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At least 163 records · Page 9

Performance Evaluations of Ceramic Wafer Seals

Future hypersonic vehicles will require high temperature, dynamic seals in advanced ramjet/scramjet engines and on the vehicle airframe to seal the perimeters of movable panels, flaps, and doors. Seal temperatures in these locations can exceed 2000 F, especially when the seals are in contact with hot ceramic matrix composite sealing surfaces. NASA Glenn Research Center is developing advanced ceramic wafer seals to meet the needs of these applications. High temperature scrub tests performed between silicon nitride wafers and carbon-silicon carbide rub surfaces revealed high friction forces and evidence of material transfer from the rub surfaces to the wafer seals. Stickage between adjacent wafers was also observed after testing. Several design changes to the wafer seals were evaluated as possible solutions to these concerns. Wafers with recessed sides were evaluated as a potential means of reducing friction between adjacent wafers. Alternative wafer materials are also being considered as a means of reducing friction between the seals and their sealing surfaces and because the baseline silicon nitride wafer material (AS800) is no longer commercially available.

Dunlap, Patrick H., Jr.↗

Separation and Detection of Toxic Gases with a Silicon Micromachined Gas Chromatography System

A miniature gas chromatography (GC) system was designed and fabricated using silicon micromachining and integrated circuit (IC) processing techniques. The silicon micromachined gas chromatography system (SMGCS) is composed of a miniature sample injector that incorporates a 10 microliter sample loop; a 0.9 meter long, rectangular shaped (300 micrometer width and 10 micrometer height) capillary column coated with a 0.2 micrometer thick copper phthalocyanine (CuPc) stationary phase; and a dual detector scheme based upon a CuPc-coated chemiresistor and a commercially available 125 micrometer diameter thermal conductivity detector (TCD) bead. Silicon micromachining was employed to fabricate the interface between the sample injector and the GC column, the column itself, and the dual detector cavity. A novel IC thin-film processing technique was developed to sublime the CuPc stationary phase coating on the column walls that were micromachined in the host silicon wafer substrate and Pyrex (r) cover plate, which were then electrostatically bonded together. The SMGCS can separate binary gas mixtures composed of parts-per-million (ppm) concentrations of ammonia (NH3) and nitrogen dioxide (NO2) when isothermally operated (55-80 degrees C). With a helium carrier gas and nitrogen diluent, a 10 microliter sample volume containing ammonia and nitrogen dioxide injected at 40 psi ((2.8 x 10(exp 5)Pa)) can be separated in less than 30 minutes.

Kolesar, Edward S.↗

Advanced detectors and signal processing for bubble memories

The feasibility of combining silicon and magnetic bubble technologies is demonstrated. Results of bubble film annealing indicate that a low temperature silicon on garnet technology is the most likely one to succeed commercially. Annealing ambients are also shown to have a major effect on the magnetic properties of bubble films. Functional MOSFETs were fabricated on bubble films coated with thick (approximately 1 micron) SiO2 layers. The two main problems with these silicon on garnet MOSFETs are low electron mobilities and large gate leakage currents. Results indicate that the laser recrystallized silicon and gate oxide (SiO2) layers are contaminated. The data suggest that part of the contaminating ions originate in the sputtered oxide spacer layer and part originates in the bubble film itself. A diffusion barrier, such as silicon nitride, placed between the bubble film and the silicon layer should eliminate the contamination induced problem.

Kryder, M. H.↗

Tensile and creep properties of titanium-vanadium, titanium-molybdenum, and titanium-niobium alloys

Tensile and creep properties of experimental beta-titanium alloys were determined. Titanium-vanadium alloys had substantially greater tensile and creep strength than the titanium-niobium and titanium-molybdenum alloys tested. Specific tensile strengths of several titanium-vanadium-aluminum-silicon alloys were equivalent or superior to those of commercial titanium alloys to temperatures of 650 C. The Ti-50V-3Al-1Si alloy had the best balance of tensile strength, creep strength, and metallurgical stability. Its 500 C creep strength was far superior to that of a widely used commercial titanium alloy, Ti-6Al-4V, and almost equivalent to that of newly developed commercial titanium alloys.

Gray, H. R.↗

Silicon Photo-Multiplier Readouts for Scintillators in High-Energy Astronomy

New scintillator materials have recently been shown to hold great potential for low-cost, reliable gamma-ray detectors in high-energy astronomy. New devices for the detection of scintillation light promise to make scintillator-based instruments even more attractive by reducing mass and power requirements,in particular, silicon photo-multipliers (SiPMs) are starting to become commercially available that offer gains and quantum efficiencies similar to those of photo-multiplier tubes (PMTs), but with greatly reduced mass, high ruggedness, low voltage requirements, and no sensitivity to magnetic fields. We have conducted laboratory tests of a sample of commercially available SiPMs coupled to LaBr3;Ce, a scintillator of relevance to to future high-energy astrophysics missions. We present results for gamma-ray spectroscopy. compare the SiPM performance to that of a PMT, and discuss the extent to which SiPMs offer significant advantages for scintillator-based space missions.

Bloser, Peter F.↗

Narrow bandgap semiconducting silicides: Intrinsic infrared detectors on a silicon chip

Work done during the final report period is presented. The main technical objective was to achieve epitaxial growth on silicon of two semiconducting silicides, ReSi2 and CrSi2. ReSi2 thin films were grown on (001) silicon wafers by vacuum evaporation of rhenium onto hot substrates in ultrahigh vacuum. The preferred epitaxial relationship was found to be ReSi2(100)/Si(001) with ReSi2(010) parallel to Si(110). The lattice matching consists of a common unit mesh of 120 A(sup 2) area, and a mismatch of 1.8 percent. Transmission electron microscopy revealed the existence of rotation twins corresponding to two distinct but equivalent azimuthal orientations of the common unit mesh. MeV He(+) backscattering spectrometry revealed a minimum channeling yield of 2 percent for an approximately 1,500 A thick film grown at 650 C. Although the lateral dimension of the twins is on the order of 100 A, there is a very high degree of alignment between the ReSi2(100) and the Si(001) planes. Highly oriented films of CrSi2 were grown on (111) silicon substrates, with the matching crystallographic faces being CrSi2(001)/Si(111). The reflection high-energy electron diffraction (RHEED) patterns of the films consist of sharp streaks, symmetrically arranged. The predominant azimuthal orientation of the films was determined to be CrSi2(210) parallel to Si(110). This highly desirable heteroepitaxial relationship has been obtained previously by others; it may be described with a common unit mesh of 51 A(sup 2) and mismatch of 0.3 percent. RHEED also revealed the presence of limited film regions of a competing azimuthal orientation, CrSi2(110) parallel to Si(110). A channeling effect for MeV He(+) ions was not found for this material. Potential commercial applications of this research may be found in silicon-integrated infrared detector arrays. Optical characterizations showed that semiconducting ReSi2 is a strong absorber of infrared radiation, with the adsorption constant increasing above 2 x 10(exp 4) cm(sup -1) for photon energies above 0.2 eV. CrSi2 is of potential utility for detection at photon energies above approximately 0.3 eV.

Mahan, John E.↗

Performance of MEMS Silicon Oscillator, ASFLM1, under Wide Operating Temperature Range

Over the last few years, MEMS (Micro-Electro-Mechanical Systems) resonator-based oscillators began to be offered as commercial-off-the-shelf (COTS) parts by a few companies [1-2]. These quartz-free, miniature silicon devices could compete with the traditional crystal oscillators in providing the timing (clock function) for many digital and analog electronic circuits. They provide stable output frequency, offer great tolerance to shock and vibration, and are immune to electro-static discharge [1-2]. In addition, they are encapsulated in compact lead-free packages, cover a wide frequency range (1 MHz to 125 MHz), and are specified, depending on the grade, for extended temperature operation from -40 C to +85 C. The small size of the MEMS oscillators along with their reliability and thermal stability make them candidates for use in space exploration missions. Limited data, however, exist on the performance and reliability of these devices under operation in applications where extreme temperatures or thermal cycling swings, which are typical of space missions, are encountered. This report presents the results of the work obtained on the evaluation of an ABRACON Corporation MEMS silicon oscillator chip, type ASFLM1, under extreme temperatures.

Patterson, Richard L.↗

Silicon Carbide Nanotube Synthesized

Carbon nanotubes (CNTs) have generated a great deal of scientific and commercial interest because of the countless envisioned applications that stem from their extraordinary materials properties. Included among these properties are high mechanical strength (tensile and modulus), high thermal conductivity, and electrical properties that make different forms of single-walled CNTs either conducting or semiconducting, and therefore, suitable for making ultraminiature, high-performance CNT-based electronics, sensors, and actuators. Among the limitations for CNTs is their inability to survive in high-temperature, harsh-environment applications. Silicon carbon nanotubes (SiCNTs) are being developed for their superior material properties under such conditions. For example, SiC is stable in regards to oxidation in air to temperatures exceeding 1000 C, whereas carbon-based materials are limited to 600 C. The high-temperature stability of SiCNTs is envisioned to enable high-temperature, harsh-environment nanofiber- and nanotube-reinforced ceramics. In addition, single-crystal SiC-based semiconductors are being developed for hightemperature, high-power electronics, and by analogy to CNTs with silicon semiconductors, SiCNTs with single-crystal SiC-based semiconductors may allow high-temperature harsh-environment nanoelectronics, nanosensors, and nanoactuators to be realized. Another challenge in CNT development is the difficulty of chemically modifying the tube walls, which are composed of chemically stable graphene sheets. The chemical substitution of the CNTs walls will be necessary for nanotube self-assembly and biological- and chemical-sensing applications. SiCNTs are expected to have a different multiple-bilayer wall structure, allowing the surface Si atoms to be functionalized readily with molecules that will allow SiCNTs to undergo self-assembly and be compatible with a variety of materials (for biotechnology applications and high-performance fiber-reinforced ceramics).

Lienhard, Michael A.↗

Thermal Processing Effects on the Adhesive Strength of PS304 High Temperature Solid Lubricant Coatings

In this paper the effects of post deposition heat treatments on the cohesive and adhesive strength properties of PS304, a plasma sprayed nickel-chrome based, high temperature solid lubricant coating deposited on stainless steel, are studied. Plasma spray deposited coating samples were exposed in air at temperatures from 432 to 650 C for up to 500 hr to promote residual stress relief, enhance particle to particle bonding and increase coating to substrate bond strength. Coating pull-off strength was measured using a commercial adhesion tester that utilizes 13 mm diameter aluminum pull studs attached to the coating surface with epoxy. Pull off force was automatically recorded and converted to coating pull off strength. As deposited coating samples were also tested as a baseline. The as-deposited (untreated) samples either delaminated at the coating-substrate interface or failed internally (cohesive failure) at about 17 MPa. Samples heat treated at temperatures above 540 C for 100 hr or at 600 C or above for more than 24 hr exhibited strengths above 31 MPa, nearly a two fold increase. Coating failure occurred inside the body of the coating (cohesive failure) for nearly all of the heat-treated samples and only occasionally at the coating substrate interface (adhesive failure). Metallographic analyses of heat-treated coatings indicate that the Nickel-Chromium binder in the PS304 appears to have segregated into two phases, a high nickel matrix phase and a high chromium precipitated phase. Analysis of the precipitates indicates the presence of silicon, a constituent of a flow enhancing additive in the commercial NiCr powder. The exact nature and structure of the precipitate phase is not known. This microstructural change is believed to be partially responsible for the coating strength increase. Diffusion bonding between particles may also be playing a role. Increasing the heat treatment temperature, exposure time or both accelerate the heat treatment process. Preliminary measurements indicate that the heat treatment also results in a one time, permanent coating thickness increase of about 3%. Based upon these results, the incorporation of a heat treatment prior to final finishing has been incorporated in the application process of this coating technology.

DellaCorte, Christopher↗

Development and evaluation of die materials for use in the growth of silicon ribbons by the inverted ribbon growth process, task 2. LSSA project

The results of emission spectroscopic analysis indicate that molten silicon can remain in contact with hot-pressed Si3N4 (99.2 percent theoretical density) for prolonged periods without attaining the impurity content level of the nitride. Although MgO was used as binder, Mg was not found present in the silicon sessile drop in quantities much above the level initially present in the silicon source material. Preliminary experiments with EFG-type dies coated with CVD Si3N4 or CVD SiOxNy indicate that capillary rise does not occur readily in these dies. The same was found to be true of hot-pressed and reaction-sintered Si3N4 obtained commercially. However, when dies were formed by depositing CVD layers on shaped silicon slabs, a column of molten silicon was maintained in each CVD die while being heated in contact with a crucible of molten silicon. Preliminary wetting of dies appears necessary for EFG growth. Several ribbon growth experiments were performed from V-shaped dies.

Duffy, M. T.↗

Controlled Directional Solidification of Aluminum - 7 wt Percent Silicon Alloys: Comparison Between Samples Processed on Earth and in the Microgravity Environment Aboard the International Space Station

An overview of the international "MIcrostructure Formation in CASTing of Technical Alloys" (MICAST) program is given. Directional solidification processing of metals and alloys is described, and why experiments conducted in the microgravity environment aboard the International Space Station (ISS) are expected to promote our understanding of this commercially relevant practice. Microstructural differences observed when comparing the aluminum - 7 wt% silicon alloys directionally solidified on Earth to those aboard the ISS are presented and discussed.

Grugel, Richard N.↗

Analysis of stress-strain, fracture and ductility behavior of aluminum matrix composites containing discontinuous silicon carbide reinforcement

Mechanical properties and stress-strain behavior for several types of commercially fabricated aluminum matrix composites, containing up to 40 vol % discontinuous SiC whisker, nodule, or particulate reinforcement were evaluated. It was found that the elastic modulus of the composites was isotropic, to be independent of type of reinforcement, and to be controlled solely by the volume percentage of SiC reinforcement present. The yield/tensile strengths and ductility were controlled primarily by the matrix alloy and temper condition. Ductility decreased with increasing reinforcement content, however, the fracture strains observed were higher than those reported in the literature for this type of composite. This increase in fracture strain is attributed to cleaner matrix powder and increased mechanical working during fabrication. Conventional aluminum and titanium structural alloys were compared and have shown that the properties of these low cost, lightweight composites have good potential for application to aerospace structures.

Mcdanels, D. L.↗

Commerical (terrestrial) and modified solar array design studies for low cost, low power space applications

The suitability of commercial (terrestrial) solar arrays for use in low Earth orbit is examined. It is shown that commercial solar arrays degrade under thermal cycling because of material flexure, and that certain types of silicones used in the construction of these arrays outgas severely. Based on the results, modifications were made. The modified array retains the essential features of typical commercial arrays and can be easily built by commercial fabrication techniques at low cost. The modified array uses a metal tray for containment, but eliminates the high outgassing potting materials and glass cover sheets. Cells are individually mounted with an adhesive and individually covered with glass cover slips, or clear plastic tape. The modified array is found to withstand severe thermal cycling for long intervals of time.

Kolecki, J. C.↗

Electrically Conductive Paints for Satellites

A program was conducted to develop and test electrically conductive paint coatings for spacecraft. A wide variety of organic and inorganic coatings were formulated using conductive binders, conductive pigments, and similar approaches. Z-93, IITRI's standard specification inorganic thermal control coating, exhibits good electrical properties and is a very space-stable coating system. Several coatings based on a conductive pigment (antimony-doped tin oxide) in silicone and silicate binders offer considerable promise. Paint systems using commercially available conductive polymers also appear to be of interest, but will require substantial development. Evaluations were made based on electrical conductivity, paint physical properties, and the stability of spectral reflectance in space environment testing.

Gilligan, J. E.↗

Solar photovoltaic systems

The Department of Energy's photovoltaic program is outlined. The main objective of the program is the development of low cost reliable terrestrial photovoltaic systems. A second objective is to foster widespread use of the system in residential, industrial and commercial application. The system is reviewed by examining each component; silicon solar cell, silicon solar cell modules, advanced development modules and power systems. Cost and applications of the system are discussed.

Forney, R. G.↗

Spinner For Etching Of Semiconductor Wafers

Simple, inexpensive apparatus coats semiconductor wafers uniformly with hydrofluoric acid for etching. Apparatus made in part from small commercial electric-fan motor. Features bowl that collects acid. Silicon wafer placed on platform and centered on axis; motor switched on. As wafer spins, drops of hydrofluoric acid applied from syringe. Centrifugal force spreads acid across wafer in fairly uniform sheet.

Lombardi, Frank↗

A LiF silicon sandwich counter to measure water content of planetary surfaces

The neutron counter proposed here has a long history and was commercially available in a somewhat different form. This counter would be suitable for a rover or lander since it requires a rather long measuring time for each placement. It consists of two silicon wafer charged-particle counters with a layer of Li-6F deposited on the inner surface of one. The neutron detecting reaction is Li-6(n,H-3)He-4 in which the alpha particle and the triton are emitted from the Li-6 deposit back to back. If one of the detectors sees the alpha particle, the other will see the triton. This allows one to use a coincidence technique that virtually eliminates all background. The signals from each detector can be added together so that the total energy of the reaction, Q=4.6 MeV and the kinetic energy of the neutron, can be recorded.

Drake, D. M.↗

Development of an Improved High Efficiency Thin Silicon Solar Cell

Breakage and front contact failure in high efficiency, textured ultrathin cells was reduced as a consequence of the introduction of process modifications. In a small production run, over one hundred ultrathin cells, having an average AMO efficiency of 13%, were fabricated from 10-25 ohm cm silicon. An in-house aluminum paste for back surface field formation was developed that resulted in cell efficiencies equivalent to those from commercial pastes. The quality of the back surface field was found to be dependent on the orientation of the silicon slice during alloying.

Storti, G.↗