Search NASA⌕ Search

SEARCH · Search NASA

Results for “Chips”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Cut–and–chip harvester material capacity and fuel performance on commercial-scale willow fields for varying ground and crop conditions

Shrub willow (Salix spp.) is capable of producing commercially attractive amounts of biomass in short rotations, but harvesting costs and logistics remain a concern. There is a particular need for information about harvesting operations on larger, commercial short–rotation woody crop systems. Another recent issue on commercial fields in northern New York is commercial growers conducting harvests during the growing season rather than the recommended dormant season when fields may be too wet to harvest. This study evaluated and modeled the in–field performance of a cut–and–chip harvester for almost 700 wagonloads of chips operating in commercial willow fields in a wider array of crop and field conditions than have been previously reported. Analysis indicated that the time of harvest (leaf–on or leaf–off) and whether site conditions were wet or dry affected the harvester's material capacity. Mean material capacity was greatest for leaf–off, dry conditions (71.8 Mg/hr) and lowest for leaf–on harvests, which were similar for wet (30.4 Mg/hr) and dry conditions (29.7 Mg/hr). Mean crop specific fuel consumption ranged between 1.3 and 3.3 L/Mg, but can get considerably higher for standing biomasses below 40 Mg/ha. Wet ground conditions and leaf–on harvests tend to decrease material capacity and increase fuel consumption as the harvester has to divert power to forward movement and material processing. Relationships for material capacity and fuel consumption based on standing biomass, time of harvest and ground conditions will be essential for evaluating and modeling the economic and environmental impacts of commercial–scale willow operations.

09 BIOMASS FUELS↗
DOE OSTI2026

Scalable multiplexed machine learning gas sensor chips for food classification

Multiplexed gas sensor arrays combined with machine learning have unlocked previously inaccessible applications for scent-based sensing. Current platforms are limited by overlapping sensing materials with similar compositions, leading to highly correlated responses, or multistep deposition processes that hinder scalability. In this work, we developed a 16-element monolithic chip with fully distinct sensing layers, enabling a truly heterogeneous array. The system consists of highly sensitive carbon nanotube field effect transistors that are functionalized through a single-step microdispensing method compatible with automated pipetting systems. The resulting chip produces characteristic signal patterns in response to object-specific scent profiles and, when combined with machine learning algorithms, can perform automated object identification. We demonstrate the classification of 16 different objects, including food spoilage and nut allergens, with a 92.6% overall prediction accuracy.

Bassil, Carla [University of California, Berkeley,↗
DOE OSTI2020

Chirped-grating spectrometer-on-a-chip

We demonstrate an on-chip spectrometer readily integrable with CMOS electronics. The structure is comprised of a SiO 2 /Si 3 N 4 /SiO 2 waveguide atop a silicon substrate. A transversely chirped grating is fabricated, in a single-step optical lithography process, on a portion of the waveguide to provide angle and wavelength dependent coupling to the guided mode. The spectral and angular information is encoded in the spatial dependence of the grating period. A uniform pitch grating area, separated from the collection area by an unpatterned propagation region, provides the out-coupling to a CMOS detector array. A resolution of 0.3 nm at 633 nm with a spectral coverage tunable across the visible and NIR (to ∼ 1 µm limited by the Si photodetector) by changing the angle of incidence, is demonstrated without the need for any signal processing deconvolution. This on-chip spectrometer concept will cost effectively enable a broad range of applications that are beyond the reach of current integrated spectroscopic technologies.

Nezhadbadeh, Shima↗
DOE OSTI2021

Optics-on-a-chip for ultrafast manipulation of 350-MHz hard x-ray pulses

Microelectromechanical systems (MEMS) are miniature devices integrated into a vast range of industrial and consumer applications. Optical MEMS are developed for dynamic spatiotemporal control in lightwave manipulation and communication as modulators, switches, multiplexers, spectrometer, etc. However, they have not been shown to function similarly in sub-nm wavelength regimes, namely, with hard x-rays, as high-brilliance pulsed x-rays have proven powerful for addressing challenges in time-domain science, from energy conversion to neurobiological control. While desirable temporal properties of x-ray pulses can be enhanced by optics, conventional x-ray optics are inherently massive in size, hence, never dynamic. We demonstrate highly ultrafast x-ray optics-on-a-chip based on MEMS capable of modulating hard x-ray pulses exceeding 350 MHz, 10 3 × higher than any other mechanical modulator, with a pulse purity >10 6 without compromising the spectral brilliance. Moreover, the timing characteristics of the devices can be tuned on-the-fly to deliver optimal pulse properties to create a host of dynamic x-ray instruments and applications, impossible with traditional optics of 10 9 × bulkier and more massive. The advent of the ultrafast optics-on-a-chip heralds a new paradigm of x-ray photonics, time-domain science, and accelerator diagnostics, especially at not only the future-generation light sources that offer coherent and high-frequency pulses but also lab-based facilities that normally do not offer timing structures.

42 ENGINEERING↗
DOE OSTI2021

Photonic integration of Er 3+ :Y 2 SiO 5 with thin-film lithium niobate by flip chip bonding

Rare earth ions are known as promising candidates for building quantum light-matter interface. However, tunable photonic cavity access to rare earth ions in their desired host crystal remains challenging. Here, we demonstrate the integration of erbium doped yttrium orthosilicate (Er 3+ :Y 2 SiO 5 ) with thin-film lithium niobate photonic circuit by plasma-activated direct flip chip bonding. Resonant coupling to erbium ions is realized by on-chip electro-optically tuned high Q lithium niobate micro-ring resonators. Fluorescence and absorption of erbium ions at 1536.48 nm are measured in the waveguides, while the collective ion-cavity cooperativity with micro-ring resonators is assessed to be 0.36. This work presents a versatile scheme for future rare earth ion integrated quantum devices.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2023

Chip-scale frequency combs for data communications in computing systems

Recent developments in chip-based frequency-comb technology demonstrate that comb devices can be implemented in applications where photonic integration and power efficiency are required. The large number of equally spaced comb lines that are generated make combs ideal for use in communication systems, where each line can serve as an optical carrier to allow for massively parallel wavelength-division multiplexing (WDM) transmission. In this review, we summarize the developments in integrated frequency-comb technology for use as a WDM source for communication systems in data centers and high-performance computing systems. We highlight the following three approaches for chip-scale comb generation: semiconductor modelocked lasers, electro-optic combs, and Kerr frequency combs.

Okawachi, Yoshitomo (ORCID:0000000196390549)↗
DOE OSTI2025

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.

Bernson, Robert [Tyndall National Institute, Cork ↗
DOE OSTI2025

Telecom-to-visible quantum frequency converter on a silicon nitride chip

Quantum frequency conversion serves a key role in the realization of hybrid quantum networks by interfacing between wavelength-incompatible platforms. Here we present what is believed to be the first quantum frequency converter connecting visible and telecom domains on a silicon nitride (SiN) chip, using Bragg-scattering four-wave mixing to upconvert heralded single photons from 1260 to 698 nm, which covers a 192 THz span. We examine the noise sources in SiN and devise approaches to suppress noise photons at the source and target frequencies to enable measurements at the single-photon level. We demonstrate an on-chip conversion efficiency of 5% in photon flux and describe design modifications that can be implemented to significantly improve it. Our results pave the way for the implementation of complementary metal-oxide-semiconductor (CMOS)-compatible devices in quantum networks.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2024

Beam test results for the Endcap Timing ReadOut Chip (ETROC2) for the CMS ETL upgrade

The Endcap Timing ReadOut Chip (ETROC) for the Compact Muon Solenoid (CMS) Minimum ionizing particle Timing Detector (MTD) is designed to process Low Gain Avalanche Diode (LGAD) signals with a time resolution of 40-50ps per hit, with 30-35 ps per charged particle using two layer detector. The ETROC2, is the first full size (16x16 pixels) and full functionally design that has been tested in hadron and electron beams at CERN and DESY (Sep 2023 - June 2024). Precision timing studies at these test beams are done using a self-referential beam telescope composed of up to 4 layers/chips. This talk describes the ETROC2 beam telescope and summarizes the performance of the ETROC2 chips bump-bonded to (16x16) Fondazione Bruno Kessler (FBK) and Hamamatsu Photonics K.K. (HPK) LGAD sensors using results from recent test beams. The experiences and lessons learned during the course of these test beams are also detailed in this talk.

Safdari, Murtaza↗
DOE OSTI2024

The Single Event Error (SEE) test and analysis of the CMS Endcap Timing Layer readout chip

The ETROC2, the first full size and full functionality prototype chip for the CMS Endcap Timing Layer readout, is strategically designed to meet the SEE immunity requirements of detector operation with the low power constraint. The triplicated periphery and pixel I2C configuration registers are designed with self-correction feature. The pixel readout control is centralized in the global readout and fully triplicated. The pixel readout is not triplicated, instead protected with power-efficient one-bit correction Hamming code. The TMR protection of the on-pixel threshold calibration can be turned off allowing the detection of the beam spot during the beam test by checking the bit-flips of the internal memory cells. In the initial proton beam test in January 2024, the chip readout process did not hang throughout the tests. The Hamming code correction strategy works because the error corrected TDC data were observed in the data frames. The error-injection simulation is performed to analy ze the small number of bit-flips in the configuration registers. We also performed SEE testing with a heavy ion beam in April and the data analysis is ongoing. The detailed design on the SEE immunity and the testing as well as simulation results will be presented, including follow-up SEE testing results in May and June 2024.

Gong, Datao↗
DOE OSTI2025

Shear Assisted Processing and Extrusion of Magnesium Alloy Machining Chips

The Pacific Northwest National Laboratory (PNNL) utilized Shear Assisted Processing and Extrusion (ShAPE) to convert magnesium alloy machining chips directly into wrought material. PNNL fabricated 0.25” and 0.50” round rod from cold compacted briquettes pressed from dry-machined chips by Loukus Technologies. The alloy composition is proprietary and protected by a Materials Transfer Agreement (MTA) between PNNL and Loukus. Extrusions were fabricated using the ShAPE 2.0 machine, tooling, and process. PNNL is evaluating tensile properties per ASTM E8 and microstructure for grain size, texture, and porosity using Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD). Tensile properties and microstructure results were not available at the time of writing this document. Extruded rods have also been sent to Loukus for evaluation.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Automated Detection of Qubit Structures on Quantum Chips

In this study, YOLO (You Only Look Once), a well-known object detection and image segmentation model, is used to detect qubits on a quantum chip. The model is trained by exposing it to various images of objects of interest and by setting various training parameters to allow the model to learn in unconventional conditions. We were able to provide the model with numerous images of qubits and various prominent features of note located on a qubit. We then created a simple GUI to display the model's live detections that would be integrated with the SEMs. This allowed us to create various functions such as auto-imagery of the qubits across a chip, auto-focusing, auto-contrasting, automatic staging, and directional corrections, enabling users to scan and analyze qubit surfaces in a fast and effective manner.

Perjuste, Ruth [Wellesley Coll.]↗
NASA NTRS1969

Improved method of dicing integrated circuit wafers into chips

Method employing a pressure chamber is used for dicing semiconductor single-crystal wafers, containing integrated circuits, into small chips along pre-scribed lines. Uniform bending of the scribed wafer over the convex surface of a perforated hemisphere, breaks it cleanly into individual chips without damaging the circuits.

Litant, I.↗
NASA NTRS1972

Development of chip passivated monolithic complementary MISFET circuits with beam leads

The results are presented of a program to demonstrate the processes for fabricating complementary MISFET beam-leaded circuits, which, potentially, are comparable in quality to available bipolar beam-lead chips that use silicon nitride passivation in conjunction with a platinum-titanium-gold metal system. Materials and techniques, different from the bipolar case, were used in order to be more compatible with the special requirements of fully passivated complementary MISFET devices. Two types of circuits were designed and fabricated, a D-flip-flop and a three-input NOR/NAND gate. Fifty beam-leaded chips of each type were constructed. A quality and reliability assurance program was performed to identify failure mechanisms. Sample tests and inspections (including destructive) were developed to measure the physical characteristics of the circuits.

Ragonese, L. J.↗
NASA NTRS1973

Laser scanner for testing semiconductor chips

Individual ''fingerprint'' signals are produced when system photoexcites chips. ''Fingerprints'' are analyzed for characteristics associated with defects, including many not visible to the naked eye. Electromagnetic radiation photogenerates free electrons and holes in semiconductor chip. These carriers produce electrical signals at terminals. Signals vary depending on what defects are present.

Hall, T. C.↗
NASA NTRS1980

Azimuth correlator design for IC chip

Azimuth correlator circuit synthetic-aperature radar (SAR) is designed for single integrated circuit (IC) chip. Azimuth correlator modules constructed with sets of such chips could make real-time signal processing possible. Primary advantages are realized in areas of weight and power requirement reductions.

Tyree, V. C.↗
NASA NTRS1978

Indium antimonide infrared CCD linear imaging arrays with on-chip preprocessing

A description is presented of the fabrication of a new InSb CCD chip based on an improved process which eliminates the limitations inherent with the earlier techniques. This process includes planar junction formation and an aluminum and SiO2 material system which is amenable to state-of-the-art chemical and plasma delineation techniques. Further, the new chip integrates for the first time in monolithic format InSb IR detectors with an InSb CCD. The reported experiments represent the first operation of an InSb infrared CCD array. In addition to fuller characterization of the 20-element charge-coupled infrared imaging device, several factors which influence device performance are currently being addressed. These include surface state density, the CCD output circuit, and storage time (dark current).

Thom, R. D.↗