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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Electroplated Au for conformal coating of high aspect ratio silicon structures
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Devices for Thermal Conductivity Measurements of Electroplated Bi for X-ray TES Absorbers
Electroplated bismuth (Bi) is commonly used in transition-edge sensors (TESs) for X-rays because of its high stopping power and low heat capacity (Collan in Phys Rev B 1:2888, 1970, Yan in Appl Phys Lett 111:192602, 2017). Electroplated Bi is usually grown on top of another metal that acts as seed layer, typically gold (Au), making it challenging to extrapolate its thermoelectric properties. In this work, we present four-wire resistance measurement structures that allow us to measure resistance as a function of temperature of electroplated Bi independently of Au. The results show that the thermal conductivity of the Bi at 3 K is high enough to ensure the correct thermalization of X-ray photons when used as an absorber for TESs.
Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications
Here, in this study, electromagnetic and radiation shielding structures were fabricated by 3D printing acrylonitrile butadiene styrene (ABS) structures via fused filament fabrication and electroplating with copper (Cu) and nickel (Ni) metals. Prior to electroplating, the printed ABS materials were made conductive by surface electrodeposition of polypyrrole (PPy). ABS adsorbs the pyrrole monomer, which subsequently polymerizes via oxidation forming conductive PPy layer on the printed structures. The successful anchoring of PPy layer can be attributed to its hydrogen bonding and electrostatic interactions with ABS. Thermal analysis, optical, and electron microscopy equipped with energy dispersive X-ray were employed to characterize the printed shielding structures, while the interference and radiation shielding effectiveness were evaluated using a spectrum analyzer and dosimeter, respectively. The interference shielding was found to be effective at 60 ± 5 dB over relatively small frequency range. Shielding was also apparent against gamma and X-ray ionizing rays, but more significantly effective against beta rays. Furthermore, the Cu/Ni coating was able to reduce any heat-induced dimensional changes for the 3D printed ABS substrate without compromising the mechanical integrity.
In-situ synchrotron X-ray study on microstructure and stress evolutions of electroplated copper upon self-annealing
Background: The self-annealing behavior of electroplated copper (Cu) at room temperature is gaining attention in the microelectronics industry due to its significant impact on reliability issues such as substrate warpage and electrical resistivity. Methods: In this study, in-situ analysis of the microstructure transition and stress relaxation of the electroplated copper upon self-annealing was conducted via synchrotron white X-ray nanodiffraction (beamline 21A, Taiwan Photon Source) and grazing-incidence X-ray diffraction (beamline 17B1, Taiwan Light Source). Significant Findings: Remarkable relaxations of deviatoric stress and absolute strain component along the [002] direction were closely related to the Cu grain growth and crystallographic reorientation at the early stage of selfannealing, and a complete stress/strain relaxation can be achieved with the cessation of microstructure transition. In conclusion, the in-situ synchrotron X-ray studies provided an insight into Cu self-annealing mechanism, offering valuable information for improving Cu interconnect reliability.
Iodine Capture with Copper-Electroplated Nickel Foams
This work explores the use of Ni0 foam scaffolds for Cu0 coatings for use as sorbents for iodine. The Cu0 electroplating was performed from aqueous copper(II) sulfate (CuSO4) solutions under different conditions to achieve a range of Cu0-layer thicknesses (4.89 ± 1.05 μm–57.32 ± 3.95 μm) with 900 A·m–2 current densities and coating times of 15–180 min. The thickest coatings resulted in Cu0-plated Ni0 foams with >89 mass % Cu0 in the final product. Iodine capture experiments showed very high Cu0 utilizations of 91.9–97.3 mass % at iodine loadings of 839–1774 mg·g–1 through the formation of CuI (marshite; space group F-43m). No evidence was found of iodine reactions taking place with the Ni0 scaffold, so it remained in iodine-loaded Cu-electroplated Ni foams as structural support to provide mechanical rigidity to the foams during the iodine loading process. Hot pressing of these materials can be used to create a CuI/Ni ceramic-metal composite waste form for disposal as demonstrated with spark plasma sintering.
Thermal Conductivity of Electroplated Copper Onto Bulk Niobium at Cryogenic Temperatures
Superconducting radio-frequency (SRF) cavities made of high-purity bulk niobium are widely used in modern particle accelerators. The development of metallic outer coatings with high thermal conductivity would have a beneficial impact in terms of improved thermal stability, reduced material cost and for the development of conduction-cooled, cryogen-free SRF cavities. Several high-purity, fine-grain Nb samples have been coated with 2-4 mm thick copper by electroplating. Measurements of the thermal conductivity of the bimetallic Nb/Cu samples in the range 2 ? 7 K showed values of the order of 1 kW/(m K) at 4.3 K. Very good adhesion between copper and niobium was achieved by depositing a thin Cu layer by cold spray on the niobium, prior to electroplating the bulk Cu layer.
Thermal Conductivity of Electroplated Copper Onto Bulk Niobium at Cryogenic Temperatures
Superconducting radio-frequency (SRF) cavities made of high-purity bulk niobium are widely used in modern particle accelerators. The development of metallic outer coatings with high thermal conductivity would have a beneficial impact in terms of improved thermal stability, reduced material cost and for the development of conduction-cooled, cryogen-free SRF cavities. Several high-purity, fine-grain Nb samples have been coated with 2-4 mm thick copper by electroplating. Measurements of the thermal conductivity of the bimetallic Nb/Cu samples in the range 2 ? 7 K showed values of the order of 1 kW/(m K) at 4.3 K. Very good adhesion between copper and niobium was achieved by depositing a thin Cu layer by cold spray on the niobium, prior to electroplating the bulk Cu layer.
Low-temperature electroplating of zirconium: Ionic mixture methods
Non-aqueous ionic mixture electroplating allows for room-temperature or near-room-temperature applications of thin metal films, typically metals for which aqueous solvents cannot be used. While there are many methods of plating zirconium, each has disadvantages that ionic liquid plating could correct. However, ionic liquid plating requires further research and development, as a new class of solvents were only developed a few years ago. Current ionic liquids cost several thousand dollars per liter, yet produce films with less than 90% surface coverage as well as deposition of salt species that enable interdiffusion through the Zr. Film coverage needs to be increased while maintaining approximate room temperatures and lower solvent costs. Current ionic liquid technology has suffered from poor surface wetting and limited Zr diffusivity leading to dendrite formation which inhibits total surface coverage. Zr electroplating can be improved by application of room-temperature ionic mixtures as the plating medium. We have successfully demonstrated the capability to plate high-quality metallic zirconium layers using deep eutectic solvents (DES) and DES-ionic liquid (IL) mixtures. Plating thicknesses of up to 6 microns have been achieved, and the coatings are conformal to the substrate and not dendritic, with low contamination from the plating solution. Our current method uses the DES ethaline (a 1:2 ratio of choline chloride and ethylene glycol) to complex zirconium (IV) ions (present via the addition of ZrF4). We pulse plate the Zr from a bath with an overabundance of LiF, in accordance with prior literature. We have also had success in mixing the DES with ILs, such as Triethylsulfonium bis(trifluoromethylsulfonyl)imide, 1-Butyl-3-methylpyridinium bis(trifluormethylsulfonyl)imide, Methyl-trioctylammonium bis(trifluoromethylsulfonyl)imide, and Diethylmethyl(2-methoxyethyl)ammonium bis(trifluoromethylsulfonyl)imide.
Non-permeable substrate carrier for electroplating
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
Electroplating Titanium from Ionic Mixtures
Titanium & Zirconium metal films have been electroplated by a near-ambient scalable process for high value-add/lower volume applications. The films have been commercially tested as bonding layers
Titanium Electroplating from Deep Eutectic Solvent Ethaline: Progress Report
This fiscal year we investigated the kinetic mechanism of electroplating of titanium on stainless steel substrates, as well as the influence of additives on the brightness and smoothness of this plating, as related to the FY24 LD-TCF proposal.
Environmental degradation of electroplated nickel and copper coated SS316H in molten FLiNaK salt
Corrosion of nickel and copper electroplated coatings on SS316H in molten FLiNaK salt was studied. 500- and 1000-hour static corrosion tests were performed in molten FLiNaK at 700 degrees Celsius. Characterization of the coatings following corrosion indicated that they did not degrade in the molten salt during the corrosion experiment and fully protected the underlying SS316H from chromium dissolution. Interdiffusion between the copper coating and SS316H was extremely limited, interdiffusion between the nickel coating and SS316H. Diffusion modelling revealed that the nickel coatings still significantly reduced chromium dissolution over 60 years despite the interdiffusion.
Resolving Current-Dependent Regimes of Electroplating Mechanisms for Fast Charging Lithium Metal Anodes
Poor fast-charge capabilities limit the usage of rechargeable Li metal anodes. Understanding the connection between charging rate, electroplating mechanism, and Li morphology could enable fast-charging solutions. In this report we develop a combined electroanalytical and nanoscale characterization approach to resolve the current-dependent regimes of Li plating mechanisms and morphology. Measurement of Li + transport through the solid electrolyte interphase (SEI) shows that low currents induce plating at buried Li||SEI interfaces, but high currents initiate SEI-breakdown and plating at fresh Li||electrolyte interfaces. The latter pathway can induce uniform growth of {110}-faceted Li at extremely high currents, suggesting ion-transport limitations alone are insufficient to predict Li morphology. At battery relevant fast-charging rates, SEI-breakdown above a critical current density produces detrimental morphology and poor cyclability. Thus, prevention of both SEI-breakdown and slow ion-transport in the electrolyte is essential. This mechanistic insight can inform further electrolyte engineering and customization of fast-charging protocols for Li metal batteries.
Mechanically Polishing Electroplated Nb3Sn for Higher Accelerating Gradients
As the demand for more efficient SRF technology continues to rise, so does the need to improve the performance of Nb3Sn, the most promising alternative to niobium. Leveraging recent breakthroughs in Nb3Sn research from Cornell University and Fermilab, namely the electrochemical synthesis-based growth of Nb3Sn and the centrifugal barrel polishing (CBP) technique to smoothen the final Nb3Sn film, our primary goal is to reduce surface roughness while preserving the film’s quality. We present promising RF results from an electroplated cavity that underwent mechanical polishing using the CBP technique, which showed an increase in the maximum accelerating gradient compared to the baseline test. However, contamination-induced Q-slope limited performance. Temperature mapping reveals quench location and heating response before, during and after quench.
Solar cells formed via aluminum electroplating
Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.
Dopant for improving casting and electroplating performance
Systems, methods, components, and parts are provided for improving casting and electroplating performance of a plated cast part by doping a semiconductor material with an electrically active dopant before mixing the semiconductor material into a base material. The doped semiconductor material improves the castability of the base material and has an improved electrical conductivity which is closer to that of the base material such that a consistency of a subsequent plating on the part is improved.
Advances in Electroplating Gradients and Thick Metallic Coatings on Microspherical Targets for Inertial Confinement Fusion
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