Search NASASearch

SEARCH · Search NASA

Results for “Detector Readout”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records

An Efficient, FPGA-Based, Cluster Detection Algorithm Implementation for a Strip Detector Readout System in a Time Projection Chamber Polarimeter

A fundamental challenge in a spaceborne application of a gas-based Time Projection Chamber (TPC) for observation of X-ray polarization is handling the large amount of data collected. The TPC polarimeter described uses the APV-25 Application Specific Integrated Circuit (ASIC) to readout a strip detector. Two dimensional photoelectron track images are created with a time projection technique and used to determine the polarization of the incident X-rays. The detector produces a 128x30 pixel image per photon interaction with each pixel registering 12 bits of collected charge. This creates challenging requirements for data storage and downlink bandwidth with only a modest incidence of photons and can have a significant impact on the overall mission cost. An approach is described for locating and isolating the photoelectron track within the detector image, yielding a much smaller data product, typically between 8x8 pixels and 20x20 pixels. This approach is implemented using a Microsemi RT-ProASIC3-3000 Field-Programmable Gate Array (FPGA), clocked at 20 MHz and utilizing 10.7k logic gates (14% of FPGA), 20 Block RAMs (17% of FPGA), and no external RAM. Results will be presented, demonstrating successful photoelectron track cluster detection with minimal impact to detector dead-time.

Polarimeter

Issues and directions in IR detector readout electronics

An introduction to the major issues encountered in the readout of imaging detector arrays in the infrared are presented. These include circuit issues such as multiplexing, buffering, and noise, as well as materials issues. Future directions in infrared readout electronics will also be discussed. These include on-chip signal processing and advanced hybridization schemes. Finally, recent work at Columbia on 2DEG-charge coupled devices for IR detector multiplexing are described.

Fossum, Eric R.

GaAs Multiplexers for VLWIR Detector Readout Below 10 Kelvin

A multiplexer and buffer based on GaAs JFET technology is presented. This multiplexer operates normally from room temperature down to 4 Kelvin and is suitable for the readout of Very Long Wavelength Infrared Detectors that must be cooled to below 10 Kelvin.

detector arrays GaAs multiplexers

Comparing Thermal Neutron Scintillators for Use With SiPM-Readout Detectors

Scintillator-based thermal neutron detectors for scientific scattering facilities offer an effective combination of large-area coverage and good spatial resolution. At Oak Ridge National Laboratory, silicon photomultiplier (SiPM)-readout Anger cameras using 6 Li glass scintillators have been developed, but the spatial resolution of these detectors is limited by the relatively low light yield of the glass. Recently, several brighter scintillator compositions with sufficient 6 Li concentration have emerged as promising candidates for higher-resolution imaging. Here, in this work, we evaluate five scintillator materials: GS20, LiF/ZnS:Ag, LiF/ZnO:Zn, LiI:Eu, and Cs 2 LiYCl 6 :Ce, each mounted on a SiPM Anger camera. For each scintillator, the neutron detection efficiency, spatial resolution, and count rate capabilities were measured and compared. Each of the new compositions achieved a spatial resolution better than 0.5 mm, compared to 0.66 mm for GS20, with LiI:Eu reaching the best value of 0.32 mm. Although these compositions improve the spatial resolution of the Anger camera, their longer pulse decay times limit their use in high count rate applications, and the camera’s hardware must be optimized for the different properties of the new scintillators.

Neutron detectors

Characterization of the First Prototype of the L1K65n Differential-Output Charge-Sensitive Preamplifier ASIC for High-Performance, Low-Background HPGe Detector Readout

Next-generation neutrinoless double-beta (0νββ) decay searches require a large detector/isotope mass and very low radioactive backgrounds. The upcoming LEGEND-1000 experiment (Large Enriched Germanium Experiment for Neutrinoless double-beta Decay) constitute a ton-scale array of several hundred high-purity germanium (HPGe) detectors enriched in 76Ge, the isotope of interest. It aims to reach a sensitivity beyond 10 28 years on the 0νββ decay half-life of 76Ge, necessitating an order of magnitude reduction in background with respect to the state of the art. This will require the implementation of a dedicated application specific integrated circuit (ASIC) preamplifier that will significantly lower background contribution compared to the conventional low-mass front end (LMFE) employed in the Majorana Demonstrator and LEGEND-200 experiments while maintaining or improving energy resolution and other performance parameters. Features include a high (9 MeV) dynamic range with noise low enough to achieve a trigger threshold of <1 keV, a single power supply to reduce background-inducing cabling, and a differential output to maintain signal integrity over several meters of transmission line. The chip would be optimized to operate in liquid argon (87 K) and be able to do so reliably for ten years. Following on from an earlier 180-nm prototype, we have developed a differential-output charge-sensitive preamplifier ASIC fabricated in a 65-nm process, 1×2 mm in size, that addresses these needs. Here, we present recent results from the successful testing and characterization of the first version of this device.

ASIC

Data Reduction Pipeline for the CHARIS Integral-Field Spectrograph I: Detector Readout Calibration and Data Cube Extraction

We present the data reduction pipeline for CHARIS, a high-contrast integral-field spectrograph for the Subaru Telescope. The pipeline constructs a ramp from the raw reads using the measured nonlinear pixel response and reconstructs the data cube using one of three extraction algorithms: aperture photometry, optimal extraction, or chi-squared fitting. We measure and apply both a detector flatfield and a lenslet flatfield and reconstruct the wavelength- and position-dependent lenslet point-spread function (PSF) from images taken with a tunable laser. We use these measured PSFs to implement a chi-squared-based extraction of the data cube, with typical residuals of approximately 5 percent due to imperfect models of the under-sampled lenslet PSFs. The full two-dimensional residual of the chi-squared extraction allows us to model and remove correlated read noise, dramatically improving CHARIS's performance. The chi-squared extraction produces a data cube that has been deconvolved with the line-spread function and never performs any interpolations of either the data or the individual lenslet spectra. The extracted data cube also includes uncertainties for each spatial and spectral measurement. CHARIS's software is parallelized, written in Python and Cython, and freely available on github with a separate documentation page. Astrometric and spectrophotometric calibrations of the data cubes and PSF subtraction will be treated in a forthcoming paper.

Brandt, Timothy D.

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L

Radiation detector readout system Patent

Circuit design for determining amount of photomultiplier tube light detection utilizing variable current source and dark current signals of opposite polarity

Baker, B. R.

Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

focal plane arrays (FPAs)

Fast, High-Precision Readout Circuit for Detector Arrays

The GEO-CAPE mission described in NASA's Earth Science and Applications Decadal Survey requires high spatial, temporal, and spectral resolution measurements to monitor and characterize the rapidly changing chemistry of the troposphere over North and South Americas. High-frame-rate focal plane arrays (FPAs) with many pixels are needed to enable such measurements. A high-throughput digital detector readout integrated circuit (ROIC) that meets the GEO-CAPE FPA needs has been developed, fabricated, and tested. The ROIC is based on an innovative charge integrating, fast, high-precision analog-to-digital circuit that is built into each pixel. The 128×128-pixel ROIC digitizes all 16,384 pixels simultaneously at frame rates up to 16 kHz to provide a completely digital output on a single integrated circuit at an unprecedented rate of 262 million pixels per second. The approach eliminates the need for off focal plane electronics, greatly reducing volume, mass, and power compared to conventional FPA implementations. A focal plane based on this ROIC will require less than 2 W of power on a 1×1-cm integrated circuit. The ROIC is fabricated of silicon using CMOS technology. It is designed to be indium bump bonded to a variety of detector materials including silicon PIN diodes, indium antimonide (InSb), indium gallium arsenide (In- GaAs), and mercury cadmium telluride (HgCdTe) detector arrays to provide coverage over a broad spectral range in the infrared, visible, and ultraviolet spectral ranges.

Rider, David M.

Radiation-Hard Smart-Pixel Detector ASIC ReadOut with Digital AI in 28nm

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout channels. With event rates as high as 40 MHz, these detectors will generate petabytes of data per second. To enable discovery within strict bandwidth and latency constraints, future trackers must be capable of fast, power efficient, and radiation hard data-reduction at the source. This effort is pursuing the co-design development of high-performance readout smart pixel ASICs for a future Phase III High Luminosity upgrade of the Large Hadron Collider. A 1.6mm2 ASIC prototype was designed by Fermilab in CMOS 28 nm bulk process and submitted for manufacturing in February 2024. It leverages the analog front-end pixel design of a previous prototype fabricated and tested in 2023, which achieved a simulated detection level of ~400e- with 30fF input capacitance. The ROIC consists of two matrices of 16×16 smart pixels, each 25×25 μm2 in size. Each smart pixel contains a charge-sensitive preamplifier with leakage current compensation and three auto-zero comparators for a 2-bit flash-type ADC. There is digital space for the integration of our fully combinatorial AI that performs momentum classification at the bunch crossing rate. The total power consumption is ∼6μW per pixel, which corresponds to ~1mW/cm2. The ASIC incorporates programmable front-end charge injection circuitry to generate pixel cluster charges during characterization. The cluster profile will be generated to duplicate hit characteristics of various momentum (pT). We will present early results from chip testing.

Parpillon, Benjamin

Fabrication of an Absorber-Coupled MKID Detector and Readout for Sub-Millimeter and Far-Infrared Astronomy

We have fabricated absorber-coupled microwave kinetic inductance detector (MKID) arrays for sub-millimeter and farinfrared astronomy. Each detector array is comprised of lambda/2 stepped impedance resonators, a 1.5μm thick silicon membrane, and 380μm thick silicon walls. The resonators consist of parallel plate aluminum transmission lines coupled to low impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The Al transmission lines simultaneously act to absorb optical power and are designed to have a surface impedance and filling fraction so as to match the impedance of free space. Our novel fabrication techniques demonstrate high fabrication yield of MKID arrays on large single crystal membranes and sub-micron front-to-back alignment of the microstrip circuit.

far-infrared

Fabrication of an Absorber-Coupled MKID Detector and Readout for Sub-Millimeter and Far-Infrared Astronomy

We have fabricated absorber-coupled microwave kinetic inductance detector (MKID) arrays for sub-millimeter and far-infrared astronomy. Each detector array is comprised of lambda/2 stepped impedance resonators, a 1.5 micrometer thick silicon membrane, and 380 micrometer thick silicon walls. The resonators consist of parallel plate aluminum transmission lines coupled to low impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The Al transmission lines simultaneously act to absorb optical power and are designed to have a surface impedance and filling fraction so as to match the impedance of free space. Our novel fabrication techniques demonstrate high fabrication yield of MKID arrays on large single crystal membranes and sub-micron front-to-back alignment of the microstrip circuit.

Brown, Ari-David

Assembly and Integration Process of the High-Density Detector Array Readout Modules for the Simons Observatory

The Simons Observatory will measure the cosmic microwave background tempera-ture and polarization using a suite of new telescopes in the Atacama Desert in Chile. The Simons Observatory will use dichroic transition edge sensor (TES) bolometer arrays spanning six frequency bands from 27 to 280 GHz. The Simons Observa-tory will pioneer the use of a densely packed multiplexing architecture based on the microwave SQUID multiplexer ( 𝜇mux), housing ∼2000 microwave resonators, each coupled to a TES. The Simons Observatory aims to multiplex each array of ∼2000 detectors with a single pair of coaxial cables and requires a multiplexing factor of ∼1000 . The Simons Observatory cryogenic readout system is called the universal microwave multiplexing module (UMM). The UMM couples to both horn and lenslet-coupled detector arrays and is integrated into the universal focal-plane module (UFM) after being independently characterized. We present processes we have developed for highly repeatable and automated integration methods of UMMs, which will be needed for the production of the 49 UFMs required for the first stage of the Simons Observatory.

CMB

Spatial Characterization of PACE OCI ETU Using Time-Delay Mode

The OCI (Ocean Color Instrument) is the main sensor on the upcoming PACE (Plankton Aerosol Cloud ocean Ecosystem) mission. OCI has two hyperspectral CCD sensors covering 340nm to 885nm and 9 SWIR (Short Wave IR) bands from 940nm to 2260nm. SWIR bands have nominal 1km ground pixel size and CCD bands have native 1/8 km ground pixel size in diagnostic mode that will be aggregated into 1km pixels to improve SNR and meet the data rate constraints. OCI has a rotating telescope that is synchronized to the readout of the CCD and SWIR detectors. Full pre-launch system level testing for the OCI ETU (Engineering Test Unit) was completed in June 2021.With time-delayed scan mode, a sub-pixel level time-delay step is applied to the detector readout. This sub-pixel level time-delay step causes a sub-pixel level shift in the start of the data collection. After collecting time-delay step scans with different step sizes, a scan profile with sub-pixel resolution can be constructed. 1/8 and 1/4 of CCD pixel resolutions were achieved using this mode. In this paper, the OCI time-delayed scan mode will be described as well as how it was used to calculate OCI’s high spatial resolution PSF (Point Spread Function), IFOV (instantaneous Field of View), MTF (Modulation Transfer Function), and BBR (Band to Band Registration).

PACE

GaAs CCD readout for engineered bandgap detectors

GaAs and related heterostructure charge-coupled devices (CCDs) for detector array readout multiplexer applications are described. Features of resistive-gate CCDs are compared with capacitive-gate CCDs for this application. Design examples of GaAs CCD readouts for linear and two-dimensional detector arrays with different detection methods and signal coupling schemes are described. Recent progress in two-dimensional electron gas (2DEG) Al(0.3)Ga(0.7)As/GaAs resistive-gate CCDs is also presented. The 2DEG resistive-gate CCD conventional buried-channel GaAs CCD.

Song, J.-I.

Enhanced Ionization Charge Identification in the Short-Baseline Neutrino Program Neutrino Detectors with Deep Neural Networks

We present a deep neural net-based region of interest detection method (DNN ROI) for signal processing in the liquid argon time projection chambers of the Short-Baseline Neutrino (SBN) Program, SBND and ICARUS. DNN ROI addresses limitations of the traditional wire-by-wire thresholding algorithm by leveraging the full two-dimensional detector readout and cross-plane matching information. To account for detector performance variations, we explore training with augmented samples. We find that DNN ROI outperforms the traditional method in both low-level ROI identification performance and high-level reconstruction metrics for high-energy cosmic and accelerator neutrino interaction products, while also being more robust against detector variations, with or without sample augmentation.

Abratenko, P. [Tufts U.]