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Electronic circuit for monitoring excessive ripple voltage on dc power lines senses voltage variations from few millivolts to maximum of 10 volts rms. Instrument is used wherever power supply fluctuations might endanger system operations or damage equipment. Device is inexpensive and easily packaged in small chassis.
Many space and some terrestrial applications would benefit from the availability of low-temperature electronics. Exploration missions to the outer planets, Earth-orbiting and deep-space probes, and communications satellites are examples of space applications which operate in low-temperature environments. Space probes deployed near Pluto must operate in temperatures as low as -229 C. Figure 1 depicts the average temperature of a space probe warmed by the sun for various locations throughout the solar system. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. The development of electrical power systems capable of extremely low-temperature operation represents a key element of some advanced space power systems. The Low-Temperature Power Electronics Program at NASA Lewis Research Center focuses on the design, fabrication, and characterization of low-temperature power systems and the development of supporting technologies for low-temperature operations such as dielectric and insulating materials, power components, optoelectronic components, and packaging and integration of devices, components, and systems.
Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.
NASA Lewis Research Center is presently developing a 60 GHz traveling wave tube for satellite cross-link communications. The operating voltage for this new tube is - 20 kV. There is concern about the high voltage insulation system and NASA is planning a space station high voltage experiment that will demonstrate both the 60 GHz communications and high voltage electronics technology. The experiment interfaces, requirements, conceptual design, technology issues and safety issues are determined. A block diagram of the high voltage power supply test facility was generated. It includes the high voltage power supply, the 60 GHz traveling wave tube, the communications package, the antenna package, a high voltage diagnostics package and a command and data processor system. The interfaces with the space station and the attached payload accommodations equipment were determined. A brief description of the different subsystems and a discussion of the technology development needs are presented.
The NMSU Telemetry Center, in collaboration with the NASA Microelectronics Center (MRC) at UNM, has completed a study of the feasibility of building a constraint length 15, rate 1/2 Viterbi Decoder (or BVD) to operate at a rate of 10 Mbps. The BVD, if built, would make TDRSS more accessible to all users, small satellites in particular, by providing an additional 2 dB of link margin, relative to the use of the standard constraint length 7 decoder. The study included the following: review of the 1 Mbps BVD built by the Jet Propulsion Laboratory (JPL), currently the only BVD in existence; development of Specifications for the basic processing unit of the BVD (MRC); analytical Determination of performance of large constraint length convolutional codes; investigation of the impact of processor design on the overall system design; and two feasible packaging technologies, proposed by Cincinnati Electronics of Ohio. It was concluded that while the construction of the BVD is feasible, it will require the most advanced packaging technology currently available, and that the project would be best accomplished in an industrial facility. While the size, complexity, and power requirements of the BVD will be extreme, these will impact only the ground station. The spacecraft will incur a minor change in the encoder design, and the increased coding gain will allow a satellite to operate with a smaller antenna.
From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.
From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.
Spacecraft electronic systems usually demand tight packaging. It was this consideration which initially forced us to consider hybrid circuits for the analog signal processing circuits in the Small Astronomy Satellite-C (SAS-C) scientific payload. We gradually discovered that increased reliability, low power consumption, and reduced program costs all followed. This paper will attempt to share our laboratory's first experience with hybrid circuits and indicate those areas which we found to be important.
Early in the space program, NASA recognized the need to replace bulky coils, compressers, and motors for refrigeration purposes by looking at existing thermoelectric technology. This effort resulted in the development of miniaturized thermoelectric components and packaging to accommodate tight confines of spacecraft. Koolatron's portable electronic refrigerators incorporate this NASA technology. Each of the cooler/warmers employs one or two miniaturized thermoelectric modules. Although each module is only the size of a book of matches, it delivers the cooling power of a 10-pound block of ice. In some models, the cooler can be converted to a warmer. There are no moving parts. The Koolatrons can be plugged into auto cigarette lighters, recreational vehicles, boats or motel outlets.
It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.
This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.
A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.
Miniaturization efforts in new spectrometers for ionosphere/thermosphere investigations of the ion-drifts and neutral winds and corresponding temperatures make possible very light (about 250 g) packages consuming less than 0.4 W. Previously described, our approach measures the angular and energy distributions of neutral atoms and molecules (or ions) in two perpendicular planes; using those distributions to determine the full wind vector, the temperature and the relative densities of O and N2, as required for the ANDE mission. The measurements require two separate electron impact ion sources each with its own electron beam cathode. We have developed a low-temperature thermionic emission cathode that delivers 1 mA electron current at 80 mW power, making it possible to operate neutral wind-temperature experiments for the first time with powers less than 0.5 W. Advances in the ion optics of the energy-angle spectrometer enhance the energy resolution-aperture product more than a factor of 3 to enable energy resolutions of a few percent with large apertures. With these technology improvements it is now possible to obtain the full neutral wind vector, temperature and O/N2, density ratio once per second in a 250g/0.4W package with sensitivity up to about 500 km altitude in the thermosphere. We will describe the WTS as deployed in ANDE and show simulated data with the non-linear least squares analysis to illustrate expected performance of the WTS in the estimated errors in the three components of the wind, the temperature, and the relative densities.
An overview of a self contained Direct Energy Transfer (DET) Power System which was developed to provide power to the Long Duration Exposure Facility (LDEF) Heat Pipe Experiment Package (HEPP) Experiment. A brief synopsis of the flight characteristics of the power system are presented to illustrate the system's capability to function successfully in a low Earth orbit (LEO) space environment. The successful space flight operations of the battery, solar arrays, and power system electronics during the flight period of almost six years (approximately 32,000 LEO cycles) are discussed.
Recent innovations are producing a multitude of advanced commercial satellite communications (COMSATCOM) systems that could deliver massive amounts of SATCOM capacity at a fraction of current cost while also offering reliability and availability that is critical to achieving mission success for orbiting assets. Recognizing the alignment of commercial capabilities with the National Aeronautics and Space Administration's (NASA) diverse mission requirements, the agency is proactively engaging industry to formulate strategies leading towards a NASA communications architecture that includes advanced commercial capabilities. To fully leverage the expanded space resources, NASA must also address the integration of commercial waveforms into its space terminals. In pursuit of similar goals, the United States Department of Defense (DoD) is leading the standardization of the flexible modem interface (FMI) to address service integration for their tactical terminals in pursuit of a DoD Wideband SATCOM Enterprise.This paper describes how NASA is adapting this FMI standard to work with the Space Telecommunications Radio System (STRS) software-defined radio (SDR) framework to address the challenging size, weight, and power resource requirements for terminals in space. A full adaptation would include waveform compatibility with modular baseband processing, frequency compatibility with a wideband front end, and radiated beam control with an electronically steerable antenna to enable multi-provider commercial service capability in a feasible package for space terminals. Security is also a key aspect to be addressed for this integration since data will flow through commercial networks, commercial service providers have their own security mechanisms, and space terminals must be able to securely load proprietary software and firmware needed to access the commercial networks on demand. Success of this effort means commercial partners will be able to allow network-compliant implementations to be hosted on STRS-compliant SDRs in space for reliable and capable network access.
The project team completed work to expand upon American Axle & Manufacturing’s (AAM) baseline technology and develop a high-speed, AC induction electric drive unit (EDU) with total direct-oil-cooling and integrated power electronics. The project accelerated advancements in EDU technology by allowing AAM to build upon the progress made in developing the underlying baseline technologies. The following seven improvements to AAM’s baseline technology were implemented in this research and development program: 1) Increased speed (30k RPM) AC induction motor, 2) Silver-sintering of discrete silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFET) to heat sinks, 3) Electrically insulated rotor bars, 4) Optimized lamination steel, 5) EDU-integrated 650VDC inverter package, 6) Over-molded stator with molded liners, and 7) 650VDC power-dense stator design. The successful development of the technology resulted in a meaningful cost reduction for EDU systems in the market. Coupled with falling battery system costs, lower EDU costs will likely accelerate the market acceptance and related production scaling of battery electric vehicles. The objective of this project was to research, develop, and test a Heavy Rare Earth (HRE)-free 3-In-1 electric drive unit (EDU) that has class leading power density and cost. The key technologies to be developed were anticipated to meet or exceed the Department of Energy (DOE) targets of a cost ≤ $\$$7/kilowatt (kW), power density ≥ 12 kW/liter, and operating voltage ≥ 600 VDC.
The development of electronic devices for use in high temperature environments is addressed. The instrumentational needs of planetary exploration, fossil and nuclear power reactors, turbine engine monitoring, and well logging are defined. Emphasis is place on the fabrication and performance of materials and semiconductor devices, circuits and systems and packaging.
A three-man preprototype Thermoelectric Integrated Membrane Evaporation Subsystem (TIMES) has been developed to provide high quality water recovery from waste fluids on extended duration space flights. In the most recent effort, a number of improvements have been made to simplify subsystem operation and increase performance. These modifications include changes to the hollow fiber membrane evaporator, the condensing section of the thermoelectric heat pump, and the electronic controller logic and display. This paper describes the results of the test program that was conducted to evaluate the implemented improvements. In addition, an advanced design concept is discussed that will provide lower electrical power consumption, greater water production capacity, lower weight, and a smaller package than the present subsystem configuration.