preliminary effort to integrate the RF microphotonic receiver components (e.g., the lithium niobate micro-disk, the optical elements, and the Ka-band patch antenna) on an etched silicon wafer will be presented, In addition, the concomitant integration and packaging issues, and the potential NASA applications will be discussed.

Nguyen, Hung↗