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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

Making Superconducting Welds between Superconducting Wires

A technique for making superconducting joints between wires made of dissimilar superconducting metals has been devised. The technique is especially suitable for fabrication of superconducting circuits needed to support persistent electric currents in electromagnets in diverse cryogenic applications. Examples of such electromagnets include those in nuclear magnetic resonance (NMR) and magnetic resonance imaging (MRI) systems and in superconducting quantum interference devices (SQUIDs). Sometimes, it is desirable to fabricate different parts of a persistent-current-supporting superconducting loop from different metals. For example, a sensory coil in a SQUID might be made of Pb, a Pb/Sn alloy, or a Cu wire plated with Pb/Sn, while the connections to the sensory coil might be made via Nb or Nb/Ti wires. Conventional wire-bonding techniques, including resistance spot welding and pressed contact, are not workable because of large differences between the hardnesses and melting temperatures of the different metals. The present technique is not subject to this limitation. The present technique involves the use (1) of a cheap, miniature, easy-to-operate, capacitor-discharging welding apparatus that has an Nb or Nb/Ti tip and operates with a continuous local flow of gaseous helium and (2) preparation of a joint in a special spark-discharge welding geometry. In a typical application, a piece of Nb foil about 25 m thick is rolled to form a tube, into which is inserted a wire that one seeks to weld to the tube (see figure). The tube can be slightly crimped for mechanical stability. Then a spark weld is made by use of the aforementioned apparatus with energy and time settings chosen to melt a small section of the niobium foil. The energy setting corresponds to the setting of a voltage to which the capacitor is charged. In an experiment, the technique was used to weld an Nb foil to a copper wire coated with a Pb/Sn soft solder, which is superconducting. The joint was evaluated as part of a persistent-current circuit having an inductance of 1 mH. A current was induced in a loop, and no attenuation of the current after a time interval 1,000 s was discernible in a measurement having a fractional accuracy of 10(exp -4): This observation supports the conclusion that the weld had an electrical resistance <10(exp -10) omega.

Penanen, Konstantin I.↗
NASA NTRS1971

Soldering device Patent

Soldering device particularly suited to making high quality wiring joints for aerospace engineering utilizing capillary attraction to regulate flow of solder

Booth, F. W.↗
NASA NTRS2004

Thermally Conductive Metal-Tube/Carbon-Composite Joints

An improved method of fabricating joints between metal and carbon-fiber-based composite materials in lightweight radiators and heat sinks has been devised. Carbon-fiber-based composite materials have been used in such heat-transfer devices because they offer a combination of high thermal conductivity and low mass density. Metal tubes are typically used to carry heat-transfer fluids to and from such heat-transfer devices. The present fabrication method helps to ensure that the joints between the metal tubes and the composite-material parts in such heat-transfer devices have both (1) the relatively high thermal conductances needed for efficient transfer of heat and (2) the flexibility needed to accommodate differences among thermal expansions of dissimilar materials in operation over wide temperature ranges. Techniques used previously to join metal tubes with carbon-fiber-based composite parts have included press fitting and bonding with epoxy. Both of these prior techniques have been found to yield joints characterized by relatively high thermal resistances. The present method involves the use of a solder (63 percent Sn, 37 percent Pb) to form a highly thermally conductive joint between a metal tube and a carbon-fiber-based composite structure. Ordinarily, the large differences among the coefficients of thermal expansion of the metal tube, solder, and carbon-fiber-based composite would cause the solder to pull away from the composite upon post-fabrication cooldown from the molten state. In the present method, the structure of the solder is modified (see figure) to enable it to deform readily to accommodate the differential thermal expansion.

Copeland, Robert J.↗
NASA NTRS1986

Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

Buckley, John D.↗
NASA NTRSDate not supplied

Investigating Laser Beam Welding as an In-Space Joining Technique via Thermal Vacuum and Microgravity and Vacuum Experiments

In-space joining technologies are crucial for stimulating an in-space economy and for enabling sustained space exploration by in-space manufacturing and repair of metallic structures. Compared to brazing or soldering, in-space welding (ISW) can provide highly hermetic, strong, and complex joints, potentially without introducing additional material. However, the influence of extreme temperatures, reduced pressure, and reduced gravity on ISW is not yet fully elucidated. Several efforts at NASA are investigating laser beam welding (LBW) as a joining and repair method in both thermal vacuum (TVAC) and combined vacuum & reduced gravity environments. NASA Marshall Space Flight Center (MSFC) shepherded several ISW projects in its past, including the 1973 electron beam welding on Skylab, the 1989 low-power LBW on parabolic flights, and the unflown 1990s-era In-Space Welding Experiment. Recent parabolic flights and 3 degree-of-freedom ground testing build upon this heritage. A collaboration with the Ohio State University using NASA Langley Research Center (LaRC) hardware retrofitted for LBW achieved the first high-powered laser welds under vacuum and low gravity and developed a workforce capable developing such experimental hardware. A ground testing campaign at the MSFC Flat Floor simulated fit-up and welding representative of ISW in 3 degrees of freedom to emulate microgravity effects on inertial systems. One ongoing effort is a NASA Early Career Initiative project – Lunar Assembly and Servicing by Autonomous Robotics (LASAR). Ruggedized LBW components were developed by an external partner for use in TVAC. A TVAC-rated robotic arm was procured by MSFC and used in the first known robotic laser weld where all components save the laser generator were under vacuum. NASA Johnson Space Center (JSC) is advancing supervised autonomy of ISW. NASA LaRC continues to adapt their unique snowflake joint geometry, suitable for connecting segments in trusses and other structures, to LBW. Upcoming TVAC campaigns will focus on testing extreme temperatures, proving out autonomous operations, and demonstrating weld repair. Weld inspection will occur via a non-contact nondestructive evaluation (NDE) technique – electromagnetic acoustic transduction (EMAT). Another ongoing effort based at MSFC is the DISCMAN -- DIsk-Shaped Configurable and Modular vAcuum uNit – which seeks to development a compact, modular payload that can provide a vacuum environment while in a reduced gravity condition. This payload could support multiple in-space manufacturing developmental efforts, with the first demonstration technology being LBW. Currently, the design is targeting operations in the pressurized volume of a space station, but the payload could readily be adapted to other flight platforms such as parabolic or even suborbital vehicles. LASAR elucidates the effects of temperature and vacuum on LBW while DISCMAN probes those of vacuum and gravity. Through these complementary efforts, NASA is addressing the primary challenges of ISW across the space environment while simultaneously developing and maturing technologies including robotic systems and inspection methodologies for future practical implementation on the Moon and beyond. This approach is timely, as upcoming missions requiring sustained human presence in space will depend on reliable ISW capabilities to create robust metallic joints currently unproven in the space environment and to perform repairs in situ .

hypogravity↗
NASA NTRS1976

Electrical termination techniques

A technical review of high reliability electrical terminations for electronic equipment was made. Seven techniques were selected from this review for further investigation, experimental work, and preliminary testing. From the preliminary test results, four techniques were selected for final testing and evaluation. These four were: (1) induction soldering, (2) wire wrap, (3) percussive arc welding, and (4) resistance welding. Of these four, induction soldering was selected as the best technique in terms of minimizing operator errors, controlling temperature and time, minimizing joint contamination, and ultimately producing a reliable, uniform, and reusable electrical termination.

Oakey, W. E.↗
NASA NTRS2009

Board Saver for Use with Developmental FPGAs

A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.

Berkun, Andrew↗
NASA NTRS1993

(abstract) A Brief, Selective Review of Thermal Cycling Fatigue in Eutectic Tin-Lead Solder

This paper reviews selected parts of the current literature relevant to thermo-mechanical fatigue mechanisms in eutectic tin-lead solder, and suggests a general outline to account for some observed failures. The field is found to be complex. One recent experimental study finds some failure modes to be sensitive to joint geometry. Attempts to extrapolate from test environments to service environments have had only limited success. Much work remains to be done before fatigue failures in this material can be considered as under practical control.

environments↗
NASA NTRS1978

Manufacturing Process Applications Team (MATeam)

The activities of the Manufacturing Process Applications Team concerning the promotion of joint Industry/Federal Agency/NASA funded research and technology operating plan (RTOP) programs are reported. Direct transfers occurred in cutting tools, laser wire stripping, soldering, and portable X-ray unit technology. TROP program funding approval was obtained for the further development of the cutting tool Sialon and development of an automated nondestructive fracture toughness testing system.

Source record↗
NASA NTRS1984

Detecting Defective Solder Bonds

Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.

Paulson, R.↗
NASA NTRS1997

Joining of Silicon Carbide-Based Ceramics by Reaction Forming Method

Recently, there has been a surge of interest in the development and testing of silicon-based ceramics and composite components for a number of aerospace and ground based systems. The designs often require fabrication of complex shaped parts which can be quite expensive. One attractive way of achieving this goal is to build up complex shapes by joining together geometrically simple shapes. However, the joints should have good mechanical strength and environmental stability comparable to the bulk materials. These joints should also be able to maintain their structural integrity at high temperatures. In addition, the joining technique should be practical, reliable, and affordable. Thus, joining has been recognized as one of the enabling technologies for the successful utilization of silicon carbide based ceramic components in high temperature applications. Overviews of various joining techniques, i.e., mechanical fastening, adhesive bonding, welding, brazing, and soldering have been provided in recent publications. The majority of the techniques used today are based on the joining of monolithic ceramics with metals either by diffusion bonding, metal brazing, brazing with oxides and oxynitrides, or diffusion welding. These techniques need either very high temperatures for processing or hot pressing (high pressures). The joints produced by these techniques have different thermal expansion coefficients than the ceramic materials, which creates a stress concentration in the joint area. The use temperatures for these joints are around 700 C. Ceramic joint interlayers have been developed as a means of obtaining high temperature joints. These joint interlayers have been produced via pre-ceramic polymers, in-situ displacement reactions, and reaction bonding techniques. Joints produced by the pre-ceramic polymer approach exhibit a large amounts of porosity and poor mechanical properties. On the other hand, hot pressing or high pressures are needed for in-situ displacement reactions and reaction bonding techniques. Due to the equipment required, these techniques are impractical for joining large or complex shaped components.

Singh, M.↗
NASA NTRS1985

Investigation of Low-temperature Solders for Cryogenic Wind Tunnel Models

The advent of high Reynolds number cryogenic wind tunnels has forced alteration of manufacturing and assembly techniques and eliminated usage of many materials associated with conventional wind tunnel models. One of the techniques affected is soldering. Solder alloys commonly used for wind tunnel models are susceptible to low-temperature embrittlement and phase transformation. The low-temperature performance of several solder alloys is being examined during research and development activities being conducted in support of design and fabrication of cryogenic wind tunnel models. Among the properties examined during these tests are shear strength, surface quality, joint stability, and durability when subjected to dynamic loading. Results of these tests and experiences with recent models are summarized.

Firth, G. C.↗
NASA NTRS1982

Multi-100 kW: Planar low cost solar array development

The applicability of selected low cost options to solar array blanket design was studied by fabricating representative modules and submitting them to thermal cycle environment. Large area (5.9 x 5.9 cm) solar cells of 3 varieties were purchased: (1) Standard wraparound, (2) Copper contacts substituted for the conventional Titanium-Palladium-Silver, and (3) Standard wraparound except with gridded back contact instead of continuous metallization. The baseline cell was purchased to compare fabrication cost and to serve as a control cell during test evaluation of the other two cells. All cells were assembled into either substrate modules where the cell is individually filtered and welded to an integrated Kapton-copper circuit or into a superstrate configuration with 4 cells jointly adhered to a single sheet of microsheet and then welded to the integrated Kapton-copper circuit. Cell quality, particularly in the metallization of contacts, was less than desired. Problems were encountered with copper metallization in laying down a barrier metal which would ohmically bond to the silicon. The cells received were shunted (sintered) or with low contact pull strength (non-sintered), thus leading to the decision to solder rather than weld the copper cells to the Kapton substrate.

Source record↗
NASA NTRS2019

Quick-Replacement High-Temperature Superconducting Current Leads for Use in a Research Cryostat

We report the use of a series of high-temperature superconducting leads in a cryostat that require no soldering to replace in the event of a failed lead. The temperature range spanned by the leads is 50 to 3 degrees Kelvin and they typically carry currents up to 4 amperes although they have a much higher capacity in this temperature range. The leads are integrated into the cryostat by clamping both ends to gold-plated copper pads. Support of the leads over the 25-centimeter length is provided by a simple G10 strong back. Details of the clamping interface, measurements of joint resistances, and other interesting observations will be discussed.

Superconductivity↗
NASA NTRS1985

Welding, Bonding and Fastening, 1984

A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Soceity, and Society of Manufacturing Engineers conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

Buckley, J. D.↗
NASA NTRS2006

Robust Joining and Integration Technologies for Advanced Metallic, Ceramic, and Composite Systems

Robust integration and assembly technologies are critical for the successful implementation of advanced metallic, ceramic, carbon-carbon, and ceramic matrix composite components in a wide variety of aerospace, space exploration, and ground based systems. Typically, the operating temperature of these components varies from few hundred to few thousand Kelvin with different working times (few minutes to years). The wide ranging system performance requirements necessitate the use of different integration technologies which includes adhesive bonding, low temperature soldering, active metal brazing, diffusion bonding, ARCJoinT, and ultra high temperature joining technologies. In this presentation, a number of joining examples and test results will be provided related to the adhesive bonding and active metal brazing of titanium to C/C composites, diffusion bonding of silicon carbide to silicon carbide using titanium interlayer, titanium and hastelloy brazing to silicon carbide matrix composites, and ARCJoinT joining of SiC ceramics and SiC matrix composites. Various issues in the joining of metal-ceramic systems including thermal expansion mismatch and resulting residual stresses generated during joining will be discussed. In addition, joint design and testing issues for a wide variety of joints will be presented.

Singh, M.↗
NASA NTRS2019

Lunar Glovebox Balance with Wireless Technology

The most important equipment required for processing lunar samples is a high-quality mass balance for maintaining accurate weight inventory, security, and scientific study. After careful review, a Curation Office memo by Michael Duke in 1978 chose the Mettler PL200 to be used for sample weight measurements inside the gloveboxes (Fig. 3). These commercial off-the-shelf (COTS) balances did not meet the strict accepted material requirements in the Lunar lab. As a result, each balance housing, weighing pan, and wiring was custom retrofitted to meet Lunar Operating Procedure (LOP) 54 requirements [for material construction restrictions]. The original design drawings for the custom housings, readout support stands, and wiring were done by the JSC engineering directorate. The 1977- 1978 schematics, drawings, and files are now housed in the curation Data Center. Per the design specifications, the housing was fabricated from aluminum grade 6061 T6, seamless welds, and anodized per MIL-A-8625 type I, class I. The balance feet were TFE Teflon and any required joints were sealed with Viton A gaskets. The readout display and support stands outside the glovebox were fabricated from 300 series stainless steel with #4 finish and mounted to the glovebox with welded bolts. Wire harnesses that linked the balance with the outside display and power were encapsulated with TFE Teflon and transported through custom Deutsch wire bulk head pass-through systems from inside to outside the glovebox. These Deutsch connectors were custom fabricated with 316L stainless steel bodies, Viton A O-rings, aluminum 6061 with electroless nickel plating, Teflon (replacing the silicone), and gold crimp connectors (no soldering). Many of the Deutsch connectors may have been used in the Apollo program high vacuum complex in building 37 and date to about 1968 to 1970.

Zeigler, Ryan A.↗