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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Commercial Electronic Part Class Definitions

Electronic parts used in Nuclear Security Enterprise (NSE) applications have varying pedigrees. Understanding the differences among these "part classes" will better enable Kansas City National Security Campus (KCNSC) and Sandia National Laboratories (SNL, or Sandia) to effectively manage factors such as risk, effort, cost, etc. across all functional areas which have a shared interest in the definition and acquisition process. Regardless of the pedigree and complexity, all parts are expected to meet necessary quality and reliability requirements. This activity has been conducted as part of the COTS Transformation Initiative (CTI).

42 ENGINEERING↗

Automated Algorithms for Screening Electronic Parts for Aging using Power Spectra Analysis (PSA) Data

Understanding the age of semiconductor parts being built into devices and systems is of interest for manufacturing quality control. Power spectrum analysis (PSA) is a fast, non-destructive, sensitive method for examining semiconductor parts. This talk will cover the use of multivariate analysis on both PSA data and conventional current-voltage data generated prior to PSA analysis to create algorithms that can be automated to screen semiconductor parts for aging.

Multari, Rosalie A↗

A comparison of carbon impurities in pre- and post-melt uranium Part 2: Scanning/Transmission electron microscopy analysis

We report the speciation and morphology of U carbide inclusions in pre- and post-melt U metal have been explored using high-resolution analytical electron microscopy (AEM). This report presents Part 2 of our study, in which aberration (C s ) corrected transmission and scanning transmission electron microscopy (S)TEM was used to elementally and crystallographically characterize C-containing impurities and defect features in U samples for comparison with results obtained by scanning electron microscopy (SEM) in Part 1, previously published by this journal. Elemental mapping and unit cell matching of inclusions by (S)TEM are consistent with phases observed by SEM, and new dislocations can be observed associating with some inclusion morphologies and not others.

36 MATERIALS SCIENCE↗

Density Functional Tight-Binding Models for Band Structures of Transition-Metal Alloys and Surfaces across the d -Block

First-principles electronic structure simulations are an invaluable tool for understanding chemical bonding and reactions. While machine-learning models such as interatomic potentials significantly accelerate the exploration of potential energy surfaces, electronic structure information is generally lost. Particularly in the field of heterogeneous catalysis, simulated electron band structures provide fundamental insights into catalytic reactivity. This ab initio knowledge is preserved in semiempirical methods such as density functional tight binding (DFTB), which extend the accessible computational length and time scales beyond first-principles approaches. In this paper here we present Shell-Optimized Atomic Confinement (SOAC) DFTB electronic-part-only parametrizations for bulk and surface band structures of all d-block transition metals that enable efficient predictions of electronic descriptors for large structures or high-throughput studies on complex systems outside the computational reach of density functional theory.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

High Resolution Aerosol Jet Printed Components with Electrodeposition-Enhanced Conductance

Aerosol Jet Printing (AJP) is one technique of additive manufacturing used in the printing of electronics components. AJP enables the patterning of features at the ~10 μm–100 μm scale based on hardware and print parameters. Additionally, optimization of print conditions enables the printing of high-resolution features with linewidths approaching 10 μm. The aerosol jet printing of electronic parts can be limited by the conductivities which are achievable by Ag nanoparticle inks (typically 15%–25% of bulk Ag). For certain electronics applications, the increased conductivity produces unacceptable loses during operation and methods are needed to increase the conductance of the devices without sacrificing resolution. Here, we report on the AJP of inductor spirals conductor traces of linewidth 50 μm separated by 55 μm gaps. The conductivity of these features is enhanced by electrodeposition of Cu onto the Ag, resulting in a decrease in resistance of 35–45x. Impedance measurements demonstrate that the addition of Cu by electrodeposition to a 27-turn spiral inductor resulted in an inductance of 3.6 μH. Finally, we demonstrate the use of a lift-off process to produce free-standing, flexible, conductive films using AJP.

36 MATERIALS SCIENCE↗

Hybrid gausslet/Gaussian basis sets

We introduce hybrid gausslet/Gaussian basis sets, where a standard Gaussian basis is added to a gausslet basis in order to increase accuracy near the nuclei while keeping the spacing of the grid of gausslets relatively large. The Gaussians are orthogonalized to the gausslets, which are already orthonormal, and approximations are introduced to maintain the diagonal property of the two electron part of the Hamiltonian so that it continues to scale as the second power of the number of basis functions rather than the fourth. We introduce several corrections to the Hamiltonian designed to enforce certain exact properties, such as the values of certain two-electron integrals. We also introduce a simple universal energy correction that compensates for the incompleteness of the basis stemming from the electron–electron cusps based on the measured double occupancy of each basis function. We perform a number of Hartree Fock and full configuration interaction (full-CI) test calculations on two electron systems and Hartree Fock on a ten-atom hydrogen chain to benchmark these techniques. The inclusion of the cusp correction allows us to obtain complete basis set full-CI results for the two electron cases at the level of several micro-Hartrees, and we see similar apparent accuracy for Hartree Fock on the ten-atom hydrogen chain.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Electron-phonon coupling induced intrinsic Floquet electronic structure

Floquet states are a topic of intense contemporary interest, which is often induced by coherent external oscillating perturbation (e.g., laser, or microwave) which breaks the continuous time translational symmetry of the systems. Usually, electron–phonon coupling modifies the electronic structure of a crystal as a non-coherent perturbation and seems difficult to form Floquet states. Surprisingly, we found that the thermal equilibrium electron–phonon coupling in M(MoS) 3 and M(MoSe) 3 (where M is a metallic element) exhibits a coherent behavior, and the electronic structure can be described by the Floquet theorem. Such a coherent Floquet state is caused by a selective giant electron–phonon coupling, with thermodynamic phonon oscillation serving as a driving force on the electronic part of the system. The quasi-1D Dirac cone at the Fermi energy has its band gap open and close regularly. Similarly, the electric current will oscillate even under a constant voltage.

36 MATERIALS SCIENCE↗

Elimination of the bias-stress effect in ligand-free quantum dot field-effect transistors

Field-effect transistors (FETs) made from colloidal quantum dot (QD) solids commonly suffer from current–voltage hysteresis caused by the bias-stress effect (BSE), which complicates fundamental studies of charge transport in QD solids and the use of QD FETs in electronics. Here, we show that the BSE can be eliminated in n-channel PbSe QD FETs by first removing the QD ligands with a dose of H 2 S gas and then infilling the QD films with alumina by atomic layer deposition (ALD). The H 2 S-treated, alumina-infilled FETs have stable, hysteresis-free device characteristics (total short-term stability), indefinite air stability (total long-term stability), and a high electron mobility of up to 14 cm 2 V −1 s −1 , making them attractive for QD circuitry and optoelectronic devices. The BSE-free devices are utilized to conclusively establish the dependence of the electron mobility on temperature and QD diameter. We demonstrate that the BSE in these devices is caused by both electron trapping at the QD surface and proton drift within the film. The H 2 S/alumina chemistry produces ligand-free PbSe/PbS/Al 2 O 3 interfaces that lack the traps that cause the electronic part of the BSE, while full alumina infilling stops the proton motion responsible for the ionic part of the BSE. In conclusion, our matrix engineering approach should aid efforts to eliminate the BSE, boost carrier mobilities, and improve charge transport in other types of nanocrystal solids.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

TurboRVB: A many-body toolkit for ab initio electronic simulations by quantum Monte Carlo

TurboRVB is a computational package for ab initio Quantum Monte Carlo (QMC) simulations of both molecular and bulk electronic systems. The code implements two types of well established QMC algorithms: Variational Monte Carlo (VMC) and diffusion Monte Carlo in its robust and efficient lattice regularized variant. A key feature of the code is the possibility of using strongly correlated many-body wave functions (WFs), capable of describing several materials with very high accuracy, even when standard mean-field approaches [e.g., density functional theory (DFT)] fail. The electronic WF is obtained by applying a Jastrow factor, which takes into account dynamical correlations, to the most general mean-field ground state, written either as an antisymmetrized geminal power with spin-singlet pairing or as a Pfaffian, including both singlet and triplet correlations. This WF can be viewed as an efficient implementation of the so-called resonating valence bond (RVB) Ansatz, first proposed by Pauling and Anderson in quantum chemistry [L. Pauling, The Nature of the Chemical Bond (Cornell University Press, 1960)] and condensed matter physics [P.W. Anderson, Mat. Res. Bull 8, 153 (1973)], respectively. The RVB Ansatz implemented in TurboRVB has a large variational freedom, including the Jastrow correlated Slater determinant as its simplest, but nontrivial case. Moreover, it has the remarkable advantage of remaining with an affordable computational cost, proportional to the one spent for the evaluation of a single Slater determinant. Therefore, its application to large systems is computationally feasible. The WF is expanded in a localized basis set. Several basis set functions are implemented, such as Gaussian, Slater, and mixed types, with no restriction on the choice of their contraction. The code implements the adjoint algorithmic differentiation that enables a very efficient evaluation of energy derivatives, comprising the ionic forces. Thus, one can perform structural optimizations and molecular dynamics in the canonical NVT ensemble at the VMC level. For the electronic part, a full WF optimization (Jastrow and antisymmetric parts together) is made possible, thanks to state-of-the-art stochastic algorithms for energy minimization. In the optimization procedure, the first guess can be obtained at the mean-field level by a built-in DFT driver. The code was efficiently parallelized by using a hybrid MPI-OpenMP protocol, which is also an ideal environment for exploiting the computational power of modern Graphics Processing Unit accelerators.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Experiments and modelling of adhesive failure initiation of an epoxy underfill: a study of electronic packaging survivability

Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. For this study, data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy. Such experimental setup is deemed appropriate for future epoxy testing.

42 ENGINEERING↗

TINMAN Thermal Neutron Detector for Aircraft

TinMan is the first technology to continuously measure thermal neutron intensity during aircraft flight and to define this environment, an important achievement since changes to semiconductors have led electronic parts to become more sensitive to thermal nuetrons that may lead to disturbances in their operation.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Assessment of Potential Ergonomic Injury Risk in the Nuclear Material Processing Glovebox Environment [Capstone Project]

Gloveboxes are isolation barriers that are used within many different industries such as pharmaceuticals, electronic parts fabrication, nuclear, and biological. The research on glovebox ergonomics is currently limited with few ergonomic professionals that focusing exclusively on glovebox working environments. There is existing documentation on occupational injuries, such as musculoskeletal disorders (MSD), sustained as a direct result of working in gloveboxes. The main elements that pose ergonomic risks to glovebox workers are operational repetition, duration, force, vibration, lifting heavy (more than 15lbs with two hands) objects, and awkward postures. This paper examines a small sample of the potential causal or risk factors that lead to the ergonomic injuries. A meta-analysis utilizing a random effect model is used to examine data from several studies which focus on, dexterity and strength changes as result of glove thickness, and robotic assistive technology as a means to improve postural mechanics. With the meta-analysis technique, similar data sets from different research studies can be coalesced into a single weighted, statistically significant result for subsequent consideration. The results from the analysis show that increased glove thickness results in decreased dexterity for operators thus increasing ergonomic risk factors such as task duration. It is also shown that glove thickness decreases grip strength but a similar decrease in pinch strength is not definitively demonstrated. With decreased grip strength, operators will need to exert more force (a known ergonomic risk factor) on processing tools, etc. during operations thus increasing the risk of ergonomic injury. The use of robotic assistive technology as a means to improve operator posture (risk factor) was also examined. Although it may be intuitively assumed that human-robotic collaboration would be beneficial in reducing risk factors, the result from this study’s analysis was not statistically significant. It is inferred that with additional directed research on this topic another study/analysis could be statistically significant demonstrating the benefits of the technology.

99 GENERAL AND MISCELLANEOUS↗

A comparison of carbon impurities in pre- and post-melt uranium Part 1: Scanning electron microscopy analysis

Although C impurities in U have been studied for decades, fundamental questions regarding their incorporation, migration, and overall transformation during metal processing still exist. In two written Parts, we compare the chemical speciation, distribution, crystallography, and morphologies (size, shape, etc.) of carbon-containing impurities in U metal both before and after melting using high resolution analytical electron microscopy (AEM). This first Part demonstrates the variability of carbide inclusions in depleted U (DU) metal with respect to their chemical phases and morphologies as observed by scanning electron microscopy (SEM). Here, a variety of inclusion types, such as the pill-shaped U monocarbide (UC), previously only hypothesized, are summarized. Additionally, delineation between hopper-shaped U carbonitride U(C,N) and dendritic UC inclusions is discussed in relationship to archived literature.

36 MATERIALS SCIENCE↗

Comments on the paper “Eliminating beam-induced depolarizing effects in the hydrogen jet target for high-precision proton beam polarimetry at the Electron-Ion Collider” (Part I)

A critical review of the methodology used in F. Rathmann et al., Phys. Rev. Accel. Beams 29, 021001 (2026), to evaluate beam-induced depolarization of the Atomic Polarized Hydrogen Gas Jet (HJET) target at the Electron–Ion Collider (EIC) is presented. It is shown that several key assumptions underlying that analysis—including the introduction of a photon emission threshold, the application of Fermi’s Golden Rule to coherent hyperfine transitions, the interpretation of power broadening as a physical linewidth increase, and the treatment of spatial magnetic fields—are either incorrect or internally inconsistent. As a consequence, the predicted large depolarization effects are demonstrated to be artifacts of the adopted methodology rather than genuine physical phenomena. A consistent quantum-mechanical treatment based on the time-dependent Schrödinger equation shows that beam-induced depolarization probabilities at the EIC are negligibly small.

43 PARTICLE ACCELERATORS↗

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. Here, to increase power density, performance, efficiency, and reliability-as well as to reduce cost-innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental R&D related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics, packaging materials, thermal materials and interfaces, fluid-based thermal management technologies, reliability, condition monitoring, and prognostics. Latest developments in this area are published as a Special Section on Multiphysics Aspects of Power Electronics Packaging. The first part was published in the May 2024 issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume 14, Issue 5). The second part of that Special Section is being published in this issue. A brief summary of the papers included in the second part are given below.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level - Part 1

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. To increase power density, performance, efficiency, and reliability and reduce cost, innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental research and development related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics; packaging materials; thermal materials and interfaces; fluid-based thermal management technologies; reliability; condition monitoring; and prognostics. To address these important aspects, this Special Section on Multiphysics Aspects of Power Electronics Packaging includes several articles to be published in two parts. More details are given below on the articles included in the first part.

condition monitoring↗