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Method employing a pressure chamber is used for dicing semiconductor single-crystal wafers, containing integrated circuits, into small chips along pre-scribed lines. Uniform bending of the scribed wafer over the convex surface of a perforated hemisphere, breaks it cleanly into individual chips without damaging the circuits.
"Climate dice", describing the chance of unusually warm or cool seasons, have become more and more "loaded" in the past 30 years, coincident with rapid global warming. The distribution of seasonal mean temperature anomalies has shifted toward higher temperatures and the range of anomalies has increased. An important change is the emergence of a category of summertime extremely hot outliers, more than three standard deviations (3 sigma) warmer than the climatology of the 1951-1980 base period. This hot extreme, which covered much less than 1% of Earth's surface during the base period, now typically covers about 10% of the land area. It follows that we can state, with a high degree of confidence, that extreme anomalies such as those in Texas and Oklahoma in 2011 and Moscow in 2010 were a consequence of global warming, because their likelihood in the absence of global warming was exceedingly small. We discuss practical implications of this substantial, growing, climate change.
The Diurnal Land-Atmosphere Coupling Experiment (DICE) aims to explore the complex interactions between the land surface and atmospheric boundary layer, which are generally not well understood and difficult to isolate in models. The project involves over 10 different models, combining expertise from both land surface and atmospheric boundary-layer modelling groups. A simple three-stage methodology is designed to assess land-atmosphere feedbacks. Stage 1: the individual components are assessed in isolation, driven and evaluated against observational data; stage 2: the impact of coupling is investigated; stage 3: the sensitivity of the stand-alone models to variations in driving data is explored. For this initial study, a three-day clear-sky period in the mid-west USA over, an assumed simple, predominantly grass surface was simulated using data from the CASES-99 field campaign. Key conclusions from the study include: (1) the memory of vegetation state within Land Surface Models (LSMs) needs attention; (2) the height of atmospheric forcing for LSMs is important, particularly for the nocturnal boundary layer, and this has implications for both observations and vertical resolution for atmospheric models; (3) land-atmosphere feedbacks reduce errors in simulated surface fluxes at the expense of the accuracy of the variables that the models are designed to simulate (e.g., temperature, humidity and wind speed); (4) problems remain in representing the stable boundary layer in atmospheric models; (5) the mixing of temperature and humidity within the boundary layer may need to be represented separately; (6) differences in daytime profiles of heat, moisture and momentum between models are mainly due to the way the models erode the inversion at the top of the boundary layer, rather than differences in the surface fluxes. Resultant variations in modelled boundary layer heights have a substantial impact on relative humidity and could partially explain variations in coupling strength between models in the GLACE experiment.
Orbital evolutions of about 160 short-period (SP) comets are numerically integrated for 4400 years in the framework of a realistic dynamical model. By the round-trip error in closure test, a reliable time space of the integrated orbits is estimated for each comet. Majority of the SP comets with their Tisserand's constant(J) between 2.8 and 3.1 are found to evolve within the past 1000-2000 years from the orbits whose perihelia are near the Jovian orbit to the orbits with perihelia of 1-2 AU. This evolution is much more rapid than that expected from Monte Carlo simulations based on symmetric distribution of planetary perturbations, thus suggesting that asymmetry of perturbation distribution play an important role in cometary evolution. Several comets are shown to evolve from the near-Saturn orbits and then to be handed over under the control of Jupiter. We also find that a few comets were captured from long-period orbits (a = 75-125 AU) via only a few close encounters with Jupiter. It is confirmed that the captured SP comets of low-inclination with 2.7 less than J less than 3.1 show more or less strong chaotic behavior. On the other hand, comets with longer orbital period and/or of high inclination reveal slow or quasi-periodic orbital evolution.
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A jointly funded (NASA/FAA) real-time simulation study was conducted at NASA Langley Research Center to gather comparative performance data among three candidate final-approach spacing aid (FASA) display formats. Several objective measures of controller performance and their display eye-scan behavior as well as subjective workload and rating questionnaires were used. For each of two representative pattern-speed procedures (a 170-knot procedure and a 210-knot procedure with speed control aiding), data were gathered, via twelve FAA controllers, using four final-controller display format conditions (manual/ARTS 3, graphic marker, DICE countdown, and centerline slot marker). Measured runway separations were more precise with both the graphic marker and DICE countdown formats than with the centerline slot marker and both (graphic and DICE) improved precision relative to the manual/ARTS 3 format. For three separate rating criteria, the subject controllers ranked the FASA formats in the same order: graphic marker, DICE countdown, and centerline slot marker. The increased precision measured with the 210-knot pattern-speed procedure may indicate the potential for the application of speed-control aiding where higher pattern speeds are practical after the base-to-final turn. Also presented are key FASA issues, a rationale for the formats selected for testing, and their description.
Funded by the NSF CubeSat and NASA ELaNa programs, the Dynamic Ionosphere CubeSat Experiment (DICE) mission consists of two 1.5U (1.5 Unit) CubeSats which were launched into an eccentric low Earth orbit on October 28, 2011. Each identical spacecraft carries two Langmuir probes to measure ionospheric in-situ plasma densities, electric field probes to measure in-situ DC and AC electric fields, and a science grade magnetometer to measure in-situ DC and AC magnetic fields. Given the tight integration of these multiple sensors with the CubeSat platforms, each of the DICE spacecraft is effectively a sensor-sat capable of comprehensive ionospheric diagnostics. The use of two identical sensor-sats at slightly different orbiting velocities in nearly identical orbits permits the deconvolution of spatial and temporal ambiguities in the observations of the ionosphere from a moving platform. In addition to demonstrating nanosat-based constellation science, the DICE mission is advancing a number of groundbreaking CubeSat technologies including miniaturized mechanisms and high-speed downlink communications.
Developments which will reduce the costs associated with the distribution of satellite services are considered with emphasis on digital communication link implementation. A digitally implemented communications experiment (DICE) which demonstrates the flexibility and efficiency of digital transmission of television video and audio, telephone voice, and high-bit-rate data is described. The utilization of the DICE system in a full duplex teleconferencing mode is addressed. Demonstration teleconferencing results obtained during the conduct of two sessions of the 7th AIAA Communication Satellite Systems Conference are discussed. Finally, the results of link characterization tests conducted to determine (1) relationships between the Hermes channel 1 EIRP and DICE model performance and (2) channel spacing criteria for acceptable multichannel operation, are presented.
The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.
Magnetite is a common conductive mineral found on Earth and Mars. Disk-shaped precipitates approximately 40 nm in diameter have been shown to have manganese and aluminum concentrations. Atom-probe field-ion microscopy (APFIM) is the only technique that can potentially quantify the composition of these precipitates. APFIM will be used to characterize geological and planetary materials, analyze samples of interest for geomicrobiology; and, for the metrology of nanoscale instrumentation. Prior to APFIM sample preparation was conducted by electropolishing, the method of sharp shards (MSS), or Bosch process (deep reactive ion etching) with focused ion beam (FIB) milling as a final step. However, new methods are required for difficult samples. Many materials are not easily fabricated using electropolishing, MSS, or the Bosch process, FIB milling is slow and expensive, and wet chemistry and the reactive ion etching are typically limited to Si and other semiconductors. APFIM sample preparation using the dicing saw is commonly used to section semiconductor wafers into individual devices following manufacture. The dicing saw is a time-effective method for preparing high aspect ratio posts of poorly conducting materials. Femtosecond laser micromachining is also suitable for preparation of posts. FIB time required is reduced by about a factor of 10 and multi-tip specimens can easily be fabricated using the dicing saw.
A method for batch manufacturing of slabs for zig-zag lasers including steps of bonding two non-active media to either side of an active medium to form a sandwich, dicing the sandwich to provide slices, rendering two surfaces of each slice into total-internal-reflection (TIR) surfaces, and then dicing the slices perpendicular to the TIR surfaces to provide a plurality of zig-zag slabs.
Planar array processing of indium arsenide wafers includes dicing into a prescribed geometry, then cleaning and drying, and finally pre-oxidizing in an oxygen atmosphere at 500 degrees C. The last step forms an oxide interface between the InAs surface and a glow discharge deposited layer of silicon dioxide.
Oxide-passivated semiconductor chip is given protective glass coating by means of vapor deposition over metallic substrate of integrated circuit (IC). Method provides more reliable oxide-passivation and hermetic sealing in current use. Chips and scratches incurred during dicing, testing, and assembly are markedly reduced.
Miniature amplifier for bioelectronic instrumentation consumes only about 100 mW and has frequency response flat to within 0.5 dB from 0.14 to 450 Hz. Device consists of five thin film substrates, which contain eight operational amplifiers and seven field-effect transistor dice.
Integrated circuit (IC) flip-flop resolving time parameters are measured by wafer probing, without need of dicing or bonding, throught the incorporation of test structures on an IC together with the flip-flop to be measured. Several delays that are fabricated as part of the test circuit, including a voltage-controlled delay with a resolution of a few picosecs, are calibrated as part of the test procedure by integrating them into, and out of, the delay path of a ring oscillator. Each of the delay values is calculated by subtracting the period of the ring oscillator with the delay omitted from the period with the delay included. The delay measurement technique is sufficiently general for other applications. The technique is illustrated for the case of the flip-flop parameters of a 5-micron feature size NMOS circuit.
The rapid change of resistance with temperature of high quality films of high T sub c superconductors can be used to make resistance thermometers with very low temperature noise. Measurements on c-axis yttrium barium copper oxide (YBCO) films have given a spectral intensity of temperature noise less than 4 times 10(exp -8) K/Hz(exp 1/2) at 10 Hz. Consequently, the opportunity exists to make useful bolometric infrared detectors that operate near 90 K which can be cooled with liquid nitrogen. The fabrication and measurement of two bolometer architectures are discussed. The first is a conventional bolometer which consists of a 3000 A thick YBCO film deposited in situ by laser ablation on top of a 500 A thick SrTiO3 thickness and diced into 1x1 mm(exp 2) bolometer chips. Gold black smoke was used as the radiation absorber. The voltage noise was less than the amplifier noise when the film was current biased. Optical measurements gave an NEP of 5 times 10(exp -11) W/Hz(exp 1/2) at 10 Hz. The second architecture is that of an antenna-coupled microbolometer which consists of a small (5x10 cubic microns) YBCO film deposited directly on a bulk substrate with a low thermal conductance (YSZ) and an impedance matched planar lithographed spiral or log-periodic antenna. This structure is produced by standard photolithographic techniques. Measurements gave an electrical NEP of 4.7 times 10(exp -12) W/Hz(exp 1/2) at 10 kHz. Measurements of the optical efficiency are in progress. The measured performance of both bolometers will be compared to other detectors operating at or above liquid nitrogen temperatures so as to identify potential applications.
The following subject areas are covered: issues (liquid rocket propulsion - current development approach, current certification process, and costs of engineering changes); state of the art (DICE information management system, key government participants, project development strategy, quality management, and numerical propulsion system simulation); needs identified; and proposed program.