Design for Testability in 3-Dimensional Assemblies
3DANN, a 3D mixed-mode multiple IC stacked processor capable of 1 TeraOPS, presented many novel problems related to testability.
3D stacking design for test↗
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Evaluation of 3D Plus Packaging Test Structures for NASA Goddard Space Flight Center
Environmental tests were performed on packaging test structures designed and manufactured for ESA and CNES by 3D PLus ELectronics. The design provided circuit elements that acted as thermal, mechanical and moisture sensors. Other design features showed the compatibility of the packaging with chip passives, bare electronic dice and plastic encapsulated microcircuits packaged together in an innovative, stacked multichip module. The NASA GSFC testing augmented long duration testing on the same units carried out by ESA and CNES. The NASA portion demonstrated packaging stability over temperature, in moisture, with voltage stress, in shock and in vibration environments.
Plante, Jeannette↗
Extra high speed modified Lundell alternator parameters and open/short-circuit characteristics from global 3D-FE magnetic field solutions
The combined magnetic vector potential - magnetic scalar potential method of computation of 3D magnetic fields by finite elements, introduced in a companion paper, is used for global 3D field analysis and machine performance computations under open-circuit and short-circuit conditions for an example 14.3 kVA modified Lundell alternator, whose magnetic field is of intrinsic 3D nature. The computed voltages and currents under these machine test conditions were verified and found to be in very good agreement with corresponding test data. Results of use of this modelling and computation method in the study of a design alteration example, in which the stator stack length of the example alternator is stretched in order to increase voltage and volt-ampere rating, are given here. These results demonstrate the inadequacy of conventional 2D-based design concepts and the imperative of use of this type of 3D magnetic field modelling in the design and investigation of such machines.
Wang, R.↗
Evaluation of 3D Inverse Code Using Rotor 67 as Test Case
A design modification of Rotor 67 is carried out with a full 3D inverse method. The blade camber surface is modified to produce a prescribed pressure loading distribution, with the blade tangential thickness distribution and the blade stacking line at midchord kept the same as the original Rotor 67 design. Because of the inviscid-flow assumption used in the current version of the method, Rotor 67 geometry is modified for use at a design point different from the original design value. A parametric study with the prescribed pressure loading distribution yields the following results. In the subsonic section, smooth pressure loading shapes generally produce blades with well-behaved blade surface pressure distributions. In the supersonic section, the study shows that the strength and position of the passage shock correlate with the characteristics of the blade pressure loading shape. In general, "smooth" prescribed blade pressure loading distributions generate blade designs with reverse cambers which have the effect of weakening the passage shock.
Dang, T.↗
Design, Prototyping, and Testing of a Novel Flowpath with an Array of Six 3D Matrix Vitvo Bioreactors for the NASA Bioculture System
The NASA Bioculture System is an advanced cell culture closed-loop system containing highly automated flowpaths designed to conduct long term biology experiments on ISS with earth remote controllable medium flow, temperature, gas composition, medium exchange, cell sampling and fixation. This technology was already demonstrated with successful cardiomyocyte and osteocyte cultures experiments onboard the ISS and is now supporting NASA PI science. The Bioculture System, however, can only support 10 cassettes with disposable flowpaths, each containing a single hollow fiber bioreactor with a culture capacity of about 2ml. This constraint not only severely limits the number of investigators that can conduct experiments in space, but also subjects the experiments to limitations in the number of replicates and conditions that can be studied. To address these limitations, we sought a novel design solution to maximize the number of separate bioreactor cultures and volume that can be conducted simultaneously. To this end we designed, prototyped, and are now testing a six-Vitvo 3D Matrix 2ml bioreactor insert that replaces the conventional Bioculture System hollow fiber bioreactor. This design will allow the Bioculture System to support up to 60 different bioreactors and samples at once. Specifically, the novel gas-tight containment housing insert contains six COTS Rigenerand VITVO bioreactors stacked on each side of a heat sink powered by the existing heating element and pair of temperature sensors. Medium will be distributed into each bioreactor's cell-free chamber via its built-in Luer connector, then across the 3D matrix to the cell chamber, dissipating laminar flow and limiting fluid shear stresses that might mechanostimulate cell cultures. Gas (5% CO2 in air) will be supplied directly to the bioreactor gas-tight housing for exchange via the bioreactor flat-surface gas-permeable membranes, eliminating the need for the existing Bioculture System cassette oxygenator. If successfully implemented on ISS, this new multi-bioreactor insert for the Bioculture System has the potential to make real-time cell science experimentation in space more efficient and accessible to more investigators.
Ma, Kristin R.↗
Cohesive Elements for Shells
A cohesive element for shell analysis is presented. The element can be used to simulate the initiation and growth of delaminations between stacked, non-coincident layers of shell elements. The procedure to construct the element accounts for the thickness offset by applying the kinematic relations of shell deformation to transform the stiffness and internal force of a zero-thickness cohesive element such that interfacial continuity between the layers is enforced. The procedure is demonstrated by simulating the response and failure of the Mixed Mode Bending test and a skin-stiffener debond specimen. In addition, it is shown that stacks of shell elements can be used to create effective models to predict the inplane and delamination failure modes of thick components. The results indicate that simple shell models can retain many of the necessary predictive attributes of much more complex 3D models while providing the computational efficiency that is necessary for design.
Davila, Carlos G.↗
Effective Simulation of Delamination in Aeronautical Structures Using Shells and Cohesive Elements
A cohesive element for shell analysis is presented. The element can be used to simulate the initiation and growth of delaminations between stacked, non-coincident layers of shell elements. The procedure to construct the element accounts for the thickness offset by applying the kinematic relations of shell deformation to transform the stiffness and internal force of a zero-thickness cohesive element such that interfacial continuity between the layers is enforced. The procedure is demonstrated by simulating the response and failure of the Mixed Mode Bending test and a skin-stiffener debond specimen. In addition, it is shown that stacks of shell elements can be used to create effective models to predict the inplane and delamination failure modes of thick components. The results indicate that simple shell models can retain many of the necessary predictive attributes of much more complex 3D models while providing the computational efficiency that is necessary for design.
Davila, Carlos G.↗
Command and Data Handling Branch Internship
Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.
Billings, Rachel Mae↗
Ristra Project FY23 L2 Milestone Report, Rev.1: MRT #8541: Multiphysics Scaling on EAS-3
The findings of this report were used to close out the ATDM milestone MRT# 8541, which was designed to demonstrate readiness of ATDM multiphysics codes for mission-relevant work on ATS-4, El Capitan. To this end, the closure criteria were to run a 3D shaped charge problem at scale up to 50% of the El Capitan early-access system, RZVernal (AMD Trento CPUs and AMD MI-250X GPUs), demonstrate scalability, and document challenges with the software stack and environment. LANL’s approach to this milestone was to test our modular software capability by developing an entirely new code, Moya, built upon our FleCSI framework. The physics capability and the GPU infrastructure needed for the shaped charge problem on GPUs was added to Moya, and the required calculations were performed at scale. Moya showed good scaling without any fine-tuning of GPU kernels; there is still significant room for performance enhancements, especially for the Legion backend. Tied up in this L2 milestone was a closeout of KPP-3s for the ECP ST Projects at LANL; this material will be covered in a separate document.
97 MATHEMATICS AND COMPUTING↗
Windform® XT 2.0 Use as 3U CubeSat Primary Structure
CubeSats provide a platform for small-scale space research and technology demonstration at reduced complexity, cost, and development time. These advantages drove the NASA Langley Research Center (LaRC) to develop and launch the GPX2 3U CubeSat to explore the viability of using Commercial Off-The-Shelf (COTS) differential GPS (dGPS) in low earth orbit. To reduce manufacturing costs and increase design flexibility, the project chose additive manufactured Windform® XT 2.0 as the primary bus material rather than traditional subtractive manufactured (milled) metal. The bus is a two-part, Selective Laser Sintered, 3D-print structure consisting of a single-piece, five-walled chassis and single-walled cover. The bus was specially designed to allow the project to accommodate the payload electronics stack as well as antennas, receivers, and deployable mechanisms. By using an additive manufactured solution, LaRC was able to design in features unrealizable through traditional milling, with a lead-time of roughly two weeks. In comparison, traditional subtractive manufacturing limits geometry options due to toolpath reach and bus construction would have required multiple components for each wall. This would have resulted in a more costly, longer lead-time article with more joints, fasteners, and complexity with a commensurate increase in overall mass. A number of lessons-learned were captured during the design, analysis, and testing of the GPX2 CubeSat covering thermal and structural analysis, vibration modeling, and geometric tolerancing. Additionally, a variety of material testing and verification were performed before and during spacecraft design and integration to assure the suitability of Windform® XT 2.0 for the launch and mission environments. This article provides the highlights of designing and testing the GPX2 bus.
CubeSat↗
NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology
Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.
3D packaging↗
Additive Manufacturing of SiC Based Ceramics and Ceramic Matrix Composites
Silicon carbide (SiC) ceramics and SiC fiber reinforcedSiC ceramic matrix composites (SiCSiC CMCs) offer high payoff as replacements for metals in turbine engine applications due to their lighter weight, higher temperature capability, and lower cooling requirements. Additive manufacturing approaches can offer game changing technologies for the quick and low cost fabrication of parts with much greater design freedom and geometric complexity. Four approaches for developing these materials are presented. The first two utilize low cost 3D printers. The first uses pre-ceramic pastes developed as feed materials which are converted to SiC after firing. The second uses wood containing filament to print a carbonaceous preform which is infiltrated with a pre-ceramic polymer and converted to SiC. The other two approaches pursue the AM of CMCs. The first is binder jet SiC powder processing in collaboration with rp+m (Rapid Prototyping+Manufacturing). Processing optimization was pursued through SiC powder blending, infiltration with and without SiC nano powder loading, and integration of nanofibers into the powder bed. The second approach was laminated object manufacturing (LOM) in which fiber prepregs and laminates are cut to shape by a laser and stacked to form the desired part. Scanning electron microscopy was conducted on materials from all approaches with select approaches also characterized with XRD, TGA, and bend testing.
3-D printing↗
NASA Tech Briefs, January 2011
The topics include: 1) Distributed Aerodynamic Sensing and Processing Toolbox; 2) Collaborative Supervised Learning for Sensor Networks; 3) Hazard Detection Software for Lunar Landing; 4) Onboard Nonlinear Engine Sensor and Component Fault Diagnosis and Isolation Scheme; 5) Network-Capable Application Process and Wireless Intelligent Sensors for ISHM; 6) Interface Supports Multiple Broadcast Transceivers for Flight Applications; 7) FPGA Sequencer for Radar Altimeter Applications; 8) Miniature Sapphire Acoustic Resonator - MSAR; 9) Process-Hardened, Multi-Analyte Sensor for Characterizing Rocket Plume Constituents; 10) SAD5 Stereo Correlation Line-Striping in an FPGA; 11) Hybrid Composite Cryogenic Tank Structure; 12) Nanoscale Deformable Optics; 13) Reliability-Based Design Optimization of a Composite Airframe Component; 14) Zinc Oxide Nanowire Interphase for Enhanced Lightweight Polymer Fiber Composites; 15) Plasma Igniter for Reliable Ignition of Combustion in Rocket Engines; 16) Wire Test Grip Fixture; 17) A Sub-Hertz, Low-Frequency Vibration Isolation Platform; 18) Carbon Nanofibers Synthesized on Selective Substrates for Nonvolatile Memory and 3D Electronics; 19) Nanoparticle/Polymer Nanocomposite Bond Coat or Coating; 20) High-Resolution Wind Measurements for Offshore Wind Energy Development; 21) Spring Tire; 22) Marsviewer 2008; 23) Mission Services Evolution Center Message Bus; 24) Major Constituents Analysis for the Vehicle Cabin Atmosphere Monitor; 25) Astronaut Health Participant Summary Application; 26) Adaption of the AMDIS Method to Flight Status on the VCAM Instrument; 27) Natural Language Interface for Safety Certification of Safety-Critical Software; 28) Cryogenic Caging for Science Instrumentation; 29) Wide-Range Neutron Detector for Space Nuclear Applications; 30) In Situ Guided Wave Structural Health Monitoring System; 31) Multiplexed Energy Coupler for Rotating Equipment; 32) Attitude Estimation in Fractionated Spacecraft Cluster Systems; 33) Full Piezoelectric Multilayer-Stacked Hybrid Actuation/Transduction Systems; 34) Active Flow Effectors for Noise and Separation Control; 35) Method and System for Temporal Filtering in Video Compression Systems; 36) Apparatus for Measuring Total Emissivity of Small, Low-Emissivity Samples; 37) Multiple-Zone Diffractive Optic Element for Laser Ranging Applications; 38) Simplified Architecture for Precise Aiming of a Deep-Space Communication Laser Transceiver; 39) Two-Photon-Absorption Scheme for Optical Beam Tracking; 40) High-Sensitivity, Broad-Range Vacuum Gauge Using Nanotubes for Micromachined Cavities; 41) Wide-Field Optic for Autonomous Acquisition of Laser Link; 42) Extracting Zero-Gravity Surface Figure of a Mirror; 43) Modeling Electromagnetic Scattering From Complex Inhomogeneous Objects; 44) Visual Object Recognition and Tracking of Tools; 45) Method for Implementing Optical Phase Adjustment; 46) Visual SLAM Using Variance Grid Maps; 47) Rapid Calculation of Spacecraft Trajectories Using Efficient Taylor Series Integration; 48) Efficient Kriging Algorithms; 49) Predicting Spacecraft Trajectories by the WeavEncke Method; 50) An Augmentation of G-Guidance Algorithms; 51) Comparison of Aircraft Icing Growth Assessment Software; 52) Silicon-Germanium Voltage-Controlled Oscillator at 105 GHz; 53) Estimation of Coriolis Force and Torque Acting on Ares-1; 54) Null Lens Assembly for X-Ray Mirror Segments; and 55) High-Precision Pulse Generator.
Source record↗
Chromium enhances the mechanical performance of 3d transition metal high entropy alloys
A comprehensive examination of the compositional effects on the deformation behavior of high entropy alloys (HEAs) was conducted through nanoindentation, indentation creep, and stress relaxation experiments at ambient temperature. The alloys investigated included NiCoFe, NiCoCr, NiCoCrFe, and NiCoCrFeMn, all of which underwent identical thermomechanical processing. From the experimental results, NiCoCr exhibited the highest maximum shear stress for dislocation nucleation (13 GPa) and nanoindentation hardness (3.8 GPa) among the alloys tested. It also showed the lowest stress sensitivity (0.02) and activation volume (3–4 b 3 ) under creep and stress relaxation conditions, indicative of its superior plastic flow properties. Density functional theory (DFT) calculations further revealed an uneven charge density and larger bonding-length variation in NiCoCr due to the presence of Cr, which increased lattice distortion, impeding dislocation movement. Furthermore, in this study, post-deformation microscopy using transmission electron microscopy (TEM) revealed a high density of stacking faults and twins in NiCoCr that effectively enhanced its creep strength. The results highlight the significance of specific elemental effects, particularly from Cr in this study, over configurational entropy effect (i.e., compositional complexity) in governing the deformation microstructure and mechanical properties of HEAs. Finally, these insights will be instrumental for the design and optimization of advanced alloys for load-bearing applications.
36 - MATERIALS SCIENCE↗
CubeSub
This presentation introduces and discusses the development of the CubeSub submersible concept, an Autonomous Underwater Vehicle (AUV) designed around the CubeSat satellite form factor. The presented work is part of the author's MSc thesis in Aerospace Engineering at the Royal Institute of Technology, Stockholm, Sweden, and was performed during an internship at the Mission Design Division of the NASA Ames Research Center, Moffett Field, CA. Still in the early stages of its development, the CubeSub is to become a submersible test-bed for technology qualified for underwater and space environments. With the long-term goal of exploring the underwater environments in outer space, such as the alleged subsurface ocean of Jupiter's moon Europa, a number of technology and operational procedures must be developed and matured. To assist in this, the CubeSub platform is introduced as a tool to allow engineers and scientists to easily test qualified technology underwater. A CubeSat is a class of miniaturized satellite built to a standardized size. The base size is 1U (U for unit), corresponding to a 100 x 100 x 113.5 cu mm cube. A 1U CubeSat can in other words easily be held in one hand. Stacking units give larger satellite sizes such as the also commonly used 1.5U, 2U and 3U. The CubeSat standard is in itself already well established and hundreds of CubeSats have to date been launched into space. Compatible technology is readily available and the know-how exists in the space industry, all of which makes it a firm ground to stand on for the CubeSub. The rationale behind using the CubeSat form factor is to make use of this pre-existing foundation, making the CubeSub easy to develop, modular and readily available. It will thereby aid in the process of maturing the concept of a fully space qualified submersible headed for outer space. As a further clarification, the CubeSub is itself not meant for outer space, but to facilitate development of such a vessel. Along with its uses as a testbed, the CubeSub also holds the potential to become a useful tool for exploration and experimentation here on Earth. A highly standardized system utilizing well-known hardware can reduce the cost and required work load for researchers wishing to perform experiments and exploration. Users could design sensors and experiments to comply with the already well established CubeSat standard, which are then carried by the CubeSub to the region of interest. This in turn means that the end users can focus more on formulating the experiment itself and less about how to get it where they want it. The CubeSub is designed to be built up by modules, which can be assembled in different configurations to fulfill different needs. Each module will be powered individually and intermodular communication will be wireless, removing the need for wiring. The inside of the cylindrical hull will be flooded with ambient water to enhance the interaction between payloads and surrounding environment. The overall torpedo-like shape is similar to that of a conventional AUV, slender and smooth. This is to make for a low drag, reduce the risk of snagging on surrounding objects and make it possible to deploy through an ice sheet via a narrow borehole or navigate in tight areas. To keep costs low and further accelerate development, rapid prototyping is utilized wherever possible. Full-scale prototypes are being constructed through 3D-printing and using COTS (Commercial Off-The-Shelf) components. 3D-printing is used both for the largest hull components and the relatively small and delicate propellers. Arduino boards are used for control and internal communication
AUV↗