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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1967

Investigation of Solder Cracking Problems on Printed Circuit Boards

A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

CIRCUIT BOARD↗
NASA NTRS2007

Designing High Speed Printed Circuit Boards Using DxDesigner and Expedition

Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.

printed circuit boards↗
NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability

This NESC Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗
NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability (Reuse Document ID 20205007963)

This HDPUG Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗
NASA NTRS1998

Review and Design of Printed Reflectarray Antennas

A printed reflectarray is an antenna similar to a parabolic reflector, but with its reflecting surface capable of being designed either flat or slightly curved for conformal mounting onto an existing structure without adding significant amount of mass and volume to the structure.

printed↗
NASA NTRS1996

Capabilities of Printed Reflectarray Antennas

This article presents an advanced antenna technology, namely the printed reflectarray, that has the potential for providing an enhanced communication capability with relatively low cost, small size and small mass. It has applicaiton in the commercial and military arenas as well as in space exploration.

advanced↗
NASA NTRSDate not supplied

Liquid Droplet Printing

The center has recently invested in a new additive manufacturing technology known as liquid metal jetting or liquid droplet printing. The Additec ElemX machine’s process utilizes wire feedstock fed into a ceramic crucible, where it is melted and ejected by pulsed Lorentz force using an external coil. The team will start with material characterization of various commercially available aluminum alloys to establish process parameters, repeatability, mechanical properties, and microstructure. Future research will consider additional alloys and explore concepts that may potentially adapt the technology for relevance in zero or low gravity environments. The printer has a 12”x12”x4.7” build volume and 0.24mm minimum layer height, with surface finishes comparable to sand castings.

liquid droplet printing↗
NASA NTRS2026

Influence of Processing Parameters on the Mechanical Properties of 3D Printed Borosilicate Particulate Reinforced Polymer Composites

Emerging composite materials are expanding the potential of additive manufacturing and enabling applications previously restricted by traditional manufacturing methods. The multi-phase nature of these composite materials combined with the complex in-ternal geometry of additively manufactured parts have enabled unique behavior, and potentially new applications. Additionally, these materials can be pyrolyzed to create dense metal, ceramic, and glass parts with geometries typically not achievable by tra-ditional processes. Additive manufacturing of borosilicate glass-based systems can open new applications in nuclear engineering, astronomy, and bone regrowth therapy. To elucidate the process-parameter relationship of borosilicate-polylactic acid (PLA) composites, mechanical testing was conducted and compared with a pure polylactic acid polymer baseline. Test specimens were fabricated by fused-filament fabrication with minimal post-processing. Yield strength, ultimate strength, and elastic modulus were calculated from stress-strain curves. Optical and scanning electron microscopy were conducted to observe the specimen microstructure before and after testing. The highest compressive yield strength for the composite was 28.22 MPa, and the highest compressive yield strength for PLA was 49.30 MPa. Print orientation was found to benefit the composite material but have a detrimental effect on the pure matrix material. An elastic modulus of 2.66 GPa was recorded for the borosilicate-PLA composite at 100% infill, 1 shell wall, and layer lines parallel to compression axis. Microscopy revealed that lower modulus composite specimens had the particulates re-distributed within the matrix. Tensile testing was done according to a polymer testing standard, which caused difficulties obtaining consistent fracture within the gauge length.

mechanical testing↗
NASA NTRS1966

Process produces accurate registry between circuit board prints

Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

Source record↗
NASA NTRS1967

Teleprinter uses thermal printing technique

Alphameric/facsimile printer receives serial digital data in the form of a specified number of bits per group and prints it on thermally sensitive paper. A solid state shift-register memorizes the incoming serial digital data.

Perkins, R. D.↗