Addendum to NASA synchrodyne contract Final report
Design of research and fabrication facility for monolithic integrated circuits
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Development of qualification test program for microelectronic devices Final report, 1 Nov. 1968 - 3 Jul. 1969
Qualification test program for digital monolithic integrated circuit devices
Binelli, W. D.↗
Coaxial Inverted Geometry Epitaxial Transistor
Silicon transistor, developed for use in biotelemetry circuits, provides high current gain at low levels of power and voltage. Device operates from biopotential or miniature batteries and is suitable for incorporation into monolithic integrated circuits. Coaxial configuration and small size offer promise for high frequency application.
Hruby, R. J.↗
Long life assurance study for manned spacecraft long life hardware. Volume 2: Long life assurance studies of EEE parts and packaging
Guidelines for the design, development, and fabrication of electronic components and circuits for use in spacecraft construction are presented. The subjects discussed involve quality control procedures and test methodology for the following subjects: (1) monolithic integrated circuits, (2) hybrid integrated circuits, (3) transistors, (4) diodes, (5) tantalum capacitors, (6) electromechanical relays, (7) switches and circuit breakers, and (8) electronic packaging.
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Coaxial inverted geometry transistor having buried emitter
The invention relates to an inverted geometry transistor wherein the emitter is buried within the substrate. The transistor can be fabricated as a part of a monolithic integrated circuit and is particularly suited for use in applications where it is desired to employ low actuating voltages. The transistor may employ the same doping levels in the collector and emitter, so these connections can be reversed.
Hruby, R. J.↗
Techniques of Final Preseal Visual Inspection
A dissertation is given on the final preseal visual inspection of microcircuit devices to detect manufacturing defects and reduce failure rates in service. The processes employed in fabricating monolithic integrated circuits and hybrid microcircuits, various failure mechanisms resulting from deficiencies in those processes, and the rudiments of performing final inspection are outlined.
Anstead, R. J.↗
Temperature compensated current source
A current source was designed which is substantially independent of variations of temperature. The current source may be made either to have a linear dependence upon changes of temperature or, by the simple addition of a resistor, may be made substantially independent of temperature variations. Since the current source consists only of transistors of one conductivity type and resistors, it is ideally suited for manufacture in the form of a monolithic integrated circuit.
Breuer, D. R.↗
Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits
Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.
Mandal, R. P.↗
Phase control and beam steering of semiconductor laser arrays
The operational principles and a possible device configuration of one dimensional monolithically integrated semiconductor laser arrays are described. The output beam of the array can be electronically steered. Devices of the type can find applications in optical communication systems where the power levels needed are above the capability of a single laser device.
Katz, J.↗
Semiconductor optoelectronic devices for free-space optical communications
The properties of individual injection lasers are reviewed, and devices of greater complexity are described. These either include or are relevant to monolithic integration configurations of the lasers with their electronic driving circuitry, power combining methods of semiconductor lasers, and electronic methods of steering the radiation patterns of semiconductor lasers and laser arrays. The potential of AlGaAs laser technology for free-space optical communications systems is demonstrated. These solid-state components, which can generate and modulate light, combine the power of a number of sources and perform at least part of the beam pointing functions. Methods are proposed for overcoming the main drawback of semiconductor lasers, that is, their inability to emit the needed amount of optical power in a single-mode operation.
Katz, J.↗
LEC GaAs for integrated circuit applications
Recent developments in liquid encapsulated Czochralski techniques for the growth of semiinsulating GaAs for integrated circuit applications have resulted in significant improvements in the quality and quantity of GaAs material suitable for device processing. The emergence of high performance GaAs integrated circuit technologies has accelerated the demand for high quality, large diameter semiinsulating GaAs substrates. The new device technologies, including digital integrated circuits, monolithic microwave integrated circuits and charge coupled devices have largely adopted direct ion implantation for the formation of doped layers. Ion implantation lends itself to good uniformity and reproducibility, high yield and low cost; however, this technique also places stringent demands on the quality of the semiinsulating GaAs substrates. Although significant progress was made in developing a viable planar ion implantation technology, the variability and poor quality of GaAs substrates have hindered progress in process development.
Kirkpatrick, C. G.↗
Large-area thin-film modules
The low cost potential of thin film solar cells can only be fully realized if large area modules can be made economically with good production yields. This paper deals with two of the critical challenges. A scheme is presented which allows the simple, economical realization of the long recognized, preferred module structure of monolithic integration. Another scheme reduces the impact of shorting defects and, as a result, increases the production yields. Analytical results demonstrating the utilization and advantages of such schemes are discussed.
Tyan, Y. S.↗
MMIC devices for active phased array antennas
The use of finlines for microwave monolithic integrated circuit application in the 20 to 40 GHz frequency range. Other wave guiding structures, are also examined from a comparative point of view and some sonclusions are drawn on the basis of the results.
Mittra, R.↗
Optically controlled microwave devices and circuits: Emerging applications in space communications systems
Optical control of microwave devices and circuits by an optical fiber has the potential to simplify signal distribution networks in high frequency communications systems. The optical response of two terminal and three terminal (GaAs MESFET, HEMT, PBT) microwave devices are compared and several schemes for controlling such devices by modulated optical signals examined. Monolithic integration of optical and microwave functions on a single semiconductor substrate is considered to provide low power, low loss, and reliable digital and analog optical links for signal distribution.
Bhasin, Kul B.↗
Detection of radio-frequency modulated optical signals by two and three terminal microwave devices
An interdigitated photoconductor (two terminal device) on GaAlAs/GaAs heterostructure was fabricated and tested by an electro-optical sampling technique. Further, the photoresponse of GaAlAs/GaAs HEMT (three terminal device) was obtained by illuminating the device with an optical signal modulated up to 8 GHz. Gain-bandwidth product, response time, and noise properties of photoconductor and HEMT devices were obtained. Monolithic integration of these photodetectors with GaAs microwave devices for optically controlled phased array antenna applications is discussed.
Bhasin, K. B.↗
A 30-GHz monolithic receiver
Several monolithic integrated circuits have been developed to make a 30-GHz receiver. The receiver components include a low-noise amplifier (LNA), an IF amplifier, a mixer, and a phase shifter. The LNA has a 7-dB noise figure with over 17 dB of associated gain. The IF amplifier has a 13-dB gain with a 30-dB control range. The mixer has a conversion loss of 10.5 dB. The phase shifter has a 180-deg phase shift control and a minimum insertion loss of 1.6 dB.
Liu, Louis C. T.↗
Phase-locked arrays of semiconductor injection lasers - A review
Arrays of phase-locked semiconductor injection lasers integrated monolithically on the same substrate are one potential method for obtaining higher power levels (in controlled mode operation) than those available from a single laser. This paper describes basic methods for analyzing the electrical and optical characteristics of these devices, and discusses problems associated with maintaining a stable operation in a single array mode ('supermode'). Various experimental results are presented and compared with theory.
Katz, Joseph↗
Optically interconnected phased arrays
Phased-array antennas are required for many future NASA missions. They will provide agile electronic beam forming for communications and tracking in the range of 1 to 100 GHz. Such phased arrays are expected to use several hundred GaAs monolithic integrated circuits (MMICs) as transmitting and receiving elements. However, the interconnections of these elements by conventional coaxial cables and waveguides add weight, reduce flexibility, and increase electrical interference. Alternative interconnections based on optical fibers, optical processing, and holography are under evaluation as possible solutions. In this paper, the current status of these techniques is described. Since high-frequency optical components such as photodetectors, lasers, and modulators are key elements in these interconnections, their performance and limitations are discussed.
Bhasin, Kul B.↗