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At least 163 records · Page 9

Low-temperature bonding of temperature-resistant electronic connections

Bonding of flat metal surfaces utilizes low temperature melting intermediate material, pulse heating, and pressure application to produce strong, electrically conductive bond resistant to melting at temperatures well above melting point of intermediate material. Little or no intermediate material remains at the interface.

Peluso, R. F.↗

Design and performance characteristics of the Vertical Temperature Profile Radiometer /VTPR/ for atmospheric temperature soundings.

Description of the design and operation of a radiometer which derives atmospheric temperature profiles on the basis of spectral measurements in eight optical filter channels. The radiometer achieves its eight-channel capability by sequentially viewing the eight optical filters mounted in a rotating filter wheel, with a single IR detector and electronic amplification channel processing the signal for all the filters. The advantages and disadvantages of this sequential approach as compared to eight 'parallel' radiometric channels are discussed. The proposed radiometer provides a relative calibration accuracy between seven out of the eight channels of better than 0.1% rms of the full dynamic range. The absolute accuracy achievable between in-flight calibrations of six minutes, or between two-hour calibrations using optical temperature correction factors, is better than an rms value of 0.15% of full scale. The radiometric correlation between the in-flight calibration source of the instrument and a reference standard blackbody is better than an rms value of 0.5% of full scale.

Falbel, G.↗

Design and performance characteristics of the vertical temperature profile radiometer /VTPR/ for atmospheric temperature soundings

Various design characteristics and performance achievements of the vertical temperature profile radiometer (VTPR) are discussed. It is shown that the VTPR provides a relative calibration accuracy of better than 0.1% rms of the full dynamic range and has been operating successfully in space on the ITOS spacecraft for more than eleven months. The absolute accuracy achievable between in-flight calibrations of 6 minutes, or between 2-hour calibrations using optical temperature correction factors, is better than an rms value of 0.15% of full scale. The radiometric correlation between the VTPR in-flight calibration source and a reference standard blackbody is better than an rms value of 0.5% of full scale.

Falbel, G.↗

Temperature dependence of electrical conductivity and lunar temperatures

Metallic conduction mechanicsms are probably not important in lunar materials because of the small amounts of free metal and metallic oxides present. This is confirmed by the extremely low conductivities measured to date and the fact that the conductivity increases with temperature. The major conduction mechanicsm appears to be ionic. This conduction mechanism is very strongly controlled by temperature, by deviations from stoichiometry, by electric field strengths, and by oxygen fugacity.

Olhoeft, G. R.↗

The brightness temperature of a half-space random medium with nonuniform temperature profile

The problem of microwave thermal emission from a half-space random medium is solved. We consider a laminar structure which has a nonuniform temperature distribution in the vertical direction. A radiative transfer approach is applied. For constant absorption and scattering coefficients, the brightness temperature is determined by a simple closed-form formula. Physical interpretations and numerical results are illustrated and discussed for the various cases.

Tsang, L.↗

Effect of temperature on the electronic instability and the crystalline phase change at low temperature of V3Si type compounds

Equations assuming a Jahn-Teller type effect for the d band electrons in V3Si compounds are given, and the results of free-energy change calculations by using some approximations based on these equations are depicted. The tetragonal structure is converted to cubic as the temperature rises past T sub m which is calculated as 13 K. by the Batterman-Barrett method and is measured to be 20-5 K. Other parameters such as change of C sub p with temperature are predicted better.

Labbe, J.↗

Room-temperature adhesive for high-temperature use

PPQ (polyphenylquinoxaline) cures at room temperature, but withstands temperatures between -186 and +402 deg C. Adhesive is applied in chloroform solution. Bond forms as solvent evaporates.

Brooks, J. L.↗

A comparison of high-temperature flare models with observations and implications for the low-temperature flare

EUV data from the Harvard College Observatory and Naval Research Laboratory instruments on board the Skylab Apollo telescope mount, together with SOLRAD 9 X-ray data, are analyzed in order to empirically deduce the variation of emission measure with temperature in the atmosphere of a number of solar flares. A 'mean' differential emission measure profile Q(T) for a flare is constructed which is then compared with the profile predicted by a number of theoretical models. It is found that realistic flare models must include both conductive and radiative terms in the energy equation, and that hydrodynamic terms may be important at low temperatures. The implications of the results obtained are discussed for flare models in general and it is shown that the inclusion of the conductive term into models which have hitherto neglected it can perhaps resolve some of the observational difficulties with such models.

Machado, M. E.↗

Fracture temperature and flaw growth in nitronic 40 at cryogenic temperatures

The fracture resistance and fatigue response of Armco Nitronic 40 austenitic stainless steel were evaluated under cryogenic conditions. Tensile, fracture toughness and fatigue crack growth properties were measured at -275 F. The tensile yield strength was approximately 120 ksi and the fracture toughness was estimated to be 350 ksi-in /2 on the basis of fracture toughness measurements. Testing was conducted to evaluate the behavior of a simulated section of the wing of the Pathfinder 1 model subject to a load and temperature history typical of that for testing in the National Transonic Facility. The wing section model incorporated a proposed brazing technique for pressure-transducer attachment. The simulated wing section performed satisfactorily at stress levels of nearly 60 percent of the material yield strength. The brazing technique proved to be an effective method of transducer attachment under conditions of high stress levels and large temperature excursions.

Domack, M. S.↗

Structure-to-glass transition temperature relationships in high temperature stable condensation polyimides

The presence of a hexafluoroisopropylidene (6F) connecting group in aryl dianhydrides used to prepare aromatic condensation polyimides provides high glass transition temperature (T sub g) polyimides with excellent thermo-oxidative stability. The purpose of this study was to determine if a trifluorophenyl-ethylidene (3F) connecting group would have a similar effect on the T sub g of aromatic condensation polyimides. A new dianhydride containing the 3F connecting group was synthesized. This dianhydride and an aromatic diamine also containing the 3F connecting group were used together and in various combinations with known diamines or known dianhydrides, respectively, to prepare new 3F containing condensation polyimides. Known polyimides, including some with the 6F connecting linkage, were also prepared for comparison purposes. The new 3F containing polymers and the comparison polymers were prepared by condensation polymerization via the traditional amic-acid polymerization method in N,N-dimethylacetamide solvent. The solutions were characterized by determining their inherent viscosities and then were thermally converted into polyimide films under nitrogen atmosphere at 300 to 500 C, usually 350 C. The T sub g's of the films and resin discs were then determined by thermomechanical analysis and were correlated as a function of the final processing temperatures of the films and resin discs. The results showed that similarities existed in the T sub g's depending on the nature of the connecting linkage in the monomers used to prepare the condensation polyimides.

Alston, W. B.↗