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At least 163 records · Page 9

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NASA NTRS2017

A Ka-Band (26 GHz) Circularly Polarized 2x2 Microstrip Patch Sub-Array with Compact Feed

A Ka-Band (26 gigahertz) 2 by 2 sub-array with square-shaped microstrip patch antenna elements having two truncated corners for circular polarization (CP) is presented. In addition, the layout for a new compact microstrip feed network for the sub-array is also presented. The compact feed network offers a footprint size reduction of near 60 percent over traditional sub-array at 26 gigahertz. Experimental data indicates that a truncation amount a equals 0.741 millimeters for an isolated patch element results in a return loss (S (sub II)) of minus 35 decibels at 26.3 gigahertz. Furthermore, the measured S (sub II) for the proof-of-concept sub-array with the above elements is better than minus 10.0 decibels at 27.7 gigahertz. However, the impedance match and the operating frequency can be fine-tuned to 26 gigahertz by adjusting the feed network dimensions. Lastly, good agreement is observed between the measured and simulated S (sub II) for the subarray for both right hand and left hand CP. The goal of this effort is utilize the above sub-array as a building block for a larger N by N element array, which would serve as a feed for a reflector antenna for satellite communications.

Microstrip↗

NASA NTRS1995

Vibration Method for Tracking the Resonant Mode and Impedance of a Microwave Cavity

There has been a concerted effort to improve the microwave heating technique for processing materials at high temperature. Improved optimization of the energy transfer from a microwave source to the material being processed is required. A vibration technique is pre- sented to continuously maintain a mode resonance and impedance match between a constant frequency magnetron source and a resonant cavity.

microwave↗

NASA NTRSDate not supplied

Cognitive Tapered Slot Circular Array Antenna for Lunar Surface Communications

In this paper, we present the design of a cognitive tapered slot circular array (TSCA) antenna with multiple electronically switched sector beams for lunar surface communication. The circular array is capable of sensing the frequency, power, and direction of arrival of the RF signals. The design of the TSCA builds on our prior work on the development of a single TSA element with a balanced microstrip/coax feed. The measured return loss of the single TSA element shows wide bandwidth with good impedance match across the 5 to 35 GHz frequency range. Additionally, the single TSA has good radiation patterns. The single TSA serves as the building block for a four-element TSCA with multiple electronically switched sector beams for sensing and communications.

Cognitive communications↗

NASA NTRSDate not supplied

Cognitive Tapered Slot Circular Array Antenna for Lunar Surface Communications

Antenna↗

NASA NTRSDate not supplied

Technology Developments for FIR Bolometric Detector Focal Plane Assemblies

A discussion of recent technology developments for far-infrared bolometric detector focal plane assemblies is provided. Some of the developments include strategies for fabricating high filling fraction background limited-transition edge sensor bolometric detectors, impedance-matched absorber coatings, a micromachined blackbody source, and the capability to fabricate indium bumps on non-planar substrates.

Detectors↗

NASA NTRS1994

Acoustic calibration apparatus for calibrating plethysmographic acoustic pressure sensors

An apparatus for calibrating an acoustic sensor is described. The apparatus includes a transmission material having an acoustic impedance approximately matching the acoustic impedance of the actual acoustic medium existing when the acoustic sensor is applied in actual in-service conditions. An elastic container holds the transmission material. A first sensor is coupled to the container at a first location on the container and a second sensor coupled to the container at a second location on the container, the second location being different from the first location. A sound producing device is coupled to the container and transmits acoustic signals inside the container.

Zuckerwar, Allan J.↗

NASA NTRS1995

Acoustic calibration apparatus for calibrating plethysmographic acoustic pressure sensors

Zuckerwar, Allan J.↗

NASA NTRS2011

Ultra-Sensitive Transition-Edge Sensors (TESs) for Far-IR/Submm Space-Borne Spectroscopy

We have built surface micromachined thin-film metallized Si(x)N(y) optical absorbers for transition-edge sensors (TESs) suitable for the Background - Limited far-IR/Submm Spectrograph (BLISS). BLISS is a broadband (38 micrometers - 433 micrometers), grating spectrometer consisting of five wavebands each with a modest resolution of R (is) approx. 1000. Because BLISS requires the effective noise equivalent power (NEP) of the TES to be below 10 (exp 19) W/Hz(exp 1/2), our TESs consist of four long (1000 micrometers), narrow (0.4 micrometers ), and thin (0.25 micrometers ) Si(x) N(y) support beams that reduce the thermal conductance G between the substrate and the optical absorber. To reduce the heat capacity of the absorber and make the response time tau fast enough for BLISS, our absorbers are patterned into a mesh geometry with a fill factor of less than 10%. We use a bilayer of Ti/Au to make the effective impedance of the absorber match the impedance of the incoming radiation for each band. Measurements of the response time of the metallized absorbers to heat pulses show that their heat capacity exceeds the predictions of the Debye model. Our results are suggestive that the surface of the low pressure chemical vapor deposition (LPCVD) Si(x)N(y) used in the absorbers' construction is the source of microstates that dominate the heat capacity.

far-IR spectrometer↗

NASA NTRS2003

High-Performance Solid-State W-Band Power Amplifiers

The figure shows one of four solid-state power amplifiers, each capable of generating an output power greater than or equal to 240 mW over one of four overlapping frequency bands from 71 to 106 GHz. (The bands are 71 to 84, 80 to 92, 88 to 99, and 89 to 106 GHz.) The amplifiers are designed for optimum performance at a temperature of 130 K. These amplifiers were developed specifically for incorporation into frequency-multiplier chains in local oscillators in a low-noise, far-infrared receiving instrument to be launched into outer space to make astrophysical observations. The designs of these amplifiers may also be of interest to designers and manufacturers of terrestrial W-band communication and radar systems. Each amplifier includes a set of six high-electron-mobility transistor (HEMT) GaAs monolithic microwave integrated-circuit (MMIC) chips, microstrip cavities, and other components packaged in a housing made from A-40 silicon-aluminum alloy. This alloy was chosen because, for the original intended spacecraft application, it offers an acceptable compromise among the partially competing requirements for high thermal conductivity, low mass, and low thermal expansion. Problems that were solved in designing the amplifiers included designing connectors and packages to fit the available space; designing microstrip signal-power splitters and combiners; matching of impedances across the frequency bands; matching of the electrical characteristics of those chips installed in parallel power-combining arms; control and levelling of output power across the bands; and designing the MMICs, microstrips, and microstrip cavities to suppress tendencies toward oscillation in several modes, both inside and outside the desired frequency bands.

Gaier, Todd↗

NASA NTRS2008

24-Way Radial Power Combiner/Divider for 31 to 36 GHz

The figure shows a prototype radial power-combining waveguide structure, capable of operation at frequencies from 31 to 36 GHz, that features an unusually large number (N = 24) of combining (input) ports. The combination of wide-band operation and large N is achieved by incorporating several enhancements over a basic radial power-combiner design. In addition, the structure can be operated as a power divider by reversing the roles of the input and output ports. In this structure, full-height waveguides at the combining ports are matched in impedance to reduced-height radial waveguides inside the combiner base. This match is effected by impedance-transforming stepped waveguide sections. This matching scheme is essential to achievement of large N because N is limited by the height of the waveguides in the base. Power is coupled from the 24 reduced- height radial waveguides into the TE01 mode of a circular waveguide in the base with the help of a matching post at the bottom of the base. ( TE signifies transverse electric, the first subscript is the azimuthal mode number, and the second subscript is the radial mode number.) More specifically, the matching post matches the reflections from the walls of the 24 reduced-height waveguides and enables the base design to exceed the bandwidth requirement. After propagating along the circular waveguide, the combined power is coupled, via a mode transducer, to a rectangular waveguide output port. The mode transducer is divided into three sections, each sized and shaped as part of an overall design to satisfy the mode-conversion and output-coupling requirements while enabling the circular waveguide to be wide enough for combining the 24 inputs over the frequency range of 31 to 36 GHz. During the design process, it was found that two different rectangular waveguide outputs could be accommodated through modification of only the first section of the mode converter, thereby enabling operation in multiple frequency ranges.

Epp, Larry↗

NASA NTRS2007

Distributed Antenna-Coupled TES for FIR Detectors Arrays

We describe a new architecture for a superconducting detector for the submillimeter and far-infrared. This detector uses a distributed hot-electron transition edge sensor (TES) to collect the power from a focal-plane-filling slot antenna array. The sensors lay directly across the slots of the antenna and match the antenna impedance of about 30 ohms. Each pixel contains many sensors that are wired in parallel as a single distributed TES, which results in a low impedance that readily matches to a multiplexed SQUID readout These detectors are inherently polarization sensitive, with very low cross-polarization response, but can also be configured to sum both polarizations. The dual-polarization design can have a bandwidth of 50The use of electron-phonon decoupling eliminates the need for micro-machining, making the focal plane much easier to fabricate than with absorber-coupled, mechanically isolated pixels. We discuss applications of these detectors and a hybridization scheme compatible with arrays of tens of thousands of pixels.

antenna↗

NASA NTRS2005

Control Software for a High-Performance Telerobot

A computer program for controlling a high-performance, force-reflecting telerobot has been developed. The goal in designing a telerobot-control system is to make the velocity of the slave match the master velocity, and the environmental force on the master match the force on the slave. Instability can arise from even small delays in propagation of signals between master and slave units. The present software, based on an impedance-shaping algorithm, ensures stability even in the presence of long delays. It implements a real-time algorithm that processes position and force measurements from the master and slave and represents the master/slave communication link as a transmission line. The algorithm also uses the history of the control force and the slave motion to estimate the impedance of the environment. The estimate of the impedance of the environment is used to shape the controlled slave impedance to match the transmission-line impedance. The estimate of the environmental impedance is used to match the master and transmission-line impedances and to estimate the slave/environment force in order to present that force immediately to the operator via the master unit.

Kline-Schoder, Robert J.↗

NASA NTRS2010

Fabrication of an Absorber-Coupled MKID Detector and Readout for Sub-Millimeter and Far-Infrared Astronomy

We have fabricated absorber-coupled microwave kinetic inductance detector (MKID) arrays for sub-millimeter and far-infrared astronomy. Each detector array is comprised of lambda/2 stepped impedance resonators, a 1.5 micrometer thick silicon membrane, and 380 micrometer thick silicon walls. The resonators consist of parallel plate aluminum transmission lines coupled to low impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The Al transmission lines simultaneously act to absorb optical power and are designed to have a surface impedance and filling fraction so as to match the impedance of free space. Our novel fabrication techniques demonstrate high fabrication yield of MKID arrays on large single crystal membranes and sub-micron front-to-back alignment of the microstrip circuit.

Brown, Ari-David↗

NASA NTRS2010

Fabrication of an Absorber-Coupled MKID Detector and Readout for Sub-Millimeter and Far-Infrared Astronomy

We have fabricated absorber-coupled microwave kinetic inductance detector (MKID) arrays for sub-millimeter and farinfrared astronomy. Each detector array is comprised of lambda/2 stepped impedance resonators, a 1.5μm thick silicon membrane, and 380μm thick silicon walls. The resonators consist of parallel plate aluminum transmission lines coupled to low impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The Al transmission lines simultaneously act to absorb optical power and are designed to have a surface impedance and filling fraction so as to match the impedance of free space. Our novel fabrication techniques demonstrate high fabrication yield of MKID arrays on large single crystal membranes and sub-micron front-to-back alignment of the microstrip circuit.

far-infrared↗

NASA NTRS2010

Special Component Designs for Differential-Amplifier MMICs

Special designs of two types of electronic components transistors and transmission lines have been conceived to optimize the performances of these components as parts of waveguide-embedded differential-amplifier monolithic microwave integrated circuits (MMICs) of the type described in the immediately preceding article. These designs address the following two issues, the combination of which is unique to these particular MMICs: Each MMIC includes a differential double-strip transmission line that typically has an impedance between 60 and 100 W. However, for purposes of matching of impedances, transmission lines having lower impedances are also needed. The transistors in each MMIC are, more specifically, one or more pair(s) of InP-based high-electron-mobility transistors (HEMTs). Heretofore, it has been common practice to fabricate each such pair as a single device configured in the side-to-side electrode sequence source/gate/drain/gate/source. This configuration enables low-inductance source grounding from the sides of the device. However, this configuration is not suitable for differential operation, in which it is necessary to drive the gates differentially and to feed the output from the drain electrodes differentially. The special transmission-line design provides for three conductors, instead of two, in places where lower impedance is needed. The third conductor is a metal strip placed underneath the differential double-strip transmission line. The third conductor increases the capacitance per unit length of the transmission line by such an amount as to reduce the impedance to between 5 and 15 W. In the special HEMT-pair design, the side-to-side electrode sequence is changed to drain/gate/source/gate/ drain. In addition, the size of the source is reduced significantly, relative to corresponding sizes in prior designs. This reduction is justified by the fact that, by virtue of the differential configuration, the device has an internal virtual ground, and therefore there is no need for a low-resistance contact between the source and the radio-frequency circuitry. The source contact is needed only for DC biasing. These designs were implemented in a single-stage-amplifier MMIC. In a test at a frequency of 305 GHz, the amplifier embedded in a waveguide exhibited a gain of 0 dB; after correcting for the loss in the waveguide, the amplifier was found to afford a gain of 0.9 dB. In a test at 220 GHz, the overall gain of the amplifier- and-waveguide assembly was found to be 3.5 dB.

Kangaslahti, Pekka↗

NASA NTRS2012

Fabrication of an Absorber-Coupled MKID Detector

Absorber-coupled microwave kinetic inductance detector (MKID) arrays were developed for submillimeter and far-infrared astronomy. These sensors comprise arrays of lambda/2 stepped microwave impedance resonators patterned on a 1.5-mm-thick silicon membrane, which is optimized for optical coupling. The detector elements are supported on a 380-mm-thick micro-machined silicon wafer. The resonators consist of parallel plate aluminum transmission lines coupled to low-impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The transmission lines simultaneously act to absorb optical power and employ an appropriate surface impedance and effective filling fraction. The fabrication techniques demonstrate high-fabrication yield of MKID arrays on large, single-crystal membranes and sub-micron front-to-back alignment of the micro strip circuit. An MKID is a detector that operates upon the principle that a superconducting material s kinetic inductance and surface resistance will change in response to being exposed to radiation with a power density sufficient to break its Cooper pairs. When integrated as part of a resonant circuit, the change in surface impedance will result in a shift in its resonance frequency and a decrease of its quality factor. In this approach, incident power creates quasiparticles inside a superconducting resonator, which is configured to match the impedance of free space in order to absorb the radiation being detected. For this reason MKIDs are attractive for use in large-format focal plane arrays, because they are easily multiplexed in the frequency domain and their fabrication is straightforward. The fabrication process can be summarized in seven steps: (1) Alignment marks are lithographically patterned and etched all the way through a silicon on insulator (SOI) wafer, which consists of a thin silicon membrane bonded to a thick silicon handle wafer. (2) The metal microwave circuitry on the front of the membrane is patterned and etched. (3) The wafer is then temporarily bonded with wafer wax to a Pyrex wafer, with the SOI side abutting the Pyrex. (4) The silicon handle component of the SOI wafer is subsequently etched away so as to expose the membrane backside. (5) The wafer is flipped over, and metal microwave circuitry is patterned and etched on the membrane backside. Furthermore, cuts in the membrane are made so as to define the individual detector array chips. (6) Silicon frames are micromachined and glued to the silicon membrane. (7) The membranes, which are now attached to the frames, are released from the Pyrex wafer via dissolution of the wafer wax in acetone.

Brown, Ari↗

NASA NTRS2002

Tantalum hot-electron bolometers for low-noise heterodyne receivers

We describe superconducting diffusion-cooled hot-electron bolometers that were fabricated fromtantalum films grown on a thin niobium seed layer. The seed layer promotes single-phase growth of the Ta films, resulting in high-quality bolometers with transition temperatures up to 2.35 K and transition widths of less than 0.2 K. An S-parameter measurement set-up in a He-3 cryostat was used to measure device impedance versus frequency of a 400 nm long device at a temperature of 400 mK. It is shown that a 3 dB roll-off frequency of about 1 GHz can be achieved when the device resistance matches the impedance of the embedding network (no electrothermal feedback). This would lead to a prediction of 16 GHz for a 100 nm device, and indicates that a heterodyne mixer using a Ta HEB should be able to operate at several GHz even with a significant amount of electrothermal feedback.

bolometer superconductor tantalum↗

NASA NTRS2011

Microwave Tissue Soldering for Immediate Wound Closure

A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings, by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds. Using microwave energy to seal wounds has a number of advantages over lasers, which are currently in experimental use in some hospitals. Laser tissue welding is unsuitable for emergency use because its large, bulky equipment cannot be easily moved between operating rooms, let alone relocated to field sites where emergencies often occur. In addition, this approach is highly dependent on the uniformity and thickness of the protein solder as well as the surgeon s skills. In contrast, the use of microwave energy is highly tolerant of the thickness of the protein solder, level of fluids in and around the wound, and other parameters that can adversely affect the outcome of laser welding. However, controlling the depth of penetration of the microwave energy into the wound is critical for achieving effective wound sealing without damaging the adjacent tissue. In addition, microspheres that encapsulate metallic cores could also be incorporated into the protein solder to further control the depth of penetration of the microwave energy.

Arndt, G. Dickey↗